US5473513A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photosensitive array wherein chips are not thermally matched to the substrate
Assignee: Xerox Corp
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Filing: 1994-12-19
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Granted: 1995-12-05
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Expires: 2014-12-19
Abstract
Abstract Semiconductor chips, such as photosensor arrays in a full-width scanner, are mounted on a substrate to maintain reasonably consistent spacing among chips regardless of temperature conditions during use. After chips are tacked onto the substrate with uncured epoxy, the assembly is brought to a low temperature prior to the heating of the curing step. The technique permits design of the assembly to compensate for differences between the thermal coefficient of expansion of the chips and that of the substrate, while also minimizing mechanical stresses on the chips caused by heating in the course of use.
Inventors
- 👤 Kraig A. Quinn
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 01:44
CPC Classifications
G; G06; G06K; G06K7/00; G06K7/10; G06K7/10544; G06K7/10821; G06K7/10841; H; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W90/00; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/353; H10W72/354
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
50 words
An assembly comprising: a substrate; and a plurality of semiconductor chips attached to the substrate, each of the semiconductor chips being in contact with one another at a first temperature and being spaced from one another at an operating temperature, with the first temperature being lower than the operating temperature.
Claim 2
Dependent Claim
50 words
An assembly comprising: a substrate; and a plurality of semiconductor chips attached to the substrate, each of the semiconductor chips being in contact with one another at a first temperature and being spaced from one another at an operating temperature, with the first temperature being lower than the operating temperature.
Claim 3
Dependent Claim
23 words
An assembly as in claim 1, wherein the semiconductor chips comprise a material having a lower thermal coefficient of expansion than the substrate.
Claim 4
Dependent Claim
12 words
An assembly as in claim 1, wherein the substrate substantially comprises alumina.
Claim 5
Dependent Claim
19 words
An assembly as in claim 1, wherein each of the semiconductor chips defines a plurality of repetitive structures thereon.
Claim 6
Dependent Claim
35 words
An assembly as in claim 4, wherein, at the expected operating temperature of the semiconductor chips, the semiconductor chips define a gap therebetween less than the distance between individual repetitive structures on a semiconductor chip.
Claim 7
Dependent Claim
37 words
An assembly as in claim 4, wherein, at the expected operating temperature of the semiconductor chips, the semiconductor chips define a gap therebetween less than one-tenth of the distance between individual repetitive structures on a semiconductor chip.
Claim 8
Dependent Claim
12 words
An assembly as in claim 4, wherein the repetitive structures comprise photosites.
Claim 9
Dependent Claim
15 words
An assembly as in claim 4, wherein the repetitive structures comprise portions of ink-jet ejectors.
Claim 10
Dependent Claim
12 words
An assembly as in claim 4, wherein the repetitive structures comprise LEDs.
Claim 11
Dependent Claim
20 words
An assembly as in claim 1, a semiconductor chip defining a groove between a main surface and a surface thereof.
Claim 12
Dependent Claim
75 words
An assembly comprising: a substrate; and a plurality of semiconductor chips attached to the substrate and arranged in a linear array on the substrate, each of the semiconductor chips having a main surface attached to the substrate, and a side surface in contact with a neighboring chip in the linear array at a first temperature and spaced from the neighboring chip at an operating temperature, with the first temperature being lower than the operating temperature.
Claim 13
Dependent Claim
75 words
An assembly comprising: a substrate; and a plurality of semiconductor chips attached to the substrate and arranged in a linear array on the substrate, each of the semiconductor chips having a main surface attached to the substrate, and a side surface in contact with a neighboring chip in the linear array at a first temperature and spaced from the neighboring chip at an operating temperature, with the first temperature being lower than the operating temperature.
Claim 14
Dependent Claim
33 words
An assembly as in claim 11, wherein each of the semiconductor chips defines a plurality of repetitive structures evenly spaced thereon, the repetitive structures on each chip being oriented along the linear array.
Claim 15
Dependent Claim
34 words
An assembly as in claim 12, wherein, at the operating temperature, the side surfaces of neighboring semiconductor chips define a gap therebetween less than a distance between individual repetitive structures on a semiconductor chip.
Claim 16
Dependent Claim
36 words
An assembly as in claim 12, wherein, at the operating temperature, the side surfaces of neighboring semiconductor chips define a gap therebetween less than one-tenth of a distance between individual repetitive structures on a semiconductor chip.
Claim 17
Dependent Claim
12 words
An assembly as in claim 12, wherein the repetitive structures comprise photosites.
Claim 18
Dependent Claim
15 words
An assembly as in claim 12, wherein the repetitive structures comprise portions of ink-jet ejectors.
Claim 19
Dependent Claim
12 words
An assembly as in claim 12, wherein the repetitive structures comprise LEDs.
Claim 20
Dependent Claim
16 words
An assembly as in claim 11, wherein the first temperature is not less than -20° C.
Claim 21
Dependent Claim
21 words
An assembly as in claim 11, wherein the first temperature is not more than 80 celsius degrees below the operating temperature.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-04 | 1999-06-05 | 1999-12-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-04 | 2003-06-05 | 2003-12-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-04 | 2007-06-05 | 2007-12-05 | $7700.00 | Window Closed / Lapsed |