Shielded enclosure for housing electronic components and manufacturing method thereof

Claim 1

An EMI shielded structure for housing electronic parts or equipment comprising: an enclosure comprising a substantially planar plate area having a first edge and at least one side wall extending substantially orthogonally to said plate area from said first edge; said enclosure having a second edge forming an outer edge of said enclosure, said enclosure being made substantially of a molded resin; an electromagnetic interference shield member comprising at least one of a thin, flexible wire netting or a metal foil having a plurality of small holes; said electromagnetic interference shield member being disposed within said enclosure resin; said electromagnetic interference shield member being slanted at said second edge of said at least one side wall of said enclosure; said slanted portion of said electromagnetic interference shield beginning at an inner edge formed from the intersection of said side wall and said plate area of said enclosure; and said slanted portion of said electromagnetic interference shield member extending from and being exposed at said second edge of said side wall of said enclosure.

Claim 6

A method of manufacturing an enclosure for housing electronic parts or equipment, consisting of a box or a cover having a planar surface and sides with an exposed side edge and being molded by resin, using a fixed and a moveable die, comprising the steps of: setting a pre-cut, planar plate-shaped electromagnetic interference shield member in a position to face said fixed die, said electromagnetic interference shield member being made of a thin, flexible wire netting or a metal foil having a plurality of small holes disposed on substantially all surfaces of said enclosure, and having an area large enough to leave an excess amount of member exposed from the edges of the enclosure after the molding of the enclosure; shaping said electromagnetic interference shield member while closing said movable die in the direction of said fixed die; injecting a molding resin material into a space formed by said fixed die and said movable die after the start of said die closing to cause part of said molding resin material to penetrate toward said movable die through the holes of said electromagnetic interference shield member; moving said movable die to a final die closing position for pressing said electromagnetic interference shield member and resin material into the desired shape of said enclosure while leaving an excess amount of shield member at said exposed edge or said enclosure; and curing said shaped enclosure.

Claim 7

A method of manufacturing an enclosure for housing electronic parts or equipment, consisting of a box or a cover having a planar surface and sides with an exposed side edge and being molded by resin, using a fixed and a moveable die, comprising the steps of: setting a pre-cut, planar plate-shaped electromagnetic interference shield member in a position to face said fixed die, said electromagnetic interference shield member being made of a thin, flexible wire netting or a metal foil having a plurality of small holes disposed on substantially all surfaces of said enclosure, and having an area large enough to leave an excess amount of member exposed from the edges of the enclosure after the molding of the enclosure; shaping said electromagnetic interference shield member while closing said movable die in the direction of said fixed die; injecting a molding resin material into a space formed by said fixed die and said movable die after the start of said die closing to cause part of said molding resin material to penetrate toward said movable die through the holes of said electromagnetic interference shield member; moving said movable die to a final die closing position for pressing said electromagnetic interference shield member and resin material into the desired shape of said enclosure while leaving an excess amount of shield member at said exposed edge or said enclosure; and curing said shaped enclosure.

Claim 9

A method of manufacturing an EMI protected enclosure consisting of a box or a cover molded by resin for housing electronic parts or equipment, comprising the steps of: setting a pre-cut, planar plate-shaped electromagnetic interference shield member in a position to face a fixed die, said electromagnetic interference shield member being made of a thin, flexible wire netting or a metal foil having a plurality of small holes, being disposed on substantially all surfaces of said enclosure, and having an area large enough to be exposed from the edges of the enclosure after the molding of the enclosure; shaping and securing said electromagnetic interference shield member by closing said movable die in the direction of said fixed die; injecting a molding resin material into a molding space formed by said fixed die and said movable die after said shaping and securing by the die closing, a portion of said material being injected through said secured shield member to completely fill said molding space; and curing said molded resin material.

Claim 10

A method of manufacturing an EMI protected enclosure consisting of a box or a cover molded by resin for housing electronic parts or equipment, comprising the steps of: setting a pre-cut, planar plate-shaped electromagnetic interference shield member in a position to face a fixed die, said electromagnetic interference shield member being made of a thin, flexible wire netting or a metal foil having a plurality of small holes, being disposed on substantially all surfaces of said enclosure, and having an area large enough to be exposed from the edges of the enclosure after the molding of the enclosure; shaping and securing said electromagnetic interference shield member by closing said movable die in the direction of said fixed die; injecting a molding resin material into a molding space formed by said fixed die and said movable die after said shaping and securing by the die closing, a portion of said material being injected through said secured shield member to completely fill said molding space; and curing said molded resin material.

Claim 12

A method of manufacturing an EMI protected enclosure consisting of a box or a cover molded by resin for housing electronic parts or equipment, an electromagnetic interference shield member existing inside the resin, wherein said electromagnetic interference shield member is made of a thin, flexible wire netting or a metal foil having a plurality of small holes, comprising: setting said shield member between moveable and fixed parts of a mold die, in a pre-cut, planar plate-shaped state; at least partially shaping said member by said movable die and a fixed die by closing said mold die; and injecting a curable plastic material into said mold die through and around said shield member.

Claim 13

A method of manufacturing an EMI protected enclosure consisting of a box or a cover molded by resin for housing electronic parts or equipment, an electromagnetic interference shield member existing inside the resin, wherein said electromagnetic interference shield member is made of a thin, flexible wire netting or a metal foil having a plurality of small holes, comprising: setting said shield member between moveable and fixed parts of a mold die, in a pre-cut, planar plate-shaped state; at least partially shaping said member by said movable die and a fixed die by closing said mold die; and injecting a curable plastic material into said mold die through and around said shield member.

Claim 14

A method of manufacturing an EMI protected enclosure for housing electronic parts or equipment, consisting of a box or a cover made of resin and containing within the resin an electromagnetic interference shield member and being molded by using a core die and a cavity die each of which has a respective outer periphery and which together define a mold volume having the shape of said enclosure, comprising the steps of: setting a pre-cut, planar plate-shaped electromagnetic interference shield member in a position between said core die and said cavity die, said member having an area large enough to be exposed from the edges of the enclosure after the molding of the enclosure; and closing said core are and cavity die whereby said electromagnetic interference shield member extends out of a gap between the outer periphery of said cavity die and the outer periphery of said core die to the outside of said mold volume.

Claim 15

A method of manufacturing an EMI protected enclosure for housing electronic parts or equipment, consisting of a box or a cover made of resin and containing within the resin an electromagnetic interference shield member and being molded by using a core die and a cavity die each of which has a respective outer periphery and which together define a mold volume having the shape of said enclosure, comprising the steps of: setting a pre-cut, planar plate-shaped electromagnetic interference shield member in a position between said core die and said cavity die, said member having an area large enough to be exposed from the edges of the enclosure after the molding of the enclosure; and closing said core are and cavity die whereby said electromagnetic interference shield member extends out of a gap between the outer periphery of said cavity die and the outer periphery of said core die to the outside of said mold volume.