Patent US5510758A successfully refreshed from Google Patents.
US5510758A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
Assignee: Panasonic Holdings Corp
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Filing: 1994-04-06
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Granted: 1996-04-23
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Expires: 2014-04-06
Abstract
Abstract A semiconductor device includes a microstrip wiring board. The microstrip wiring board includes a substrate having a main surface, a ground conductor extending on the main surface of the substrate, a dielectric film extending on the ground conductor, and a metal wiring line extending on the dielectric film. A semiconductor chip is connected to the microstrip wiring board via a bump.
Inventors
- 👤 Suguru Fujita
- 👤 Kazuaki Takahashi
- 👤 Morikazu Sagawa
- 👤 Hiroyuki Sakai
- 👤 Yorito Ota
- 👤 Kaoru Inoue
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 22:35
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4219; G02B6/4228; G02B6/4232; H10W44/203; H10W44/216; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/07252; H10W72/20; H10W72/221; H10W72/227; H10W72/251; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
126 words
A semiconductor device comprising: a microstrip wiring board including a substrate having a main surface, a metal wiring line extending on the main surface of the substrate, a dielectric film extending on the metal wiring line, and a ground conductor extending on the dielectric film, the metal wiring line being fixed to the main surface of the substrate without using adhesive, the dielectric film being fixed to the metal wiring line without using adhesive, the ground conductor being fixed to the dielectric film without using adhesive, the substrate comprising one of silicon and glass, wherein the metal wiring line, the dielectric film, and the ground conductor comprise a microstrip transmission line; a bumps and a semiconductor chip connected to the microstrip wiring board via the bump.
Claim 2
Dependent Claim
126 words
A semiconductor device comprising: a microstrip wiring board including a substrate having a main surface, a metal wiring line extending on the main surface of the substrate, a dielectric film extending on the metal wiring line, and a ground conductor extending on the dielectric film, the metal wiring line being fixed to the main surface of the substrate without using adhesive, the dielectric film being fixed to the metal wiring line without using adhesive, the ground conductor being fixed to the dielectric film without using adhesive, the substrate comprising one of silicon and glass, wherein the metal wiring line, the dielectric film, and the ground conductor comprise a microstrip transmission line; a bumps and a semiconductor chip connected to the microstrip wiring board via the bump.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-04-23 | 1999-10-23 | 2000-04-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-04-23 | 2003-10-23 | 2004-04-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-04-23 | 2007-10-23 | 2008-04-23 | $7700.00 | Window Closed / Lapsed |