Protection circuit for protecting a semiconductor device from a voltage surge

Claim 2

An input protection circuit, comprising: a conductor pattern provided on a semiconductor substrate formed with an integrated circuit, said conductor pattern having a first end connected to an input pad provided on said semiconductor substrate and a second, opposite end and defined by first and second edges both extending between said first and second ends; a first ground pattern on said semiconductor substrate, said first ground pattern being defined by a third edge having a shape corresponding to said first edge, said first ground pattern being provided on said semiconductor substrate so as to form a first gap having generally a uniform width between said first and third edges; a second ground pattern on said semiconductor substrate, said second ground pattern being defined by a fourth edge having a shape corresponding to said second edge, said second ground pattern being provided on said semiconductor substrate so as to form a second gap having generally a uniform width between said second and fourth edges; a first gate pattern provided on said semiconductor substrate in correspondence to said first gap such that said first gate pattern extends with a separation from any of said first and third edges; a second gate pattern provided on said semiconductor substrate in correspondence to said second gap such that said second gate pattern extends with a separation from any of said second and fourth edges; a first channel region formed on said semiconductor substrate in correspondence to said first gate pattern; a second channel region formed on said semiconductor substrate in correspondence to said second gate pattern; a source region formed on said semiconductor substrate in correspondence to said conductor pattern; a first drain region formed on said semiconductor substrate in correspondence to said first ground pattern; a second drain region formed on said semiconductor substrate in correspondence to said second ground pattern; a first contact structure provided on said conductor pattern for connecting said conductor pattern to said source region electrically; a second contact structure provided on said first ground pattern for connecting said first ground pattern to said first drain region; a third contact structure provided on said second ground pattern for connecting said second ground pattern to said second drain region; a first ground structure for grounding said first gate pattern; a second ground structure for grounding said second gate pattern; a diffusion region formed on said semiconductor substrate so as to extend from said second end of said conductor pattern toward said integrated circuit, said diffusion region having a resistance; and a lead pattern extending from said diffusion region toward said integrated circuit for carrying electric signals supplied to said input pad to said integrated circuit; said conductor pattern, said first ground pattern, said first gate pattern, said first channel region, said source region and said first drain region forming a first transistor; said conductor pattern, said second ground pattern, said second gate pattern, said second channel region, said source region and said second drain region forming a second transistor; said first and second ground patterns forming two, mutually separated conducting members on said semiconductor substrate; said first and second gate patterns forming two, mutually separated conducting members on said semiconductor substrate; said first and second drain regions being formed on said substrate with a mutual separation from each other.

Claim 3

An input protection circuit as claimed in claim 1, wherein said conductor pattern includes a projection on at least one of said first and second edges such that said projection protrudes in a direction generally perpendicular to an elongating direction of said conductor pattern.

Claim 4

An input protection circuit as claimed in claim 1, wherein said conductor pattern extends zigzag from said first end to said second end.

Claim 5

An input protection circuit as claimed in claim 1, wherein said input protection circuit further includes another conductor pattern connected to said integrated circuit, such that said another conductor pattern is contacted to said diffusion region by a contact hole at a location offset from said second end of said conductor pattern toward said integrated circuit.

Claim 6

An input protection circuit as claimed in claim 4, wherein said first and second gate patterns extend generally parallel with each other along said diffusion region from said second end of said conductor pattern to said contact hole, with a mutual separation from each other, and wherein said input protection circuit further includes a pair of transistors different from any of said first and second transistors at both sides of said contact hole, such that said pair of transistors have said first and second gate patterns as respective gate electrodes.

Claim 7

An input circuit as claimed in claim 1, wherein each of said first, second and third contact structures includes a plurality of contact holes formed in an insulation layer covering an upper major surface of said substrate.

Claim 8

An input circuit as claimed in claim 1, wherein said first ground structure comprises a first polysilicon pattern having a first end connected to said first gate pattern by way of a contact hole and a second, opposite end connected to said first ground pattern by way of a different contact hole, and wherein said second ground structure comprises a second polysilicon pattern having a first end connected to said second gate pattern by way of a contact hole and a second, opposite end connected to said second ground pattern by way of a different contact hole.

