Abstract A semiconductor integrated circuit device has an interconnection structure in which multilayer aluminum interconnection layers are connected through connection holes. A first aluminum interconnection layer is formed on a main surface of the semiconductor substrate. The first aluminum interconnection layer has a surface layer which includes any of high melting point metal, high melting point metal compound, high melting point metal silicide, or amorphous silicon. An insulating layer is formed on the first aluminum interconnection layer, and has a through hole if formed extending to a surface of the first aluminum interconnection layer. A second aluminum interconnection layer is formed on the insulating layer and is electrically connected to the surface layer of the first aluminum interconnection layer through the through hole. The second aluminum interconnection layer includes a titanium layer, a titanium nitride layer and an aluminum alloy layer. The titanium layer is formed on the insulating layer to be in contact with the surface of the first aluminum interconnection layer through the through hole. The titanium nitride layer is formed on the titanium layer. The aluminum alloy layer is formed on the titanium nitride layer. An electrical contact resistance between the first and second aluminum interconnection layers is stabilized, and resistance against the electron-migration and stress-migration is improved in the interconnection structure.
A method for manufacturing an interconnection structure of a semiconductor integrated device having multilayer aluminum interconnection layers connected through connection holes, which method comprises: forming an aluminum interconnection layer on a main surface of a semiconductor substrate; forming a surface layer comprising a refractory material on a surface of said first aluminum interconnection layer; forming an insulating layer on said surface layer; forming a through hole exposing at least a surface of said surface layer by selectively removing a portion of said insulating layer; forming a titanium layer on said insulating layer in contact with the surface of said surface layer through said through hole; forming a titanium compound layer on said titanium layer; and forming an aluminum containing layer on said titanium compound layer.
Claim 2
Independent Claim
125 words
A method for manufacturing an interconnection structure of a semiconductor integrated device having multilayer aluminum interconnection layers connected through connection holes, which method comprises: forming an aluminum interconnection layer on a main surface of a semiconductor substrate; forming a surface layer comprising a refractory material on a surface of said first aluminum interconnection layer; forming an insulating layer on said surface layer; forming a through hole exposing at least a surface of said surface layer by selectively removing a portion of said insulating layer; forming a titanium layer on said insulating layer in contact with the surface of said surface layer through said through hole; forming a titanium compound layer on said titanium layer; and forming an aluminum containing layer on said titanium compound layer.
Claim 3
Dependent Claim
27 words
The manufacturing method according to claim 1, wherein said step of selectively removing includes sputter etching on the exposed surface of said surface layer by argon ions.
Claim 4
Dependent Claim
50 words
The manufacturing method according to claim 1, further comprising heating to cause reaction of said surface layer and said titanium layer to form an intermetallic compound layer of titanium and the metals included in the surface layer at a contact interface between said titanium compound layer and said surface layer.
Claim 5
Dependent Claim
23 words
The manufacturing method according to claim 3, wherein said step of heating includes heating for 15-60 minutes at a temperature of 300°-450° C.