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US5063286A Expired / Lapsed US ⏱️ 0.0 years remaining

Line image sensor with plural elements arranged at a predetermined pitch according to thermal expansion

Assignee: Ricoh Co Ltd
•
Filing: 1990-12-17
•
Granted: 1991-11-05
•
Expires: 2010-12-17
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Abstract

Abstract A multi-chip type image sensor includes, a base, a plurality of sensor chips arranged on the base so as to be staggered so that adjacent sensor chips among the sensor chips partially overlap with each other in the direction perpendicular to a direction in which the sensor chips are arranged. The sensor chips are fastened to the base by an adhesive for use in die bonding. Each of the sensor chips has a plurality of light receiving elements arranged into a line at a predetermined pixel pitch Pd. Each of the sensor chip contains silicon. Therminal pins are supported on the base and electrically coupled to the sensor chips. The following formula is satisfied: Pc=Pdx[1+(Tc-Ta) ( alpha B- alpha Si)] where Tc [ DEG C.] is a curing temperature of the adhesive, Ta [ DEG C.] is an environment temperature at which the image sensor is to be used, alpha Si is a thermal expansion coefficient of each of the sensor chips comprising silicon, alpha B is a thermal expansion coefficient of the base, and Pc is a pixel pitch at which the light receiving elements are arranged in each of the sensor chips before the adhesive is cured by die bonding.

Inventors

  • 👤 Yutaka Kaneko

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-10 01:54
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10F39/00; H10F39/10; H10F39/12; H10F39/15; H10F39/80; H10F39/804; H10W; H10W90/00

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 164 words
A multi-chip type image sensor comprising: a base; a plurality of sensor chips arranged into a line on said base, said sensor chips being fastened to said base by a die bonding process in which a first adhesive is used, each of sensor chips comprising silicon and a plurality of light receiving elements arranged into a line at a predetermined pitch; a glass plate mounted on said sensor chips so as to cover said light receiving elements, said glass plate being fastened to said sensor chips by a second adhesive which hardens at a temperature lower than a curing temperature of said first adhesive; and terminal pins supported on said base and electrically coupled to said sensor chips, the following condition being satisfied: |α.sub. -α.sub. |<|α.sub. -α.sub. | where α 1 is a thermal expansion coefficient of said base, α 2 is a thermal expansion coefficient of each of said sensor chips, and α 3 is a thermal expansion coefficient of said glass plate.
Claim 2
Dependent Claim 164 words
A multi-chip type image sensor comprising: a base; a plurality of sensor chips arranged into a line on said base, said sensor chips being fastened to said base by a die bonding process in which a first adhesive is used, each of sensor chips comprising silicon and a plurality of light receiving elements arranged into a line at a predetermined pitch; a glass plate mounted on said sensor chips so as to cover said light receiving elements, said glass plate being fastened to said sensor chips by a second adhesive which hardens at a temperature lower than a curing temperature of said first adhesive; and terminal pins supported on said base and electrically coupled to said sensor chips, the following condition being satisfied: |α.sub. -α.sub. |<|α.sub. -α.sub. | where α 1 is a thermal expansion coefficient of said base, α 2 is a thermal expansion coefficient of each of said sensor chips, and α 3 is a thermal expansion coefficient of said glass plate.
Claim 3
Dependent Claim 31 words
A multi-chip type image sensor as claimed in claim 1, wherein said first adhesive is a heat curing type adhesive and said second adhesive is a room temperature hardening type adhesive.
Claim 4
Dependent Claim 24 words
A multi-chip type image sensor as claimed in claim 1, wherein said second adhesive is optically transparent and said first adhesive is electrically conductive.
Claim 5
Dependent Claim 20 words
A multi-chip type image sensor as claimed in claim 1, wherein said second adhesive is an ultraviolet hardening type adhesive.
Claim 6
Dependent Claim 23 words
A multi-chip type image sensor as claimed in claim 1, wherein said glass plate is a Na 2 O--CaO--SiO 2 -based glass plate.
Claim 7
Dependent Claim 35 words
A multi-chip type image sensor as claimed in claim 1, further comprising a spacer provided on said base, and a second transparent glass plate mounted on said spacer so as to cover said sensor chips.
Claim 8
Dependent Claim 34 words
A multi-chip type image sensor as claimed in claim 1, further comprising a spacer provided on said base, wherein said glass plate is mounted on not only said sensor chips but also said spacer.

References Cited (Backward Citations)

US3283401A Cited
US4523102A Cited
US4914311A Cited
US4987295A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-11-04 1995-05-06 1995-11-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-11-04 1999-05-06 1999-11-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-11-04 2003-05-06 2003-11-05 $7700.00 Window Closed / Lapsed

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