Structure for microelectronic device incorporating low resistivity straps between conductive regions

Claim 2

A connecting structure comprising: a substrate; an insulating layer selectively formed on said substrate, said insulating layer defining an opening over a first region of said substrate wherein said opening has substantially vertical sidewalls of a selected height; a first interconnective layer formed on said insulating layer and said opening so as to make contact with said first region, said first interconnective layer comprising a top part and a bottom part, the top part being a semiconductor and the bottom part being a conductive material, said first interconnective layer having a thickness sufficient to partially fill said opening and to prevent dopants from subsequent doping operations from penetrating to said first region.

Claim 3

The connecting structure of claim 1 and further comprising a masking layer on said first interconnective layer, said masking layer patterned such that selected portions of said top part of said first interconnective layer remain exposed.

Claim 4

The connecting structure of claim 2 wherein said masking layer acts as a mask to subsequent doping operations by which the semiconductor of said exposed portions of said top part of said first interconnective layer is doped to render a low resistivity path from said top part to said bottom part of said first interconnective layer.

Claim 5

The connecting structure of claim 2 and further comprising a second insulating layer overlying selected portions of said first interconnective layer and said masking layer and patterned such that selected portions of said first interconnective layer remain exposed.

Claim 6

The connecting structure of claim 4 and further comprising a second interconnective layer overlying said second insulating layer, and in electrical communication with said first interconnective layer.

Claim 7

The connecting structure of claim 1 wherein said first interconnective layer is patterned so as to form a conducting path between said first region and a second region on said substrate.

Claim 8

The connecting structure of claim 6 wherein said first region is the drain region of a first transistor and said second region is the gate region of a second transistor.

Claim 9

The connecting structure of claim 7 wherein said gate region and said drain region are part of an SRAM cell structure.

Claim 10

The connecting structure of claim 6 wherein said first region is a semiconductor of a first impurity type and said second region is a semiconductor of a second impurity type.

Claim 11

A connecting structure comprising: a substrate having a first region and a second region; a first insulating layer selectively formed on said substrate, said first insulating layer defining first and second openings over said first and second regions, said openings having substantially vertical sidewalls of a selected height; a first interconnective layer formed over said insulating layer and said opening so as to make contact with said first and second region, said first interconnective layer formed of a silicide-forming metal reacted with an overlying undoped silicon layer, said first interconnective layer patterned so as to define a conducting strap between said first region and a second region; a masking layer over said first interconnective layer, said masking layer formed to have a second selected height overlying at least said first and second openings, said masking layer patterned such that selected portions of said first interconnective layer remain exposed, said masking layer acting as a mask to subsequent doping operations by which the undoped silicon of said exposed portions are doped to render a low resistivity path to said underlying silicide-forming metal, and said second selected height of said insulating layer being sufficient to prevent dopants from penetrating the portions of said first interconnective layer which lies approximately above said first and second regions whereby counter-doping of said regions may be reduced; a second interconnective layer overlying said masking layer and said exposed conducting strap; a second insulating layer overlying selected portions of said conducting strap and said masking layer and patterned such that selected portions of said conducting strap remain exposed; and a second interconnective layer overlying said second insulating layer, and overlying and in electrical communication with said conducting strap.

Claim 12

A connecting structure comprising: a substrate having a first region and a second region; a first insulating layer selectively formed on said substrate, said first insulating layer defining first and second openings over said first and second regions, said openings having substantially vertical sidewalls of a selected height; a first interconnective layer formed over said insulating layer and said opening so as to make contact with said first and second region, said first interconnective layer formed of a silicide-forming metal reacted with an overlying undoped silicon layer, said first interconnective layer patterned so as to define a conducting strap between said first region and a second region; a masking layer over said first interconnective layer, said masking layer formed to have a second selected height overlying at least said first and second openings, said masking layer patterned such that selected portions of said first interconnective layer remain exposed, said masking layer acting as a mask to subsequent doping operations by which the undoped silicon of said exposed portions are doped to render a low resistivity path to said underlying silicide-forming metal, and said second selected height of said insulating layer being sufficient to prevent dopants from penetrating the portions of said first interconnective layer which lies approximately above said first and second regions whereby counter-doping of said regions may be reduced; a second interconnective layer overlying said masking layer and said exposed conducting strap; a second insulating layer overlying selected portions of said conducting strap and said masking layer and patterned such that selected portions of said conducting strap remain exposed; and a second interconnective layer overlying said second insulating layer, and overlying and in electrical communication with said conducting strap.

