US5465008A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic microelectronics package
Assignee: Stratedge Corp
•
Filing: 1993-10-08
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Granted: 1995-11-07
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Expires: 2013-10-08
Abstract
Abstract A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
Inventors
- 👤 Martin Goetz
- 👤 Joseph Babiarz
- 👤 Deborah S. Wein
- 👤 Paul M. Anderson
- 👤 Alan W. Lindner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 03:41
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0438; H10W; H10W44/00; H10W44/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49158
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
152 words
A ceramic microelectronic package suitable for high-frequency electronic devices, comprising: a base having a top and a bottom, at least a portion of each of said top surface and said bottom surface of said base being conductive; a ceramic circuit substrate having a first cavity and a plurality of conductive patterns deposited on a surface of said ceramic circuit substrate; first means for attaching said ceramic circuit substrate to said top of said base; a ceramic seal ring substrate having a second cavity larger than said first cavity; second means for attaching said ceramic seal ring substrate to said ceramic circuit substrate, said second attaching means being non-conductive; a ceramic lid attached to said ceramic seal ring substrate; and third means for attaching said ceramic seal ring to said ceramic lid; wherein said base acts as a single ground plane and said ceramic lid is electrically isolated from said single ground plane.
Claim 2
Dependent Claim
152 words
A ceramic microelectronic package suitable for high-frequency electronic devices, comprising: a base having a top and a bottom, at least a portion of each of said top surface and said bottom surface of said base being conductive; a ceramic circuit substrate having a first cavity and a plurality of conductive patterns deposited on a surface of said ceramic circuit substrate; first means for attaching said ceramic circuit substrate to said top of said base; a ceramic seal ring substrate having a second cavity larger than said first cavity; second means for attaching said ceramic seal ring substrate to said ceramic circuit substrate, said second attaching means being non-conductive; a ceramic lid attached to said ceramic seal ring substrate; and third means for attaching said ceramic seal ring to said ceramic lid; wherein said base acts as a single ground plane and said ceramic lid is electrically isolated from said single ground plane.
Claim 3
Dependent Claim
15 words
The ceramic microelectronic package recited in claim 1 wherein the base comprises a conductive metal.
Claim 4
Dependent Claim
19 words
The ceramic microelectronic package recited in claim 1 wherein the base comprises a ceramic material and is partially metalized.
Claim 5
Dependent Claim
18 words
The ceramic microelectronic package recited in claim 2 wherein the first attaching means comprises a metal solder material.
Claim 6
Dependent Claim
27 words
The ceramic microelectronic package recited in claim 3 wherein the top of the base is metalized and wherein said first attaching means comprises a metal solder material.
Claim 7
Dependent Claim
17 words
The ceramic microelectronic package recited in claim 3 wherein said first attaching means comprises a glass material.
Claim 8
Dependent Claim
48 words
The ceramic microelectronic package recited in claim I wherein the ceramic circuit substrate has a top and a bottom surface, said top surface being attached to the ceramic seal ring substrate wherein a plurality of conductive patterns are deposited on said top surface of the ceramic RF substrate.
Claim 9
Dependent Claim
51 words
The ceramic microelectronic package recited in claim 1 wherein the second attaching means comprises at least one of a first glass material and a second glass material, said first glass material being applied to the ceramic circuit substrate and said second glass material being applied to the ceramic seal ring substrate.
Claim 10
Dependent Claim
35 words
The ceramic microelectronic package recited in claim 7 wherein the ceramic seal ring substrate is formed such that the plurality of conductive patterns deposited on the top surface of the ceramic circuit substrate are exposed.
Claim 11
Dependent Claim
18 words
The ceramic microelectronic package recited in claim 1 wherein the third attaching means is a non-conductive polymer adhesive.
Claim 12
Dependent Claim
17 words
The ceramic microelectronic package recited in claim I wherein the third attaching means is a glass material.
Claim 13
Dependent Claim
207 words
A ceramic microelectronic package for enclosing a high-frequency electronic device, said microelectronic package comprising: a ceramic lid having a top surface and a bottom surface; a ceramic seal ring substrate having a top surface and a bottom surface, said ceramic seal ring having a first cavity therein; a non-conductive first attaching means for attaching the bottom surface of the ceramic lid to the top surface of the ceramic seal ring; a ceramic circuit substrate having a top surface, a bottom surface and a second cavity therein, said second cavity being smaller than said first cavity and larger than the high-frequency electronic device and a plurality of conductive patterns disposed in the top surface of the ceramic circuit substrate; a non-conductive second attaching means for attaching the bottom surface of said ceramic seal ring to the top surface of said ceramic circuit substrate; a base having a top surface and a bottom surface, at least a portion of each of said top surface and said bottom surface being conductive, said base forming a single ground plane; and a third attaching means for attaching the bottom surface of said ceramic circuit substrate to the top surface of said base; wherein said base is electrically isolated from said ceramic lid.
Claim 14
Dependent Claim
207 words
A ceramic microelectronic package for enclosing a high-frequency electronic device, said microelectronic package comprising: a ceramic lid having a top surface and a bottom surface; a ceramic seal ring substrate having a top surface and a bottom surface, said ceramic seal ring having a first cavity therein; a non-conductive first attaching means for attaching the bottom surface of the ceramic lid to the top surface of the ceramic seal ring; a ceramic circuit substrate having a top surface, a bottom surface and a second cavity therein, said second cavity being smaller than said first cavity and larger than the high-frequency electronic device and a plurality of conductive patterns disposed in the top surface of the ceramic circuit substrate; a non-conductive second attaching means for attaching the bottom surface of said ceramic seal ring to the top surface of said ceramic circuit substrate; a base having a top surface and a bottom surface, at least a portion of each of said top surface and said bottom surface being conductive, said base forming a single ground plane; and a third attaching means for attaching the bottom surface of said ceramic circuit substrate to the top surface of said base; wherein said base is electrically isolated from said ceramic lid.
Claim 15
Dependent Claim
15 words
The ceramic microelectronic package of claim 12 wherein said bases is formed from conductive metal.
Claim 16
Dependent Claim
17 words
The ceramic microelectronic package of claim 12 wherein said third attaching means is a metal solder material.
Claim 17
Dependent Claim
18 words
The ceramic microelectronic package of claim 12 wherein said base comprises a ceramic material which is partially metalized.
Claim 18
Dependent Claim
16 words
The ceramic microelectronic package of claim 15 wherein said third attaching means is a glass material.
Claim 19
Dependent Claim
16 words
The ceramic microelectronic package of claim 12 wherein said second attaching means is a glass material.
Claim 20
Dependent Claim
15 words
The ceramic microelectronic package of claim 12 wherein said first attaching means is polymer adhesive.
Claim 21
Dependent Claim
16 words
The ceramic microelectronic package of claim 12 wherein said first attaching means is a glass material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-11-06 | 1999-05-08 | 1999-11-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-11-06 | 2003-05-08 | 2003-11-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-11-06 | 2007-05-08 | 2007-11-07 | $7700.00 | Window Closed / Lapsed |