Process for applying structured layers using laser transfer

Claim 2

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; acting upon the material film on its side remote from the process substrate by a focus of a laser beam located in a defined position corresponding to the structured layer to be produced; heating the material in the material film with the laser beam in the region of the focus so that material from the material film migrates from the focus region to the surface region; and producing the structured layer by overlapping application of material from the focus region of the material film to the process substrate.

Claim 3

A process as defined in claim 1, wherein the material film is arranged on a carrier permeable to the laser beam.

Claim 4

A process as defined in claim 2, wherein said carrier is a rigid element.

Claim 5

A process as defined in claim 2, wherein said laser beam generates a plasma that penetrates a thickness of the material film.

Claim 6

A process as defined in claim 4, wherein the plasma is generated in a film plane with an expansion corresponding approximately to a shape of the laser beam as it converges toward said focus.

Claim 7

A process as defined in claim 1, wherein the material film is arranged on a transparent carrier permeable to the laser beam and an optical focusing means for the laser beam is arranged on a side of the transparent carrier remote from the material film.

Claim 8

A process as defined in claim 6, wherein prior to an application of material from the material film to the process substrate, the material film itself is applied to the carrier by means of the laser used for applying the structured layer.

Claim 9

A process as defined in claim 7, wherein the laser beam irradiates the carrier for applying the material thereto.

Claim 10

A process as defined in claim 7, wherein the carrier is arranged at a distance from a surface of a material target for applying the material film.

Claim 11

A process as defined in claim 9, wherein said distance is in a range of from about 1 to 5 millimeters.

Claim 12

A process as defined in claim 9, wherein the material of the material target is heated on its surface, expands in the direction of the carrier and is deposited on the carrier.

Claim 13

A process as defined in claim 9, wherein the laser beam is focused onto a surface of the material target.

Claim 14

A process as defined in claim 6, wherein the focus of the laser beam is moved relative to the carrier for the structured application of the material from the material film onto the substrate.

Claim 15

A process as defined in claim 13, wherein the focus is moved by movement of the laser beam relative to the carrier and to the optical focusing means.

Claim 16

A process as defined in claim 1, wherein the focus is selected in the film plane such that its diameter is less than a dimension of the structured layer to be applied in a plane parallel to the film plane.

Claim 17

A process as defined in claim 1, wherein the laser beam consists of a plurality of laser pulses following one another in a timed sequence.

Claim 18

A process as defined in claim 16, wherein with each laser pulse, a transfer of material occurs from a focus region of the material film onto the process substrate.

Claim 19

A process as defined in claim 16, wherein the focus regions of successive laser pulses are positioned on the material film so as not to overlap.

Claim 20

A process as defined in claim 16, wherein the focus regions of successive laser pulses are positioned on the material film so as to be adjacent one another.

Claim 21

A process as defined in claim 16, wherein the focus from laser pulse to laser pulse is moved relative to the material film.

Claim 22

A process as defined in claim 1, wherein the material film is moved relative to the process substrate.

Claim 23

A process as defined in claim 1, wherein the material film is arranged at a distance from the surface region of the process substrate, said distance being less than ten times a diameter of the focus.

Claim 24

A process as defined in claim 1, wherein the material film has a material composition functionally ready for the structured layer of the functional structure.

Claim 25

A process as defined in claim 1, wherein the application of the structured layer is performed under high vacuum or ultra-high vacuum.

Claim 26

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; generating a laser pulse having a duration of between about 1 and 100 picoseconds, a focus of said laser pulse, located in a defined position corresponding to the structured layer to be produced, acting upon the material film on its side remote from the process substrate; and heating the material in the material film with the laser pulse in the region of the focus with a light density greater than 10 8 w/cm 2 so that material from the material film migrates from the focus region to the surface region; wherein the structured layer is produced on the process substrate by overlapping application of material from the focus region of the material film.

Claim 27

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; generating a laser pulse having a duration of between about 1 and 100 picoseconds, a focus of said laser pulse, located in a defined position corresponding to the structured layer to be produced, acting upon the material film on its side remote from the process substrate; and heating the material in the material film with the laser pulse in the region of the focus with a light density greater than 10 8 w/cm 2 so that material from the material film migrates from the focus region to the surface region; wherein the structured layer is produced on the process substrate by overlapping application of material from the focus region of the material film.

