US4389771A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Treatment of a substrate surface to reduce solder sticking
Assignee: AT&T Inc
•
Filing: 1981-01-05
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Granted: 1983-06-28
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Expires: 2001-01-05
Abstract
Abstract A method for preventing solder sticking on printed circuit substrates comprises mechanically roughening the surface of the substrate.
Inventors
- 👤 Michael P. Cassidy
- 👤 John F. D'Amico
- 👤 Michael A. DeAngelo, Jr.
- 👤 Kon-Mang Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 09:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K3/22; H05K3/26; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2203/00; H05K2203/02; H05K2203/025; H05K2203/04; H05K2203/044; H05K2203/11; H05K2203/1173; H05K2203/15; H05K2203/1545; H05K3/38; H05K3/381; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
88 words
A method of manufacturing a printed circuit comprising the steps of: (a) forming a circuit pattern on a flexible rubber modified epoxy coated printed circuit substrate; (b) mechanically roughening at least that portion of the substrate not having or not to have a circuit pattern thereon either before or after the formation of said pattern by means which result in roughening equivalent to roughening with a 125-400 mesh grit; and (c) flowing solder over the circuit board so as to cause solder to coat only the circuit pattern.
Claim 2
Independent Claim
88 words
A method of manufacturing a printed circuit comprising the steps of: (a) forming a circuit pattern on a flexible rubber modified epoxy coated printed circuit substrate; (b) mechanically roughening at least that portion of the substrate not having or not to have a circuit pattern thereon either before or after the formation of said pattern by means which result in roughening equivalent to roughening with a 125-400 mesh grit; and (c) flowing solder over the circuit board so as to cause solder to coat only the circuit pattern.
Claim 3
Dependent Claim
26 words
The method recited in claim 1 wherein the substrate is roughened prior to formation of a circuit pattern thereon, said pattern being formed by additive processing.
Claim 4
Dependent Claim
12 words
The method recited in claim 2 wherein the entire surface is roughened.
Claim 5
Dependent Claim
28 words
The method recited in claim 2 wherein mechanical roughening is achieved by means of a sanding or a blasting material having a grit size of from 125-400 mesh.
Claim 6
Dependent Claim
36 words
The method recited in claim 1 wherein the substrate is a metal clad material, the circuit pattern is formed by subtractive processing and the exposed areas of the substrate are roughened subsequent to circuit pattern formation.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-06-27 | 1986-12-27 | 1987-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-06-27 | 1990-12-27 | 1991-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-06-27 | 1994-12-27 | 1995-06-28 | $7700.00 | Window Closed / Lapsed |