Claim 9

An integrated circuit, comprising: a semiconductor substrate; an input pad provided on said substrate; a circuit provided on said semiconductor substrate for receiving an input signal from said input pad; and an input protection circuit provided on said semiconductor substrate between said input pad and said circuit for dissipating a voltage surge on said input signal, said input protection circuit comprising: a conductor pattern provided on said semiconductor substrate, said conductor pattern having a first end connected to said input pad and a second, opposite end and defined by first and second edges both extending between said first and second ends; a first ground pattern on said semiconductor substrate, said first ground pattern being defined by a third edge having a shape corresponding to said first edge, said first ground pattern being provided on said semiconductor substrate so as to form a first gap having generally a uniform width between said first and third edges; a second ground pattern on said semiconductor substrate, said second ground pattern being defined by a fourth edge having a shape corresponding to said second edge, said second ground pattern being provided on said semiconductor substrate so as to form a second gap having generally a uniform width between said second and fourth edges; a first gate pattern provided on said semiconductor substrate in correspondence to said first gap such that said first gate pattern extends with a separation from any of said first and third edges; a second gate pattern provided on said semiconductor substrate in correspondence to said second gap such that said second gate pattern extends with a separation from any of said second and fourth edges; a first channel region formed on said semiconductor substrate in correspondence to said first gate pattern; a second channel region formed on said semiconductor substrate in correspondence to said second gate pattern; a source region formed on said semiconductor substrate in correspondence to said conductor pattern; a first drain region formed on said semiconductor substrate in correspondence to said first ground pattern; a second drain region formed on said semiconductor substrate in correspondence to said second ground pattern; a first contact structure provided on said conductor pattern for connecting said conductor pattern to said source region electrically; a second contact structure provided on said first ground pattern for connecting said first ground pattern to said first drain region; a third contact structure provided on said second ground pattern for connecting said second ground pattern to said second drain region; a first ground structure for grounding said first gate pattern; a second ground structure for grounding said second gate pattern; a diffusion region formed on said semiconductor substrate so as to extend from said second end of said conductor pattern toward said circuit, said diffusion region having a resistance; and a lead pattern extending from said diffusion region toward said circuit for carrying electric signals supplied to said input pad to said circuit; said conductor pattern, said first ground pattern, said first gate pattern, said first channel region, said source region and said first drain region forming a first transistor; said conductor pattern, said second ground pattern, said second gate pattern, said second channel region, said source region and said second drain region forming a second transistor; said first and second ground patterns forming two, mutually separated conducting members on said semiconductor substrate; said first and second gate patterns forming two, mutually separated conducting members on said semiconductor substrate.

Claim 10

An integrated circuit, comprising: a semiconductor substrate; an input pad provided on said substrate; a circuit provided on said semiconductor substrate for receiving an input signal from said input pad; and an input protection circuit provided on said semiconductor substrate between said input pad and said circuit for dissipating a voltage surge on said input signal, said input protection circuit comprising: a conductor pattern provided on said semiconductor substrate, said conductor pattern having a first end connected to said input pad and a second, opposite end and defined by first and second edges both extending between said first and second ends; a first ground pattern on said semiconductor substrate, said first ground pattern being defined by a third edge having a shape corresponding to said first edge, said first ground pattern being provided on said semiconductor substrate so as to form a first gap having generally a uniform width between said first and third edges; a second ground pattern on said semiconductor substrate, said second ground pattern being defined by a fourth edge having a shape corresponding to said second edge, said second ground pattern being provided on said semiconductor substrate so as to form a second gap having generally a uniform width between said second and fourth edges; a first gate pattern provided on said semiconductor substrate in correspondence to said first gap such that said first gate pattern extends with a separation from any of said first and third edges; a second gate pattern provided on said semiconductor substrate in correspondence to said second gap such that said second gate pattern extends with a separation from any of said second and fourth edges; a first channel region formed on said semiconductor substrate in correspondence to said first gate pattern; a second channel region formed on said semiconductor substrate in correspondence to said second gate pattern; a source region formed on said semiconductor substrate in correspondence to said conductor pattern; a first drain region formed on said semiconductor substrate in correspondence to said first ground pattern; a second drain region formed on said semiconductor substrate in correspondence to said second ground pattern; a first contact structure provided on said conductor pattern for connecting said conductor pattern to said source region electrically; a second contact structure provided on said first ground pattern for connecting said first ground pattern to said first drain region; a third contact structure provided on said second ground pattern for connecting said second ground pattern to said second drain region; a first ground structure for grounding said first gate pattern; a second ground structure for grounding said second gate pattern; a diffusion region formed on said semiconductor substrate so as to extend from said second end of said conductor pattern toward said circuit, said diffusion region having a resistance; and a lead pattern extending from said diffusion region toward said circuit for carrying electric signals supplied to said input pad to said circuit; said conductor pattern, said first ground pattern, said first gate pattern, said first channel region, said source region and said first drain region forming a first transistor; said conductor pattern, said second ground pattern, said second gate pattern, said second channel region, said source region and said second drain region forming a second transistor; said first and second ground patterns forming two, mutually separated conducting members on said semiconductor substrate; said first and second gate patterns forming two, mutually separated conducting members on said semiconductor substrate.