Claim 28

A process as defined in claim 25, wherein the focus is selected in the film plane such that its diameter is less than a dimension of the structured layer to be applied in a plane parallel to the film plane.

Claim 29

A process as defined in claim 25, wherein the structured layer is produced by multiple applications of structured part layers.

Claim 30

A process as defined in claim 25, wherein each structured part layer is produced by a side-by-side application of material from the focus regions.

Claim 31

A process as defined in claim 25, wherein the laser beam consists of a plurality of laser pulses following one another in a timed sequence.

Claim 32

A process as defined in claim 29, wherein with each laser pulse, a transfer of material occurs from a focus region of the material film onto the process substrate.

Claim 33

A process as defined in claim 29, wherein the focus regions of successive laser pulses are positioned on the material film so as to be adjacent one another.

Claim 34

A process as defined in claim 29, wherein the focus from laser pulse to laser pulse is moved relative to the material film.

Claim 35

A process as defined in claim 25, wherein the material film is moved relative to the process substrate.

Claim 36

A process as defined in claim 25, wherein the material film is arranged at a distance from the surface region of the process substrate, said distance being less than ten times a diameter of the focus.

Claim 37

A process as defined in claim 25, wherein the material film has a material composition functionally ready for the structured layer of the functional structure.

Claim 38

A process as defined in claim 25, wherein the application of the structured layer is performed under high vacuum or ultra-high vacuum.

Claim 39

A process as defined in claim 25, wherein the material film is arranged on a carrier permeable to the laser beam.

Claim 40

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; generating a laser pulse having a duration of between about 1 and 100 picoseconds, a focus of said laser pulse, located in a defined position corresponding to the structured layer to be produced, acting upon the material film on its side remote from the process substrate; and heating the material in the material film with the laser pulse in the region of the focus with a light density greater than 10 8 w/cm 2 so that material from the material film migrates from the focus region to the surface region; wherein the laser beam consists of a plurality of laser pulses following one another in a timed sequence and the focus regions of successive laser pulses are positioned on the material film so as not to overlap.

Claim 41

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; generating a laser pulse having a duration of between about 1 and 100 picoseconds, a focus of said laser pulse, located in a defined position corresponding to the structured layer to be produced, acting upon the material film on its side remote from the process substrate; and heating the material in the material film with the laser pulse in the region of the focus with a light density greater than 10 8 w/cm 2 so that material from the material film migrates from the focus region to the surface region; wherein the laser beam consists of a plurality of laser pulses following one another in a timed sequence and the focus regions of successive laser pulses are positioned on the material film so as not to overlap.

Claim 42

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; generating a laser pulse having a duration of between about 1 and 100 picoseconds, a focus of said laser pulse, located in a defined position corresponding to the structured layer to be produced, acting upon the material film on its side remote from the process substrate; and heating the material in the material film with with the laser pulse in the region of the focus with a light density greater than 10 8 w/cm 2 so that material from the material film migrates from the focus region to the surface region; wherein the material film is arranged on a transparent carrier permeable to the laser beam, an optical focusing means for the laser beam is arranged on a side of the transparent carrier remote from the material film, and the optical focusing means is coupled to the transparent carrier by means of an immersion fluid.

Claim 43

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; generating a laser pulse having a duration of between about 1 and 100 picoseconds, a focus of said laser pulse, located in a defined position corresponding to the structured layer to be produced, acting upon the material film on its side remote from the process substrate; and heating the material in the material film with with the laser pulse in the region of the focus with a light density greater than 10 8 w/cm 2 so that material from the material film migrates from the focus region to the surface region; wherein the material film is arranged on a transparent carrier permeable to the laser beam, an optical focusing means for the laser beam is arranged on a side of the transparent carrier remote from the material film, and the optical focusing means is coupled to the transparent carrier by means of an immersion fluid.