Claim 13

A connecting structure comprising: a substrate; an insulating layer selectively formed on said substrate, said insulating layer defining an opening over a first region of said substrate; a first interconnective layer formed on said insulating layer and in said opening so as to make contact with said first region, said first interconnective layer comprising a top part and a bottom part, the top part being a semiconductor and the bottom part being a conductive material, said first interconnective layer deposited on the sidewalls of said opening such that a cavity is defined by said first interconnective layer within said opening; and an insulating plug partially filling said cavity and overlying said first interconnective layer about the perimeter of said cavity, said insulating plug acting as a mask to subsequent doping operations by which the semiconductor of an exposed portion of said top part is doped to render a low resistivity path from said top part to said bottom part of said first interconnective layer, said plug acting to prevent dopants from said subsequent doping operations from penetrating to said first region.

Claim 14

A connecting structure comprising: a substrate; an insulating layer selectively formed on said substrate, said insulating layer defining an opening over a first region of said substrate; a first interconnective layer formed on said insulating layer and in said opening so as to make contact with said first region, said first interconnective layer comprising a top part and a bottom part, the top part being a semiconductor and the bottom part being a conductive material, said first interconnective layer deposited on the sidewalls of said opening such that a cavity is defined by said first interconnective layer within said opening; and an insulating plug partially filling said cavity and overlying said first interconnective layer about the perimeter of said cavity, said insulating plug acting as a mask to subsequent doping operations by which the semiconductor of an exposed portion of said top part is doped to render a low resistivity path from said top part to said bottom part of said first interconnective layer, said plug acting to prevent dopants from said subsequent doping operations from penetrating to said first region.

Claim 15

The connecting structure of claim 11 and further comprising a second insulating layer overlying selected portions of said first interconnective layer and said insulating plug and patterned such that selected portions of said first interconnective layer remain exposed.

Claim 16

The connecting structure of claim 12 and further comprising a second interconnective layer overlying said second insulating layer, and in electrical communication with said first interconnective layer.

Claim 17

The connecting structure of claim 11 wherein said first interconnective layer is patterned so as to form a conducting path between said first region and a second region.

Claim 18

The connecting structure of claim 14 wherein said first region is the drain region of a first transistor and said second region is the gate region of a second transistor.

Claim 19

The connecting structure of claim 15 wherein said gate region and said drain region are part of an SRAM cell structure.

Claim 20

The connecting structure of claim 14 wherein said first region is a semiconductor of a first impurity type and said second region is a semiconductor of a second impurity type.

Claim 21

A connecting structure comprising: a substrate; an insulating layer selectively formed on said substrate, said insulating layer defining an opening over a first region of said substrate; a conductive layer formed on said insulating layer and in said opening; a second insulating layer formed on said conductive layer, said second insulating layer and said conductive layer deposited on the sidewalls of said opening such that a cavity is defined within said second insulating layer; an insulating plug partially filling said cavity and overlying said first interconnective layer about the perimeter of said cavity, said insulating plug acting as a mask during doping operations to prevent doping of the first region of the substrate; and a conductive region formed in the second insulating layer.

Claim 22

A connecting structure comprising: a substrate; an insulating layer selectively formed on said substrate, said insulating layer defining an opening over a first region of said substrate; a conductive layer formed on said insulating layer and in said opening; a second insulating layer formed on said conductive layer, said second insulating layer and said conductive layer deposited on the sidewalls of said opening such that a cavity is defined within said second insulating layer; an insulating plug partially filling said cavity and overlying said first interconnective layer about the perimeter of said cavity, said insulating plug acting as a mask during doping operations to prevent doping of the first region of the substrate; and a conductive region formed in the second insulating layer.

Claim 23

The structure of claim 18 wherein said conductive region acts to electrically connect the top surface of said second insulating layer and said conductive layer.

Claim 24

The structure of claim 19 and further comprising a third insulating layer formed on said second insulating layer such that portions of said conductive region remain exposed.

Claim 25

The structure of claim 19 and further comprising a second conductive layer formed on said second insulating layer and in electrical communication with said conductive region.