Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
121 words
A method for setting a resistance value of a resistor, comprising the steps of: providing a substrate having a major surface; forming a heating element on the major surface; forming an isolation layer over the heating element; forming the resistor on the isolation layer, wherein a portion of the isolation layer is sandwiched between the resistor and the heating element; providing a current which flows through the heating element, wherein heat is generated in response to the current flowing through the heating element; and annealing the resistor to set the resistance value of the resistor using the heat generated by the current flowing through the heating element, wherein the resistance value of the resistor remains set after removal of the heat.
Claim 2
Independent Claim
121 words
A method for setting a resistance value of a resistor, comprising the steps of: providing a substrate having a major surface; forming a heating element on the major surface; forming an isolation layer over the heating element; forming the resistor on the isolation layer, wherein a portion of the isolation layer is sandwiched between the resistor and the heating element; providing a current which flows through the heating element, wherein heat is generated in response to the current flowing through the heating element; and annealing the resistor to set the resistance value of the resistor using the heat generated by the current flowing through the heating element, wherein the resistance value of the resistor remains set after removal of the heat.
Claim 3
Dependent Claim
45 words
A method of setting a resistance value of a resistor as claimed in claim 1, wherein the step of forming a heating element includes providing a semiconductor material on the major surface and doping a portion of the semiconductor material to form the heating element.
Claim 4
Dependent Claim
48 words
A method of setting a resistance value of a resistor as claimed in claim 1, wherein the step of forming an isolation layer further comprises: forming a layer of dielectric material on the heating element; and forming a layer of semiconductor material on the layer of dielectric material.
Claim 5
Dependent Claim
31 words
A method of setting a resistance value of a resistor as claimed in claim 1, wherein the step of annealing the resistor comprises applying a current pulse through the heating element.
Claim 6
Dependent Claim
50 words
A method of setting a resistance value of a resistor as claimed in claim 4, wherein applying a current pulse comprises the steps of: sending at least one current pulse through the heating element; and monitoring a voltage value between a first contact and a second contact of the resistor.
Claim 7
Dependent Claim
41 words
A method of setting a resistance value of a resistor as claimed in claim 1, further including forming a first electrode which contacts a portion of the resistor and forming a second electrode which contacts a portion of the heating element.
Claim 8
Independent Claim
142 words
A method for adjusting a resistance value of a resistor, comprising the steps of: providing a conductive layer; forming a layer of insulating material on the conductive layer; forming an etch control layer on the layer of insulating material; forming a layer of resistive material on the etch control layer, wherein the etch control layer and the layer of resistive material cooperate to form the resistor; forming an electrical contact to the layer of resistive material; providing a current which flows through the conductive layer, wherein heat is generated in response to the current flowing through the conductive layer; and annealing at least the layer of resistive material to adjust the resistance value of the resistor using the heat generated by the current flowing through the conductive layer, wherein the resistance value of the resistor remains adjusted after removal of the heat.
Claim 9
Independent Claim
142 words
A method for adjusting a resistance value of a resistor, comprising the steps of: providing a conductive layer; forming a layer of insulating material on the conductive layer; forming an etch control layer on the layer of insulating material; forming a layer of resistive material on the etch control layer, wherein the etch control layer and the layer of resistive material cooperate to form the resistor; forming an electrical contact to the layer of resistive material; providing a current which flows through the conductive layer, wherein heat is generated in response to the current flowing through the conductive layer; and annealing at least the layer of resistive material to adjust the resistance value of the resistor using the heat generated by the current flowing through the conductive layer, wherein the resistance value of the resistor remains adjusted after removal of the heat.
Claim 10
Dependent Claim
28 words
A method of adjusting a resistance value of a resistor as claimed in claim 7, wherein the step of providing a conductive layer includes doping the conductive layer.
Claim 11
Dependent Claim
31 words
A method of adjusting a resistance value of a resistor as claimed in claim 7, wherein the step of providing a conductive layer includes providing the conductive layer on a substrate.
Claim 12
Dependent Claim
38 words
A method of adjusting a resistance value of a resistor as, claimed in claim 7, wherein the step of annealing the layer of resistive material changes a resistance value of a portion of the layer of resistive material.
Claim 13
Dependent Claim
34 words
A method of adjusting a resistance value of a resistor as claimed in claim 10, wherein the step of annealing the layer of resistive material includes applying a current pulse through the conductive layer.
Claim 14
Dependent Claim
35 words
A method of adjusting a resistance value of a resistor as claimed in claim 7, wherein the step of forming a layer of resistive material includes forming the layer of resistive material from tungsten silicide.
Claim 15
Independent Claim
138 words
A method for setting a resistance value of a resistor, comprising the steps of: providing a substrate having a major surface; forming a first layer of insulation material on the major surface; forming an annealing element on the first layer of insulation material; forming a second layer of insulation material on the annealing element; forming an etch control layer on the second layer of insulation material; forming a layer of resistive material on the etch control layer; etching a portion of the etch control layer and the layer of resistive material to form a resistor; generating a current, wherein the current flows through the annealing element thereby dissipating heat; and using the heat to anneal the resistor, wherein a resistance value of the resistor is set by annealing the resistor and remains set after removal of the heat.
Claim 16
Independent Claim
138 words
A method for setting a resistance value of a resistor, comprising the steps of: providing a substrate having a major surface; forming a first layer of insulation material on the major surface; forming an annealing element on the first layer of insulation material; forming a second layer of insulation material on the annealing element; forming an etch control layer on the second layer of insulation material; forming a layer of resistive material on the etch control layer; etching a portion of the etch control layer and the layer of resistive material to form a resistor; generating a current, wherein the current flows through the annealing element thereby dissipating heat; and using the heat to anneal the resistor, wherein a resistance value of the resistor is set by annealing the resistor and remains set after removal of the heat.
Claim 17
Dependent Claim
24 words
The method of claim 13, wherein the step of using the heat to anneal the resistor includes using heat of at least 400° C.
Claim 18
Dependent Claim
20 words
The method of claim 13, wherein the step of generating a current includes sending current pulses through the annealing element.
Claim 19
Dependent Claim
80 words
The method of claim 13, further including the steps of: forming a third layer of dielectric material on the layer of resistive material; forming a first opening in a first portion of the third layer of dielectric material, the first opening exposing a first portion of the layer of resistive material; and forming a second opening in a second portion of the third layer of dielectric material, the second opening exposing a second portion of the layer of resistive material.
Claim 20
Dependent Claim
36 words
The method of claim 13, wherein the step of forming a layer of forming an annealing element includes forming a layer of polysilicon on the first layer of dielectric material and doping the layer of polysilicon.