Claim 44

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; generating a laser pulse having a duration of between about 1 and 100 picoseconds, a focus of said laser pulse, located in a defined position corresponding to the structured layer to be produced, acting upon the material film on its side remote from the process substrate; and heating the material in the material film with the laser pulse in the region of the focus with a light density greater than 10 8 w/cm 2 so that material from the material film migrates from the focus region to the surface region; wherein the material film is arranged on a transparent carrier permeable to the laser beam, an optical focusing means for the laser beam is arranged on a side of the transparent carrier remote from the material film, and the optical focusing means is arranged to focus the laser pulse on the carrier in a reflection-free manner.

Claim 45

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; generating a laser pulse having a duration of between about 1 and 100 picoseconds, a focus of said laser pulse, located in a defined position corresponding to the structured layer to be produced, acting upon the material film on its side remote from the process substrate; and heating the material in the material film with the laser pulse in the region of the focus with a light density greater than 10 8 w/cm 2 so that material from the material film migrates from the focus region to the surface region; wherein the material film is arranged on a transparent carrier permeable to the laser beam, an optical focusing means for the laser beam is arranged on a side of the transparent carrier remote from the material film, and the optical focusing means is arranged to focus the laser pulse on the carrier in a reflection-free manner.

Claim 46

A process as defined in claim 40, wherein the optical focusing means is integrally connected to the carrier.

Claim 47

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; acting upon the material film on its side remote from the process substrate by a focus of a laser beam, said laser beam consisting of a plurality of successive laser pulses following one another in timed sequence; locating the focus regions of said successive laser pulses on the material film so as not to overlap; and heating the material in the material film with the laser beam in the focus regions so that material from the material film migrates from the focus regions to the surface region.

Claim 48

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film above a surface region of a process substrate to be provided with the structured layer; acting upon the material film on its side remote from the process substrate by a focus of a laser beam, said laser beam consisting of a plurality of successive laser pulses following one another in timed sequence; locating the focus regions of said successive laser pulses on the material film so as not to overlap; and heating the material in the material film with the laser beam in the focus regions so that material from the material film migrates from the focus regions to the surface region.

Claim 49

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film on a carrier transparent to the laser beam and above a surface region of a process substrate to be provided with the structured layer; arranging an optical focusing means for a laser beam on a side of the transparent carrier remote from the material film, said optical focusing means and said transparent carrier being coupled by means of an immersion fluid; acting upon the material film on its side remote from the process substrate by a focus of said laser beam located in a defined position corresponding to the structured layer to be produced; and heating the material in the material film with the laser beam in the region of the focus so that material from the material film migrates from the focus region to the surface region.

Claim 50

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film on a carrier transparent to the laser beam and above a surface region of a process substrate to be provided with the structured layer; arranging an optical focusing means for a laser beam on a side of the transparent carrier remote from the material film, said optical focusing means and said transparent carrier being coupled by means of an immersion fluid; acting upon the material film on its side remote from the process substrate by a focus of said laser beam located in a defined position corresponding to the structured layer to be produced; and heating the material in the material film with the laser beam in the region of the focus so that material from the material film migrates from the focus region to the surface region.

Claim 51

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film on a carrier transparent to the laser beam and above a surface region of a process substrate to be provided with the structured layer; arranging an optical focusing means for a laser beam on a side of the transparent carrier remote from the material film, said optical focusing means being arranged to focus the laser beam on the carrier in a reflection-free manner; acting upon the material film on its side remote from the process substrate by a focus of said laser beam located in a defined position corresponding to the structured layer to be produced; and heating the material in the material film with the laser beam in the region of the focus so that material from the material film thereby migrates from the focus region to the surface region.

Claim 52

A process for applying structured layers of a functional structure of a semiconductor component, comprising the steps of: arranging a material film on a carrier transparent to the laser beam and above a surface region of a process substrate to be provided with the structured layer; arranging an optical focusing means for a laser beam on a side of the transparent carrier remote from the material film, said optical focusing means being arranged to focus the laser beam on the carrier in a reflection-free manner; acting upon the material film on its side remote from the process substrate by a focus of said laser beam located in a defined position corresponding to the structured layer to be produced; and heating the material in the material film with the laser beam in the region of the focus so that material from the material film thereby migrates from the focus region to the surface region.