Patent US5465145A successfully refreshed from Google Patents.
US5465145A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor wafer inspection apparatus
Assignee: Renesas Semiconductor Engineering Corp
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Filing: 1994-09-20
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Granted: 1995-11-07
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Expires: 2014-09-20
Abstract
Abstract Disclosed is a semiconductor wafer inspection apparatus which effectively prevents an erroneous identification of small pits as particles on a surface of a sample. In such a semiconductor wafer inspection apparatus, a light collecting portion and a reflection adjustment portion having a light reflectance different from a light reflectance of the light collecting portion are included in light collecting means.
Inventors
- 👤 Yukiko Nakashige
- 👤 Tadashi Nishioka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 09:42
CPC Classifications
G; G01; G01N; G01N21/00; G01N21/84; G01N21/88; G01N21/94; G01N21/95; G01N21/9501; H; H10; H10P; H10P74/00; H10P74/20; H10P74/203
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
92 words
A semiconductor wafer inspection apparatus comprising: light projecting means for directing a beam of light to a main surface of a semiconductor wafer; light collecting means for collecting beams of light scattered from the main surface of said semiconductor wafer; and light receiving means receiving the scattered light collected by said light collecting means for measuring intensity of the scattered light; wherein said light collecting means includes a light collecting portion having a first light reflectance, and a reflection adjustment portion having a second light reflectance different from said first light reflectance.
Claim 2
Dependent Claim
92 words
A semiconductor wafer inspection apparatus comprising: light projecting means for directing a beam of light to a main surface of a semiconductor wafer; light collecting means for collecting beams of light scattered from the main surface of said semiconductor wafer; and light receiving means receiving the scattered light collected by said light collecting means for measuring intensity of the scattered light; wherein said light collecting means includes a light collecting portion having a first light reflectance, and a reflection adjustment portion having a second light reflectance different from said first light reflectance.
Claim 3
Dependent Claim
21 words
The semiconductor wafer inspection apparatus according to claim 1, wherein said second light reflectance is smaller than said first light reflectance.
Claim 4
Dependent Claim
42 words
The semiconductor wafer inspection apparatus according to claim 1, wherein said reflection adjustment portion includes a first reflection adjustment portion having a third light reflectance, and a second reflection adjustment portion having a fourth light reflectance different from said third light reflectance.
Claim 5
Dependent Claim
26 words
The semiconductor wafer inspection apparatus according to claim 3, wherein said first reflection adjustment portion and said second reflection adjustment portion both include a stepped portion.
Claim 6
Dependent Claim
23 words
The semiconductor wafer inspection apparatus according to claim 1, wherein said reflection adjustment portion includes a liquid crystal having a dynamic scattering mode.
Claim 7
Dependent Claim
27 words
The semiconductor wafer inspection apparatus according to claim 5, wherein said liquid crystal has a thickness which changes continuously in accordance with an angle of light scattering.
Claim 8
Dependent Claim
33 words
The semiconductor wafer inspection apparatus according to claim 1, wherein said reflection adjustment portion is set in such a scattering angle range that the scattered light having a large intensity of scattering enters.
Claim 9
Dependent Claim
25 words
The semiconductor wafer inspection apparatus according to claim 1, wherein said light collecting portion and said reflection adjustment portion has the same ellipsoid of revolution.
Claim 10
Dependent Claim
48 words
The semiconductor wafer inspection apparatus according to claim 1, wherein said light collecting portion includes a base material of the light collecting portion and a light collecting film, and wherein said reflection adjustment portion includes a base material of the reflection adjustment portion and a reflection adjustment film.
Claim 11
Dependent Claim
136 words
A semiconductor wafer inspection apparatus comprising: light projecting means for directing a beam of light to a main surface of a semiconductor wafer; light collecting means including a light collecting portion having a first light reflectance and a reflection adjustment portion made of a liquid crystal having a second light reflectance different from said first light reflectance, for collecting beams of light scattered from the main surface of said semiconductor wafer; light receiving means receiving the scattered light collected by said light collecting means for measuring intensity of said scattered light; reference light detecting means for detecting a reference light transmitted through the liquid crystal of said reflection adjustment portion; and light reflectance control means for controlling the light reflectance of said reflection adjustment portion according to a detection output of said reference light detecting means.
Claim 12
Dependent Claim
136 words
A semiconductor wafer inspection apparatus comprising: light projecting means for directing a beam of light to a main surface of a semiconductor wafer; light collecting means including a light collecting portion having a first light reflectance and a reflection adjustment portion made of a liquid crystal having a second light reflectance different from said first light reflectance, for collecting beams of light scattered from the main surface of said semiconductor wafer; light receiving means receiving the scattered light collected by said light collecting means for measuring intensity of said scattered light; reference light detecting means for detecting a reference light transmitted through the liquid crystal of said reflection adjustment portion; and light reflectance control means for controlling the light reflectance of said reflection adjustment portion according to a detection output of said reference light detecting means.
Claim 13
Dependent Claim
24 words
A semiconductor wafer inspection apparatus according to claim 10, wherein said reference light detecting means includes a light collecting lens and an optical detector.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-11-06 | 1999-05-08 | 1999-11-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-11-06 | 2003-05-08 | 2003-11-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-11-06 | 2007-05-08 | 2007-11-07 | $7700.00 | Window Closed / Lapsed |