US5495668A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacturing method for a supermicro-connector
Assignee: Furukawa Electric Co Ltd
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Filing: 1994-12-19
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Granted: 1996-03-05
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Expires: 2014-12-19
Abstract
Abstract A manufacturing method for a supermicro-connector, comprising: a step of fixing a plurality of conductor wires, arranged substantially parallel to one another, by means of an elastic insulator interposed between the conductor wires, thereby making a composite structure formed of the conductor wires and the insulator; a step of cutting the composite structure along a plane extending at right angles to the conductor wires, thereby making a plurality of composite chips; a step of removing the insulator from at least one cut surface of each of the composite chips by dissolution by means of an agent, thereby exposing the respective end portions of the conductor wires for a predetermined length; and a step of forming solder bumps individually on the respective exposed end portions of the conductor wires.
Inventors
- 👤 Keisuke Furusawa
- 👤 Takao Orimo
- 👤 Takuya Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 00:17
CPC Classifications
B; B21; B21F; B21F45/00; H; H01; H01R; H01R43/00; H01R43/16; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49208; Y10T29/49801
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
127 words
A manufacturing method for a supermicro-connector, comprising: a step of fixing a plurality of conductor wires, arranged substantially parallel to one another, by means of an elastic insulator interposed between the conductor wires, thereby making a composite structure formed of the conductor wires and the insulator; a step of cutting the composite structure along a plane extending at right angles to the conductor wires, thereby making a plurality of composite chips; a step of removing the insulator from at least one cut surface of each of the composite chips by dissolution by means of an agent, thereby exposing respective end portions of the conductor wires for a predetermined length; and a step of forming solder bumps individually on the respective exposed end portions of the conductor wires.
Claim 2
Dependent Claim
127 words
A manufacturing method for a supermicro-connector, comprising: a step of fixing a plurality of conductor wires, arranged substantially parallel to one another, by means of an elastic insulator interposed between the conductor wires, thereby making a composite structure formed of the conductor wires and the insulator; a step of cutting the composite structure along a plane extending at right angles to the conductor wires, thereby making a plurality of composite chips; a step of removing the insulator from at least one cut surface of each of the composite chips by dissolution by means of an agent, thereby exposing respective end portions of the conductor wires for a predetermined length; and a step of forming solder bumps individually on the respective exposed end portions of the conductor wires.
Claim 3
Dependent Claim
69 words
A manufacturing method for a supermicro-connector according to claim 1, further comprising a step of further removing the insulator on the side for the formation of the solder bumps by dissolution by means of the agent, thereby exposing the conductor wires for a predetermined length between the solder bumps and the insulator, after the step of forming the solder bumps on the exposed end portions of the conductor wires.
Claim 4
Dependent Claim
19 words
A manufacturing method for a supermicro-connector according to claim 1, wherein said elastic insulator is an expanded silicone rubber.
Claim 5
Dependent Claim
19 words
A manufacturing method for a supermicro-connector according to claim 2, wherein said elastic insulator is an expanded silicone rubber.
Claim 6
Dependent Claim
44 words
A manufacturing method for a supermicro-connector according to claim 1, wherein each said conductor wire is formed, on the surface thereof, with a number of linear or spiral channels each having an opening with a width smaller than that of the inner part thereof.
Claim 7
Dependent Claim
45 words
A manufacturing method for a supermicro-connector according to claim 2, wherein each said conductor wire is formed, on the surface thereof, with a necessary number of linear or spiral channels each having an opening with a width smaller than that of the inner part thereof.
Claim 8
Dependent Claim
43 words
A manufacturing method for a supermicro-connector according to claim 1, wherein each said conductor wire is a stranded wire or a composite wire formed by joining and bonding a plurality of wires together so that the surface of the conductor wire is rugged.
Claim 9
Dependent Claim
43 words
A manufacturing method for a supermicro-connector according to claim 2, wherein each said conductor wire is a stranded wire or a composite wire formed by joining and bonding a plurality of wires together so that the surface of the conductor wire is rugged.
Claim 10
Dependent Claim
40 words
A manufacturing method for a supermicro-connector according to claim 1, wherein each said conductor wire is a composite wire formed of a core member erodible by a specific corrosive agent and a covering member not erodible by the corrosive agent.
Claim 11
Dependent Claim
40 words
A manufacturing method for a supermicro-connector according to claim 2, wherein each said conductor wire is a composite wire formed of a core member erodible by a specific corrosive agent and a covering member not erodible by the corrosive agent.
Claim 12
Dependent Claim
26 words
A manufacturing method for a supermicro-connector according to claim 1, wherein said conductor wires are bonded to the elastic insulator by means of an adhesive agent.
Claim 13
Dependent Claim
26 words
A manufacturing method for a supermicro-connector according to claim 2, wherein said conductor wires are bonded to the elastic insulator by means of an adhesive agent.
Claim 14
Dependent Claim
95 words
A manufacturing method for a supermicro-connector according to claim 1, wherein said plurality of conductor wires are laminated into a plurality of parallel conductor wire rows arranged at predetermined intervals under a tension applied by means of a plurality of members having different heights and formed with a plurality of V-grooves arranged at regular pitches, in said step of fixing the plurality of conductor wires, arranged substantially parallel to one another, by means of the elastic insulator interposed between the conductor wires, thereby making the composite structure formed of the conductor wires and the insulator.
