Reliability test method for semiconductor trench devices

Abstract

Abstract The present invention detects defects near the gate/trench-surface interface of trench transistors. Defects near this interface which cause long term reliability problems generally also result in charges being trapped near the interface. In accordance with one embodiment of the present invention, a negative voltage is applied to the gate of the trench transistor with its drain grounded and its source floating. A leakage current flowing between the gate and drain is measured as a function of the voltage applied to the gate. A transistor whose gate-drain leakage current exceeds a predetermined value at a specified gate voltage is deemed to be defective. In another embodiment of the present invention, the gate-drain leakage current is measured as described above and monitored over time. Charge accumulated near the gate-drain interface due to defects in the interface results in the gate-drain leakage current taking a longer period of time to fall off to its steady state value. Accordingly, if the leakage current of a particular trench transistor does not fall off to a predetermined value within a predetermined amount of time, the transistor is deemed to be defective. The minimum/maximum allowable gate-drain leakage current published in a data sheet for the trench transistor will provide consumers with additional assurance of the transistor's long term reliability.

Inventors

• 👤 Fwu-Iuan Hshieh
• 👤 Calvin K. Choi
• 👤 William H. Cook
• 👤 Lih-Ying Ching
• 👤 Mike F. Chang

Bibliographic Details