US5499668A
Expired / Lapsed
US
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Process for making electronic device
Assignee: Hitachi Ltd
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Filing: 1994-10-27
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Granted: 1996-03-19
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Expires: 2014-10-27
Abstract
Abstract Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy capable of changing the metal surface structure, thereby cleaning the metal surface.
Inventors
- 👤 Kaoru Katayama
- 👤 Shinichi Kazui
- 👤 Yasuhiro Iwata
- 👤 Hiroshi Fukuda
- 👤 Toshihiko Ohta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 08:38
CPC Classifications
H; H10; H10P; H10P70/00; H10P70/10; H10P70/12; B; B08; B08B; B08B7/00; B08B7/0035; B08B7/0042; B23; B23K; B23K1/00; B23K1/20; B23K1/206; B23K26/00; B23K26/36; B23K26/40; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3489; H10W; H10W76/00; H10W76/60; B23K2101/00; B23K2101/36; B23K2103/00; B23K2103/08; B23K2103/14; B23K2103/18; B23K2103/26; H10W72/00; H10W72/01; H10W72/012; H10W72/01271; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W76/10; H10W76/17
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
62 words
A process for a solder treatment, which comprises irradiating a surface of a solder bump or layer bonded to a ceramic substrate with a laser beam of lower energy level than energy capable of changing the solder surface structure, thereby cleaning the surface of said solder, and bonding an integrated circuit to said cleaned solder surface, said solder being comprised of Sn--Pb.
Claim 2
Dependent Claim
62 words
A process for a solder treatment, which comprises irradiating a surface of a solder bump or layer bonded to a ceramic substrate with a laser beam of lower energy level than energy capable of changing the solder surface structure, thereby cleaning the surface of said solder, and bonding an integrated circuit to said cleaned solder surface, said solder being comprised of Sn--Pb.
Claim 3
Dependent Claim
51 words
A process for making an electronic device, by connecting a part to a circuit wiring substrate by a solder, which comprises irradiating the solder with a laser beam, thereby cleaning the surface of the solder and then heating and melting the solder, thereby connecting the part to the circuit wiring substrate.
Claim 4
Dependent Claim
51 words
A process for making an electronic device, by connecting a part to a circuit wiring substrate by a solder, which comprises irradiating the solder with a laser beam, thereby cleaning the surface of the solder and then heating and melting the solder, thereby connecting the part to the circuit wiring substrate.
Claim 5
Dependent Claim
14 words
A process according to claim 2, wherein the part is a semiconductor integrated circuit.
Claim 6
Dependent Claim
18 words
A process according to claim 2, wherein the part is a seal cap of a semiconductor integrated circuit.
Claim 7
Dependent Claim
15 words
A process according to claim 2, wherein the circuit wiring substrate is a ceramic substrate.
Claim 8
Dependent Claim
56 words
A process for making an electronic device by connecting an LSI to a circuit substrate through a solder bump as a terminal, which comprises irradiating the solder bump with a laser beam, thereby cleaning the surface of the solder bump and then heating and melting the solder bump, thereby connecting the LSI to the circuit substrate.
Claim 9
Dependent Claim
56 words
A process for making an electronic device by connecting an LSI to a circuit substrate through a solder bump as a terminal, which comprises irradiating the solder bump with a laser beam, thereby cleaning the surface of the solder bump and then heating and melting the solder bump, thereby connecting the LSI to the circuit substrate.
Claim 10
Dependent Claim
14 words
A process according to claim 6, wherein the circuit substrate is a ceramic substrate.
Claim 11
Dependent Claim
20 words
A process according to claim 2, wherein the laser beam has a pulse span of not more than 1 microsecond.
Claim 12
Dependent Claim
19 words
A process according to claim 2, wherein the laser beam has a wavelength of 150 nm to 400 nm.
Claim 13
Dependent Claim
23 words
A process according to claim 2, wherein the laser beam has an energy density of 0.5 J/cm 2 to 4.0 J/cm 2 .
References Cited (Backward Citations)
WO1983001400A1
Cited
JPS62256961A
Cited
JPS6397382A
Cited
US4898650A
Cited
US5024968A
Cited
US5151135A
Cited
US5328517A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-03-19 | 1999-09-18 | 2000-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-03-19 | 2003-09-18 | 2004-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-03-19 | 2007-09-18 | 2008-03-19 | $7700.00 | Window Closed / Lapsed |