Claim 15
Dependent Claim
95 words
A manufacturing method for a supermicro-connector according to claim 2, wherein said plurality of conductor wires are laminated into a plurality of parallel conductor wire rows arranged at predetermined intervals under a tension applied by means of a plurality of members having different heights and formed with a plurality of V-grooves arranged at regular pitches, in said step of fixing the plurality of conductor wires, arranged substantially parallel to one another, by means of the elastic insulator interposed between the conductor wires, thereby making the composite structure formed of the conductor wires and the insulator.
Claim 16
Dependent Claim
31 words
A manufacturing method for a supermicro-connector according to claim 13, wherein each said conductor wire is subjected to a tension by means of a weight attached to an end portion thereof.
Claim 17
Dependent Claim
31 words
A manufacturing method for a supermicro-connector according to claim 14, wherein each said conductor wire is subjected to a tension by means of a weight attached to an end portion thereof.
Claim 18
Dependent Claim
31 words
A manufacturing method for a supermicro-connector according to claim 13, wherein said lamination intervals between the parallel conductor wire rows are adjusted by means of spacers interposed between the wire rows.
Claim 19
Dependent Claim
31 words
A manufacturing method for a supermicro-connector according to claim 14, wherein said lamination intervals between the parallel conductor wire rows are adjusted by means of spacers interposed between the wire rows.
Claim 20
Dependent Claim
31 words
A manufacturing method for a supermicro-connector according to claim 15, wherein said lamination intervals between the parallel conductor wire rows are adjusted by means of spacers interposed between the wire rows.
Claim 21
Dependent Claim
31 words
A manufacturing method for a supermicro-connector according to claim 16, wherein said lamination intervals between the parallel conductor wire rows are adjusted by means of spacers interposed between the wire rows.
Claim 22
Dependent Claim
19 words
A manufacturing method for a supermicro-connector according to claim 1, wherein said elastic insulator is a condensed-type silicone rubber.
Claim 23
Dependent Claim
19 words
A manufacturing method for a supermicro-connector according to claim 2, wherein said elastic insulator is a condensed-type silicone rubber.
Claim 24
Dependent Claim
139 words
A manufacturing method for a supermicro-connector according to claim 1, wherein the respective end portions of the conductor wires are exposed from both cut surfaces of each of the composite chips, those end portions of the conductor wires which are exposed from one of the cut surfaces are connected electrically to a metallic electrode plate, and the solder bumps are formed individually, by electroplating, on those end portions of the conductor wires which are exposed from the other cut surface, in the step of removing the insulator from at least one cut surface of each of the composite chips by dissolution by means of the agent, thereby exposing the respective end portions of the conductor wires for the predetermined length, and the step of forming the solder bumps individually on the respective exposed end portions of the conductor wires.
Claim 25
Dependent Claim
139 words
A manufacturing method for a supermicro-connector according to claim 2, wherein the respective end portions of the conductor wires are exposed from both cut surfaces of each of the composite chips, those end portions of the conductor wires which are exposed from one of the cut surfaces are connected electrically to a metallic electrode plate, and the solder bumps are formed individually, by electroplating, on those end portions of the conductor wires which are exposed from the other cut surface, in the step of removing the insulator from at least one cut surface of each of the composite chips by dissolution by means of the agent, thereby exposing the respective end portions of the conductor wires for the predetermined length, and the step of forming the solder bumps individually on the respective exposed end portions of the conductor wires.
Claim 26
Dependent Claim
92 words
A manufacturing method for a supermicro-connector according to claim 23, wherein electrically conductive paste is applied to the one cut surface of each of the composite chip along with the exposed conductor wires, the surface of the paste is coated for insulation, and the conductor wires exposed from the one cut surface and the conductive paste are brought into contact with a conductor connected to a power source, to be supplied with electric power, whereby the solder bumps are formed by electroplating on the conductor wires exposed from the other cut surface.
Claim 27
Dependent Claim
92 words
A manufacturing method for a supermicro-connector according to claim 24, wherein electrically conductive paste is applied to the one cut surface of each of the composite chip along with the exposed conductor wires, the surface of the paste is coated for insulation, and the conductor wires exposed from the one cut surface and the conductive paste are brought into contact with a conductor connected to a power source, to be supplied with electric power, whereby the solder bumps are formed by electroplating on the conductor wires exposed from the other cut surface.
Claim 28
Dependent Claim
23 words
A manufacturing method for a supermicro-connector according to claim 1, wherein said plurality of conductor wires are gold wires or gilt conductor wires.
Claim 29
Dependent Claim
23 words
A manufacturing method for a supermicro-connector according to claim 2, wherein said plurality of conductor wires are gold wires or gilt conductor wires.
Claim 30
Dependent Claim
27 words
A manufacturing method for a supermicro-connector according to claim 1, wherein the surface of each said conductor wire is roughened by an electrolytic treatment or chemical etching.
Claim 31
Dependent Claim
27 words
A manufacturing method for a supermicro-connector according to claim 2, wherein the surface of each said conductor wire is roughened by an electrolytic treatment or chemical etching.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-03-05 | 1999-09-04 | 2000-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-03-05 | 2003-09-04 | 2004-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-03-05 | 2007-09-04 | 2008-03-05 | $7700.00 | Window Closed / Lapsed |