JPS5422162A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Manufacture of semiconductor device
Assignee: Toshiba Corp
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Filing: 1977-07-21
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Granted: —
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Expires: 1997-07-21
Abstract
Abstract PURPOSE: To eliminate virtually the change of the heat resistance by forming and supplying the streak substance of the gold-tin alloy solder onto the element installation base board to be pressure-bonded while being cut into a prescribed shape and then connecting the element. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Hiroaki Shimizu
- 👤 Tsukasa Hattori
- 👤 Hiroyuki Baba
- 👤 Osamu Usuda
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-01 23:16
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/013; H10W72/011; H10W72/0113; H10W72/071; H10W72/073; H10W90/00; H10W90/701; H10W90/731; H10W90/736
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References Cited (Backward Citations)
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