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US5464984A Expired / Lapsed US ⏱️ 0.0 years remaining

X-ray imaging system and solid state detector therefor

Assignee: General Imaging Corp
•
Filing: 1995-01-09
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Granted: 1995-11-07
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Expires: 2015-01-09
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Abstract

Abstract An x-ray detector includes a scintillator, a sensor array, processing circuits, and a ceramic layer. The ceramic layer overlays the processing circuits. The pixel architecture of the detector utilizes a technique similar to a CCD array to shift data from the array. The detector preferably utilizes 4-side abuttable sensor arrays having imbedded shift registers and bond pads superimposed over the pixel array in the upper metallization layers of the sensor. An alternative embodiment incorporates a silicon-on-insulator substrate to produce a monolithic large area substrate and a contiguous uninterrupted pixel array over the entire imaging surface.

Inventors

  • 👤 John D. Cox
  • 👤 Donald W. Williams

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 20:21
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/80; H10F39/803; G; G01; G01T; G01T1/00; G01T1/29; G01T1/2914; G01T1/2921; G01T1/2928; H04; H04N; H04N23/00; H04N23/30; H04N25/00; H04N25/70; H04N25/76; H04N25/77; H10F39/10; H10F39/12; H10F39/18; H10F39/189; H10F39/1898; H10F39/804

