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US5496506A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for removing fine particles

Assignee: CLARIANT AZ (DEUTSCHLAND) AG
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Filing: 1993-09-15
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Granted: 1996-03-05
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Expires: 2013-09-15
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Abstract

Abstract A process for detecting fine particles includes the steps of forming a sublimable thin film on an essential surface of a wafer on which fine particles are present, irradiating laser beam at the surface of the wafer, receiving a reflected beam from the surface which is scattered by the presence of the fine particles, and detecting the particles from the received scattered beam. The process may further include the step of accomplishing an etchback against the sublimable film to partially retain the sublimable film adjacent the surface of the fine particles. The film can be prepared from one or a mixture of gases including free sulfur generatable gas under discharge-dissociation conditions. Sulfur compounds or polythiazyl are preferable. Alternatively, the film can be made of a condensed film of organic solvent vapor. The sublimable film is sublimed by heating after the step of detecting the fine particles.

Inventors

  • 👤 Junichi Sato

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 17:41
CPC Classifications
H; H10; H10P; H10P70/00; H10P70/10; G; G01; G01N; G01N21/00; G01N21/84; G01N21/88; G01N21/94; H10P70/12; Y; Y10; Y10S; Y10S134/00; Y10S134/902

Claims Analysis

Total Claims: 18
Claim 1
Independent Claim 58 words
A process for removing fine particles from a wafer surface of a wafer comprising the steps of: forming a sublimable thin film on the wafer surface which has fine particles thereon, and removing the fine particles with the sublimable film from the wafer surface by supplying a jetting flow of highly pressurized inert gas to said wafer surface.
Claim 2
Dependent Claim 58 words
A process for removing fine particles from a wafer surface of a wafer comprising the steps of: forming a sublimable thin film on the wafer surface which has fine particles thereon, and removing the fine particles with the sublimable film from the wafer surface by supplying a jetting flow of highly pressurized inert gas to said wafer surface.
Claim 3
Dependent Claim 16 words
A process as set forth in claim 1, wherein said sublimable film is made of sulfur.
Claim 4
Dependent Claim 29 words
A process as set forth in claim 2, wherein said sublimable film is prepared from one or a mixture of gases including free sulfur generatable gas under discharge-dissociation conditions.
Claim 5
Dependent Claim 64 words
A process as set forth in claim 3, wherein said free sulfur generatable gas is selected from the group consisting of S 2 F 2 , SF 2 , SF 4 , S 2 F 10 , S 3 Cl 2 , S 2 Cl 2 , SCl 2 , S 3 Br 2 , S 2 Br 2 , and SBr 2 .
Claim 6
Dependent Claim 16 words
A process as set forth in claim 1, wherein said sublimable film is made of polythiazyl.
Claim 7
Dependent Claim 31 words
A process as set forth in claim 5, wherein said sublimable film is prepared from one or a mixture of gases including free sulfur generatable gas under discharge-dissociation conditions and nitrogen.
Claim 8
Dependent Claim 64 words
A process as set forth in claim 6, wherein said free sulfur generatable gas is selected from the group consisting of S 2 F 2 , SF 2 , SF 4 , S 2 F 10 , S 3 Cl 2 , S 2 Cl 2 , SCl 2 , S 3 Br 2 , S 2 Br 2 , and SBr 2 .
Claim 9
Dependent Claim 19 words
A process according to claim 1, wherein the step of removing includes heating to facilitate removal of the film.
Claim 10
Dependent Claim 32 words
A process according to claim 1, which includes a step of detecting the fine particles after the step of forming the film and before the step of removing the film and particles.
Claim 11
Dependent Claim 20 words
A process according to claim 9, wherein the step of removing includes heating to aid the removal of the film.
Claim 12
Dependent Claim 62 words
A process for removing fine particles from a wafer surface of a wafer comprising the steps of: forming a sublimable thin film containing sulfur on the wafer surface which has fine particles thereon, and supplying a jetting flow of highly pressurized inert gas to said wafer surface to remove the fine particles with said sublimable film of sulfur from the wafer surface.
Claim 13
Dependent Claim 62 words
A process for removing fine particles from a wafer surface of a wafer comprising the steps of: forming a sublimable thin film containing sulfur on the wafer surface which has fine particles thereon, and supplying a jetting flow of highly pressurized inert gas to said wafer surface to remove the fine particles with said sublimable film of sulfur from the wafer surface.
Claim 14
Dependent Claim 27 words
A process according to claim 11, wherein said sublimable film is prepared from one or a mixture of gases including free sulfur generatable gas under discharge-dissociation conditions.
Claim 15
Dependent Claim 62 words
A process according to claim 12, wherein said free sulfur generatable gas is selected from the group consisting of S 2 F 2 , SF 2 , SF 4 , S 2 F 10 , S 3 Cl 2 , S 2 Cl 2 , SCl 2 , S 3 Br 2 , S 2 Br 2 , and SBr 2 .
Claim 16
Dependent Claim 14 words
A process according to claim 11, wherein said sublimable film is made of polythiazyl.
Claim 17
Dependent Claim 29 words
A process according to claim 14, wherein said sublimable film is prepared from one or a mixture of gases including free sulfur generatable gas under discharge-dissociation conditions and nitrogen.
Claim 18
Dependent Claim 62 words
A process according to claim 15, wherein said free sulfur generatable gas is selected from the group consisting of S 2 F 2 , SF 2 , SF 4 , S 2 F 10 , S 3 Cl 2 , S 2 Cl 2 , SCl 2 , S 3 Br 2 , S 2 Br 2 , and SBr 2 .

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-03-05 1999-09-04 2000-03-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-03-05 2003-09-04 2004-03-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-03-05 2007-09-04 2008-03-05 $7700.00 Window Closed / Lapsed

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