Patent US648210A successfully refreshed from Google Patents.
US5487697A
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Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
Assignee: DuPont Electronic Materials Holding Inc
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Filing: 1993-02-09
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Granted: 1996-01-30
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Expires: 2013-02-09
Abstract
Abstract The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.
Inventors
- 👤 Elmer W. Jensen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 16:17
CPC Classifications
B; B24; B24B; B24B7/00; B24B7/20; B24B7/22; B24B37/00; B24B37/04; B24B37/07; B24B37/08; B24B37/10; B24B37/105; B24B37/107; B24B37/11; B24B37/20
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
121 words
An apparatus for polishing a flat surface comprising: (a) one or more linear polishing pads each of which has a long linear dimension such that the surface of each pad which contacts said workpiece is long and narrow; and (b) a carrier which holds at least one workpiece to be polished, said carrier mounted to a rail which is parallel to a longitudinal axis of said linear polishing pad or pads whereby said carrier periodically passes each workpiece over a different portion of said pad surface as said carrier travels along said rail generally in a straight line parallel to said long linear dimension of said linear polishing pad or pads down the length of said linear polishing pad or pads.
Claim 2
Independent Claim
121 words
An apparatus for polishing a flat surface comprising: (a) one or more linear polishing pads each of which has a long linear dimension such that the surface of each pad which contacts said workpiece is long and narrow; and (b) a carrier which holds at least one workpiece to be polished, said carrier mounted to a rail which is parallel to a longitudinal axis of said linear polishing pad or pads whereby said carrier periodically passes each workpiece over a different portion of said pad surface as said carrier travels along said rail generally in a straight line parallel to said long linear dimension of said linear polishing pad or pads down the length of said linear polishing pad or pads.
Claim 3
Dependent Claim
13 words
An apparatus according to claim 1, wherein said workpiece is a semiconductor wafer.
Claim 4
Dependent Claim
23 words
An apparatus according to claim 1, wherein said carrier rotates about an axis perpendicular to said straight line of travel of said carrier.
Claim 5
Dependent Claim
13 words
An apparatus according to claim 3, wherein said workpiece is a semiconductor wafer.
Claim 6
Dependent Claim
23 words
An apparatus according to claim 1, further comprising: (c) means for holding said workpiece against said linear polishing pads with a steady pressure.
Claim 7
Dependent Claim
13 words
An apparatus according to claim 5, wherein said workpiece is a semiconductor wafer.
Claim 8
Dependent Claim
19 words
An apparatus according to claim 5, wherein the pressure holding said workpiece against said linear polishing pads is adjustable.
Claim 9
Dependent Claim
13 words
An apparatus according to claim 7, wherein said workpiece is a semiconductor wafer.
Claim 10
Dependent Claim
16 words
An apparatus according to claim 1, wherein the cross-section of said linear polishing pad is rectangular.
Claim 11
Dependent Claim
13 words
An apparatus according to claim 9, wherein said workpiece is a semiconductor wafer.
Claim 12
Dependent Claim
24 words
An apparatus according to claim 1, wherein the surface of said linear polishing pad which contacts said workpiece is part of a cylindrical surface.
Claim 13
Dependent Claim
13 words
An apparatus according to claim 11, wherein said workpiece is a semiconductor wafer.
Claim 14
Dependent Claim
25 words
An apparatus according to claim 11, wherein said linear polishing pad is moved about its axis to continuously expose fresh pad surface to said workpiece.
Claim 15
Dependent Claim
13 words
An apparatus according to claim 13, wherein said workpiece is a semiconductor wafer.
Claim 16
Dependent Claim
17 words
An apparatus according to claim 1 , wherein polishing composition is applied to said linear polishing pads.
Claim 17
Dependent Claim
13 words
An apparatus according to claim 15, wherein said workpiece is a semiconductor wafer.
Claim 18
Dependent Claim
13 words
An apparatus according to claim 15, wherein said polishing composition is a slurry.
Claim 19
Dependent Claim
13 words
An apparatus according to claim 17, wherein said workpiece is a semiconductor wafer.
Claim 20
Independent Claim
88 words
A method for polishing a flat surface of a workpiece comprising: (a) placing said workpiece in a carrier mounted to a rail which is parallel to a longitudinal axis of linear polishing pad or pads and (b) periodically passing said workpiece over a different portion of the surface of said polishing pad or pads as said carrier travels along said rail generally in a straight line parallel to a long linear dimension of said polishing pad or pads down the length of said linear polishing pad or pads.
Claim 21
Independent Claim
88 words
A method for polishing a flat surface of a workpiece comprising: (a) placing said workpiece in a carrier mounted to a rail which is parallel to a longitudinal axis of linear polishing pad or pads and (b) periodically passing said workpiece over a different portion of the surface of said polishing pad or pads as said carrier travels along said rail generally in a straight line parallel to a long linear dimension of said polishing pad or pads down the length of said linear polishing pad or pads.
Claim 22
Dependent Claim
13 words
A method according to claim 19, wherein said workpiece is a semiconductor wafer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-01-29 | 1999-07-31 | 2000-01-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-01-29 | 2003-07-31 | 2004-01-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-01-29 | 2007-07-31 | 2008-01-30 | $7700.00 | Window Closed / Lapsed |