Claims Analysis

Total Claims: 29
Claim 1
Independent Claim 167 words
An x-ray imaging sensor, comprising: a scintillator layer for converting impinging x-rays into visible light; a plurality of sensor tiles, each of said sensor tiles having an array of sensors for receiving visible light from said scintillator layer and converting said visible light into an electrical signal; a plurality of substrates for supporting, respectively, said plurality of sensor tiles; a plurality of processor arrays connected, respectively, to said plurality of substrates for processing signals from said sensor tiles, each of said substrates being larger than the sensor tile to which it is connected and having a periphery which extends beyond the periphery of the sensor tile to which it is connected, and a metallization layer on each of the substrates, said metallization layer providing an electrical connection to said processors; and a backplane having openings for receiving said processor arrays, said substrates extending beyond said openings to be supported by said backplane, said backplane having a metallization layer for connecting to the metallization layers on the substrates.
Claim 2
Dependent Claim 167 words
An x-ray imaging sensor, comprising: a scintillator layer for converting impinging x-rays into visible light; a plurality of sensor tiles, each of said sensor tiles having an array of sensors for receiving visible light from said scintillator layer and converting said visible light into an electrical signal; a plurality of substrates for supporting, respectively, said plurality of sensor tiles; a plurality of processor arrays connected, respectively, to said plurality of substrates for processing signals from said sensor tiles, each of said substrates being larger than the sensor tile to which it is connected and having a periphery which extends beyond the periphery of the sensor tile to which it is connected, and a metallization layer on each of the substrates, said metallization layer providing an electrical connection to said processors; and a backplane having openings for receiving said processor arrays, said substrates extending beyond said openings to be supported by said backplane, said backplane having a metallization layer for connecting to the metallization layers on the substrates.
Claim 3
Dependent Claim 29 words
An apparatus as claimed in claim 1 wherein said scintillator layer comprises a single large-area scintillator covering all of said plurality of sensor tiles of said x-ray imaging sensor.
Claim 4
Dependent Claim 29 words
An apparatus as claimed in claim 2 wherein said single large-area scintillator illuminates said plurality of sensor tiles through a thinned epitaxial layer of each said array of sensors.
Claim 5
Dependent Claim 55 words
An apparatus as claimed in claim 1 wherein the sensor tiles are mounted on one side of the substrates and the processor arrays are mounted on an opposite side of said substrates, and wherein each substrate has conductive vias for connecting the sensor tile mounted on that substrate to the processor array on that substrate.
Claim 6
Dependent Claim 17 words
An apparatus as claimed in claim 1 wherein said plurality of processor arrays are ASIC processor arrays.
Claim 7
Dependent Claim 22 words
An apparatus as claimed in claim 1 wherein said plurality of sensor tiles are arranged in a mosaic pattern on said backplane.
Claim 8
Dependent Claim 15 words
An apparatus as claimed in claim 1 wherein said plurality of sensor tiles are removable.
Claim 9
Dependent Claim 22 words
An apparatus as claimed in claim 1 wherein said backplane is connected to a printed circuit board backplane by an edge connector.
Claim 10
Dependent Claim 20 words
An apparatus as claimed in claim 8 wherein said printed circuit board backplane further includes analog-to-digital converters and frame buffers.
Claim 11
Dependent Claim 22 words
An apparatus as claimed in claim 1 further including a mechanical housing unit for providing mechanical support for said x-ray imaging sensor.
Claim 12
Dependent Claim 35 words
An apparatus as claimed in claim 10 wherein said mechanical housing unit contains fittings to allow coolant to flow through said mechanical housing unit to cool said plurality processor arrays and said x-ray imaging sensor.
Claim 13
Dependent Claim 24 words
An apparatus as claimed in claim 10 wherein said mechanical housing unit is hermetically sealed to prevent moisture from damaging said x-ray imaging sensor.
Claim 14
Dependent Claim 24 words
An apparatus as claimed in claim 1 wherein said metallization layer of said backplane terminates in an array of bond pads on said backplane.
Claim 15
Dependent Claim 25 words
An apparatus as claimed in claim 13 wherein said array of bond pads is attached to pins, said pins being connected to a ribbon cable.
Claim 16
Dependent Claim 34 words
An apparatus as claimed in claim 13 wherein said array of bond pads is attached to pins, said pins being connected to laminated conductors, said laminated conductors being connected to a data processing unit.
Claim 17
Dependent Claim 34 words
An apparatus as claimed in claim 13 wherein said array of bond pads is attached to pins, said pins being connected to TAB bonding, said TAB bonding being connected to a data processing unit.
Claim 18
Dependent Claim 48 words
An apparatus as claimed in claim 4 wherein each of said sensor tiles has an array of bond pads connected to said conductive vias by an epoxy preform having epoxy conductors, said epoxy conductors having a pattern for connecting said array of bond pads to said conductive vias.
Claim 19
Dependent Claim 24 words
An apparatus as claimed in claim 1 wherein said scintillator layer comprises a plurality of scintillators attached, respectively, to said plurality of sensor tiles.
Claim 20
Dependent Claim 73 words
An x-ray imaging sensor, comprising: a scintillator for converting impinging x-rays into visible light; a monolithic silicon-on-insulator substrate having a transparent insulator layer and a silicon detector layer for detecting visible light and producing electrical signals in response thereto; a plurality of processor arrays connected to said monolithic silicon-on-insulator substrate for processing signals from said silicon detector layer; and a backplane having conductive vias for connecting said backplane to said silicon detector layer.
Claim 21
Dependent Claim 73 words
An x-ray imaging sensor, comprising: a scintillator for converting impinging x-rays into visible light; a monolithic silicon-on-insulator substrate having a transparent insulator layer and a silicon detector layer for detecting visible light and producing electrical signals in response thereto; a plurality of processor arrays connected to said monolithic silicon-on-insulator substrate for processing signals from said silicon detector layer; and a backplane having conductive vias for connecting said backplane to said silicon detector layer.
Claim 22
Dependent Claim 22 words
An apparatus as claimed in claim 19 wherein said silicon detector layer is connected to said backplane conductive vias by an epoxy.
Claim 23
Dependent Claim 20 words
An apparatus as claimed in claim 19 wherein said silicon detector layer has a thickness no greater than 100 microns.
Claim 24
Dependent Claim 19 words
An apparatus as claimed in claim 19 wherein said insulator layer has a thickness no greater than 50 microns.
Claim 25
Dependent Claim 17 words
An apparatus as claimed in claim 19 wherein said insulator layer is doped with a scintillating phosphor.
Claim 26
Dependent Claim 22 words
An apparatus as claimed in claim 19 further including a mechanical housing unit for providing mechanical support for said x-ray imaging sensor.
Claim 27
Dependent Claim 36 words
An apparatus as claimed in claim 24 wherein said mechanical housing unit has a thin window made of low Z metal for allowing x-rays to penetrate said thin window and for protecting said x-ray imaging sensor.
Claim 28
Dependent Claim 30 words
An apparatus as claimed in claim 24 wherein said mechanical housing unit contains fittings to allow coolant to flow through said mechanical housing unit to cool said x-ray imaging sensor.
Claim 29
Dependent Claim 24 words
An apparatus as claimed in claim 24 wherein said mechanical housing unit is hermetically sealed to prevent moisture from damaging said x-ray imaging sensor.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-11-06 1999-05-08 1999-11-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-11-06 2003-05-08 2003-11-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-11-06 2007-05-08 2007-11-07 $7700.00 Window Closed / Lapsed

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