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US5488625A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor laser device having chip-mounted heating element

Assignee: Canon Inc
•
Filing: 1993-10-05
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Granted: 1996-01-30
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Expires: 2013-10-05
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Abstract

Abstract A semiconductor device includes a chip, a laser element formed on the chip and a heating element formed on the chip. The laser element is driven to emit a laser beam upon light-on of a laser. Upon light-off of a laser, switching is made so that the heating element is driven so as not to emit the laser beam in the normal laser beam emission direction by the laser element.

Inventors

  • 👤 Tomohiro Nakamori
  • 👤 Hiroshi Hashimoto
  • 👤 Soya Endo
  • 👤 Hitoshi Machino
  • 👤 Masanori Ishizu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 10:24
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/024; H01S5/02453; H01S5/026; H01S5/40; H01S5/4025; H01S5/022; H01S5/02208; H01S5/02212; H01S5/0261; H01S5/028; H01S5/04; H01S5/042; H01S5/06; H01S5/0607; H01S5/0612; H01S5/068; H01S5/0683; H01S5/06837; H01S5/4031; H01S5/4037; H01S5/4056

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 57 words
A semiconductor laser device comprising: a chip; a laser element formed on said chip, said laser element being operable to emit a laser beam in a first direction; and a heating element formed on the chip, said heating element comprising a heating laser element formed so as not to emit a laser beam in the first direction.
Claim 2
Dependent Claim 57 words
A semiconductor laser device comprising: a chip; a laser element formed on said chip, said laser element being operable to emit a laser beam in a first direction; and a heating element formed on the chip, said heating element comprising a heating laser element formed so as not to emit a laser beam in the first direction.
Claim 3
Dependent Claim 13 words
A device according to claim 1, wherein said heating element heats the chip.
Claim 4
Dependent Claim 26 words
A semiconductor laser device according to claim 1, further comprising a control device for controlling switchover and drive of said laser element and said heating element.
Claim 5
Dependent Claim 67 words
A semiconductor laser device comprising: a chip; a laser element formed on the chip; and a diode element formed on the chip, wherein when said diode element is connected to a power source to which said laser element is connected, the diode element generates a heat amount which is approximately equal to an amount of heat which is generated when the laser element emits a laser beam.
Claim 6
Dependent Claim 67 words
A semiconductor laser device comprising: a chip; a laser element formed on the chip; and a diode element formed on the chip, wherein when said diode element is connected to a power source to which said laser element is connected, the diode element generates a heat amount which is approximately equal to an amount of heat which is generated when the laser element emits a laser beam.
Claim 7
Dependent Claim 22 words
A semiconductor laser device according to claim 4, further comprising a detection element for detecting an emission intensity of said laser element.
Claim 8
Dependent Claim 38 words
A semiconductor laser device according to claim 4, further comprising a control device for driving said laser element at a time of laser turn-on and for switching to drive said diode element at the time of laser turn-off.
Claim 9
Dependent Claim 18 words
A semiconductor laser device according to claim 4, wherein said diode element is used for heating said chip.
Claim 10
Independent Claim 61 words
A method of driving a semiconductor laser device, comprising the steps of: forming on a single chip a laser element and a heating laser element which does not emit a laser beam in a direction in which the laser element emits a laser beam; driving the laser element; and driving the heating laser element when the laser element is not driven.
Claim 11
Independent Claim 61 words
A method of driving a semiconductor laser device, comprising the steps of: forming on a single chip a laser element and a heating laser element which does not emit a laser beam in a direction in which the laser element emits a laser beam; driving the laser element; and driving the heating laser element when the laser element is not driven.
Claim 12
Dependent Claim 21 words
A method according to claim 8, wherein said heating laser element heats said chip when said heating laser element is driven.
Claim 13
Independent Claim 37 words
A method of driving a semiconductor laser device, comprising: driving a laser element; and driving a diode element formed on the same chip on which said laser element is formed when said laser element is not driven.
Claim 14
Independent Claim 37 words
A method of driving a semiconductor laser device, comprising: driving a laser element; and driving a diode element formed on the same chip on which said laser element is formed when said laser element is not driven.
Claim 15
Dependent Claim 19 words
A method according to claim 10, wherein said diode element heats said chip when said diode element is driven.
Claim 16
Dependent Claim 46 words
A method according to claim 10, wherein when said diode element is connected to a power source to which said laser element is connected, said diode element generates a heat amount of which is approximately equal to that generated when said laser element emits laser beam.

References Cited (Backward Citations)

US4359773A Cited
US5105433A Cited
US5140605A Cited
US5197076A Cited
US5262658A Cited
US5267255A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-01-29 1999-07-31 2000-01-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-01-29 2003-07-31 2004-01-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-01-29 2007-07-31 2008-01-30 $7700.00 Window Closed / Lapsed

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