US5516032A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming bump electrode
Assignee: Panasonic Holdings Corp
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Filing: 1994-11-16
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Granted: 1996-05-14
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Expires: 2014-11-16
Abstract
Abstract The invention relates to a method for forming bump electrodes on an electronic part such as a chip or a substrate. Conventional methods for forming bump electrode had a factor causing high cost, but with the invention, instead of solder balls, low cost solder wires are used, that is, solder wires are cut in a predetermined length, the cut solder wires are vacuum-attracted to the lower face of a pick up head and transferred onto a chip, then the solder pieces transferred are heated to melt, then cooled to solidify and results in forming bump electrodes of hemisphere shape.
Inventors
- 👤 Shoji Sakemi
- 👤 Tadahiko Sakai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:33
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; B; B23; B23K; B23K3/00; B23K3/06; B23K3/0607; B23K3/0623; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H10W70/00; H10W70/099; B23K2101/00; B23K2101/36; H05K2203/00; H05K2203/02; H05K2203/0278; H05K2203/04; H05K2203/0415; H05K2203/08; H05K2203/082; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/251; H10W72/90; H10W72/941; H10W72/944; H10W72/9445
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
73 words
A method for forming a bump electrode comprising the steps of: cutting a solder wire at a predetermined position from the end thereof to obtain a solder piece; attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part; heating the solder piece transferred onto said electrode to melt; and, cooling the solder piece heated to solidify.
Claim 2
Independent Claim
73 words
A method for forming a bump electrode comprising the steps of: cutting a solder wire at a predetermined position from the end thereof to obtain a solder piece; attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part; heating the solder piece transferred onto said electrode to melt; and, cooling the solder piece heated to solidify.
Claim 3
Independent Claim
87 words
A method for forming a bump electrode comprising the steps of: deforming specific portion of a solder wire into a flat shape; cutting the solder wire of flat shape at a predetermined position from the end thereof to obtain a solder piece; attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part; heating the solder piece transferred onto said electrode to melt; and, cooling the solder piece heated to solidify.
Claim 4
Independent Claim
87 words
A method for forming a bump electrode comprising the steps of: deforming specific portion of a solder wire into a flat shape; cutting the solder wire of flat shape at a predetermined position from the end thereof to obtain a solder piece; attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part; heating the solder piece transferred onto said electrode to melt; and, cooling the solder piece heated to solidify.
Claim 5
Independent Claim
88 words
A method for forming a bump electrode comprising the steps of: deforming specific portion of a solder wire into a flat shape and at the same time cutting the solder wire at a predetermined position from the end thereof to obtain a solder piece; attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part; heating the solder piece transferred onto said electrode to melt; and, cooling the solder piece heated solidify.
Claim 6
Independent Claim
88 words
A method for forming a bump electrode comprising the steps of: deforming specific portion of a solder wire into a flat shape and at the same time cutting the solder wire at a predetermined position from the end thereof to obtain a solder piece; attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part; heating the solder piece transferred onto said electrode to melt; and, cooling the solder piece heated solidify.
Claim 7
Independent Claim
82 words
A method for forming a bump electrode comprising the steps of: cutting a solder wire at a predetermined position from the end thereof to obtain a solder piece; deforming said solder piece into a flat shape; attracting said flat solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part; heating the solder piece transferred onto said electrode to melt; and, cooling the solder piece heated to solidify.
Claim 8
Independent Claim
82 words
A method for forming a bump electrode comprising the steps of: cutting a solder wire at a predetermined position from the end thereof to obtain a solder piece; deforming said solder piece into a flat shape; attracting said flat solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part; heating the solder piece transferred onto said electrode to melt; and, cooling the solder piece heated to solidify.
Claim 9
Independent Claim
103 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches and cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred respectively onto said plurality of electrodes to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 10
Independent Claim
103 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches and cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred respectively onto said plurality of electrodes to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 11
Independent Claim
124 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches and deforming the portion of said plurality of wires from each of the ends to a predetermined position thereof into flat shapes; cutting the solder wires at a predetermined position from the each of ends thereof to obtain a plurality of solder pieces; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred respectively onto said plurality of electrodes to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 12
Independent Claim
124 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches and deforming the portion of said plurality of wires from each of the ends to a predetermined position thereof into flat shapes; cutting the solder wires at a predetermined position from the each of ends thereof to obtain a plurality of solder pieces; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred respectively onto said plurality of electrodes to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 13
Independent Claim
127 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches; deforming the portion of said plurality of wires from each of the ends to a predetermined position thereof into flat shapes and at the same time, cutting the solder wires at a predetermined position from the each of ends thereof to obtain a plurality of solder pieces; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred onto said plurality of electrodes to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 14
Independent Claim
127 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches; deforming the portion of said plurality of wires from each of the ends to a predetermined position thereof into flat shapes and at the same time, cutting the solder wires at a predetermined position from the each of ends thereof to obtain a plurality of solder pieces; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred onto said plurality of electrodes to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 15
Independent Claim
110 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches; cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces; deforming the plurality of solder pieces in flat shapes; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred onto said plurality of electrodes to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 16
Independent Claim
110 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches; cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces; deforming the plurality of solder pieces in flat shapes; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred onto said plurality of electrodes to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 17
Independent Claim
107 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches; cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed in a matrix at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred onto said plurality of electrodes of the matrix to melt; and, cooling the plurality of solder pieces heated to solidify.
Claim 18
Independent Claim
107 words
A method for forming bump electrodes comprising the steps of: arranging a plurality of solder wires parallelly at predetermined pitches; cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces; attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed in a matrix at specific pitches on a specific surface on an electronic part; heating the plurality of solder pieces transferred onto said plurality of electrodes of the matrix to melt; and, cooling the plurality of solder pieces heated to solidify.
References Cited (Backward Citations)
JPS5422162A
Cited
US4944446A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-14 | 1999-11-13 | 2000-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-14 | 2003-11-13 | 2004-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-14 | 2007-11-13 | 2008-05-14 | $7700.00 | Window Closed / Lapsed |