US5495424A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for inspecting solder portions
Assignee: Panasonic Holdings Corp
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Filing: 1994-02-24
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Granted: 1996-02-27
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Expires: 2014-02-24
Abstract
Abstract A solder portion is inspected as follows. An image of the solder portion is obtained. The image of the solder portion is collated with a plurality of predetermined reference patterns corresponding to different solder portion types respectively. A type of the solder portion is identified in response to a result of the collation. A decision is made as to whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Inventors
- 👤 Nobufumi Tokura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 03:18
CPC Classifications
G; G01; G01N; G01N21/00; G01N21/84; G01N21/88; G01N21/95; G01N21/956; G01N21/95684
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
72 words
A method of inspecting a solder portion, comprising the steps of: obtaining an image of the solder portion; collating the image of the solder portion with a plurality of predetermined reference patterns corresponding to different solder portion types respectively; identifying a type of the solder portion in response to a result of the collating step; and deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 2
Independent Claim
72 words
A method of inspecting a solder portion, comprising the steps of: obtaining an image of the solder portion; collating the image of the solder portion with a plurality of predetermined reference patterns corresponding to different solder portion types respectively; identifying a type of the solder portion in response to a result of the collating step; and deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 3
Dependent Claim
61 words
The method of claim 1, wherein the collating step and the identifying step comprise calculating rates of matching of the image of the solder portion with the reference patterns respectively, selecting a maximum matching rate from among the calculated matching rates, and identifying the type of the solder portion as being equal to the type corresponding to the maximum matching rate.
Claim 4
Independent Claim
110 words
A method of inspecting a solder portion, comprising the steps of: obtaining an image of the solder portion; calculating rates of matching of the image of the solder portion with predetermined reference patterns corresponding to different solder portion types respectively; selecting a maximum matching rate from among the calculated matching rates; comparing the maximum matching rate with a predetermined reference matching rate; identifying a type of the solder portion as being equal to the type corresponding to the maximum matching rate when the maximum matching rate is greater than the reference matching rate; and deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 5
Independent Claim
110 words
A method of inspecting a solder portion, comprising the steps of: obtaining an image of the solder portion; calculating rates of matching of the image of the solder portion with predetermined reference patterns corresponding to different solder portion types respectively; selecting a maximum matching rate from among the calculated matching rates; comparing the maximum matching rate with a predetermined reference matching rate; identifying a type of the solder portion as being equal to the type corresponding to the maximum matching rate when the maximum matching rate is greater than the reference matching rate; and deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 6
Dependent Claim
62 words
The method of claim 3, further comprising the step of using the image of the solder portion as a new reference pattern corresponding to a new solder portion type when the maximum matching rate is equal to or smaller than the reference matching rate, the new solder portion type corresponding to a gray state between a satisfactory state and an unsatisfactory state.
Claim 7
Independent Claim
80 words
An apparatus for inspecting a solder portion, comprising: means for obtaining an image of the solder portion; means for collating the image of the solder portion with a plurality of predetermined reference patterns corresponding to different solder portion types respectively; means for identifying a type of the solder portion in response to a result of the collating by the collating means; and means for deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 8
Independent Claim
80 words
An apparatus for inspecting a solder portion, comprising: means for obtaining an image of the solder portion; means for collating the image of the solder portion with a plurality of predetermined reference patterns corresponding to different solder portion types respectively; means for identifying a type of the solder portion in response to a result of the collating by the collating means; and means for deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 9
Dependent Claim
14 words
The apparatus of claim 5, wherein the collating means comprises a pattern matching circuit.
Claim 10
Independent Claim
105 words
A method of inspecting a solder portion, comprising the steps of: obtaining an image of the solder portion; deciding which of predetermined reference patterns corresponding to different solder portion types respectively is most similar to the image of the solder portion, wherein each of the reference patterns corresponds to either a satisfactory solder portion state or an unsatisfactory solder portion state; identifying a type of the solder portion as being equal to the type corresponding to the reference pattern most similar to the image of the solder pattern; and deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 11
Independent Claim
105 words
A method of inspecting a solder portion, comprising the steps of: obtaining an image of the solder portion; deciding which of predetermined reference patterns corresponding to different solder portion types respectively is most similar to the image of the solder portion, wherein each of the reference patterns corresponds to either a satisfactory solder portion state or an unsatisfactory solder portion state; identifying a type of the solder portion as being equal to the type corresponding to the reference pattern most similar to the image of the solder pattern; and deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 12
Independent Claim
110 words
An apparatus for inspecting a solder portion, comprising: means for obtaining an image of the solder portion; means for deciding which of predetermined reference patterns corresponding to different solder portion types respectively is most similar to the image of the solder portion, wherein each of the reference patterns corresponds to either a satisfactory solder portion state or an unsatisfactory solder portion state; means for identifying a type of the solder portion as being equal to the type corresponding to the reference pattern most similar to the image of the solder pattern; and means for deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
Claim 13
Independent Claim
110 words
An apparatus for inspecting a solder portion, comprising: means for obtaining an image of the solder portion; means for deciding which of predetermined reference patterns corresponding to different solder portion types respectively is most similar to the image of the solder portion, wherein each of the reference patterns corresponds to either a satisfactory solder portion state or an unsatisfactory solder portion state; means for identifying a type of the solder portion as being equal to the type corresponding to the reference pattern most similar to the image of the solder pattern; and means for deciding whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-26 | 1999-08-28 | 2000-02-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-26 | 2003-08-28 | 2004-02-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-26 | 2007-08-28 | 2008-02-27 | $7700.00 | Window Closed / Lapsed |