Patent US5461202A successfully refreshed from Google Patents.
US5461202A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible wiring board and its fabrication method
Assignee: Panasonic Holdings Corp
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Filing: 1993-10-05
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Granted: 1995-10-24
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Expires: 2013-10-05
Abstract
Abstract A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on thed printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.
Inventors
- 👤 Naoki Sera
- 👤 Toshiharu Fukui
- 👤 Kouji Tanabe
- 👤 Futoshi Matsui
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:53
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; H05K1/00; H05K1/18; H05K1/189; H05K3/0058; H05K3/0064; H05K3/22; H05K3/24; H05K3/245; H05K3/28; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/03; H05K1/0393; H05K1/09; H05K1/092; H05K1/095; H05K1/11; H05K1/118; H05K1/181; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/035; H05K2201/04; H05K2201/048; H05K2201/05; H05K2201/055; H05K2201/056; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/20; H05K2201/2009; H05K2203/00; H05K2203/16; H05K2203/166; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K3/366; H05K3/38; H05K3/386; H05K3/40; H05K3/42; H05K3/425; H05K3/428; H05K3/46; H05K3/4685; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
66 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulating film, a metallic layer formed on said printed conductive circuit layer, said metallic layer having lands, and an insulating layer formed on said metallic layer, said insulating layer having openings exposing the lands.
Claim 2
Dependent Claim
66 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulating film, a metallic layer formed on said printed conductive circuit layer, said metallic layer having lands, and an insulating layer formed on said metallic layer, said insulating layer having openings exposing the lands.
Claim 3
Dependent Claim
78 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulating film, a metallic layer formed on the printed conductive circuit layer, said metallic layer having lands; an insulating layer formed on said metallic layer said insulating having openings exposing said lands, and a copper laminated polyimide board disposed in connection with said lands for soldering.
Claim 4
Dependent Claim
78 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulating film, a metallic layer formed on the printed conductive circuit layer, said metallic layer having lands; an insulating layer formed on said metallic layer said insulating having openings exposing said lands, and a copper laminated polyimide board disposed in connection with said lands for soldering.
Claim 5
Dependent Claim
83 words
A flexible wiring board comprising: an insulating film having a curved portion and at least one principal surface; a printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulating film, a first insulating layer formed on at least the curved portion of said insulating film covered by said printed conductive circuit layer, a metallic layer formed on said printed conductive circuit layer, and a second insulating layer formed on specified areas of said metallic layer.
Claim 6
Dependent Claim
83 words
A flexible wiring board comprising: an insulating film having a curved portion and at least one principal surface; a printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulating film, a first insulating layer formed on at least the curved portion of said insulating film covered by said printed conductive circuit layer, a metallic layer formed on said printed conductive circuit layer, and a second insulating layer formed on specified areas of said metallic layer.
Claim 7
Dependent Claim
105 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulting film said conductive circuit layer having at least one cavity exposing said insulating film, a metallic layer formed on said printed conductive circuit layer, said metallic layer exposing said cavity and having one or more connecting terminals, an insulating layer formed on said metallic layer, said insulating layer having openings exposing said connecting terminals and said cavity, and a reinforcement plate disposed on a portion of a surface of said insulating film.
Claim 8
Dependent Claim
105 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulting film said conductive circuit layer having at least one cavity exposing said insulating film, a metallic layer formed on said printed conductive circuit layer, said metallic layer exposing said cavity and having one or more connecting terminals, an insulating layer formed on said metallic layer, said insulating layer having openings exposing said connecting terminals and said cavity, and a reinforcement plate disposed on a portion of a surface of said insulating film.
Claim 9
Dependent Claim
18 words
The flexible wiring board according to claim 4, wherein said reinforcement plate is formed of a solderable material.
Claim 10
Dependent Claim
79 words
A flexible wiring board comprising: an insulating film having at least one principal surface a conductive layer formed at specified areas on said at least one principal surface of said insulating film for shielding; a first insulating layer formed on said conductive layer, a printed conductive circuit layer formed on said first insulating layer, a metallic layer formed at specified areas on said printed conductive circuit layer, and a second insulating layer formed on at least said metallic layer.
Claim 11
Dependent Claim
79 words
A flexible wiring board comprising: an insulating film having at least one principal surface a conductive layer formed at specified areas on said at least one principal surface of said insulating film for shielding; a first insulating layer formed on said conductive layer, a printed conductive circuit layer formed on said first insulating layer, a metallic layer formed at specified areas on said printed conductive circuit layer, and a second insulating layer formed on at least said metallic layer.
Claim 12
Dependent Claim
65 words
A flexible wiring board comprising; an insulating film having a first and a second principal surface; a printed conductive circuit layer formed at specified places on said first principal surface of said insulating film, a metallic layer formed on said printed conductive circuit layer, an insulating layer formed on specified areas on said metallic layer, and a conductive layer formed on said second principal surface.
Claim 13
Dependent Claim
65 words
A flexible wiring board comprising; an insulating film having a first and a second principal surface; a printed conductive circuit layer formed at specified places on said first principal surface of said insulating film, a metallic layer formed on said printed conductive circuit layer, an insulating layer formed on specified areas on said metallic layer, and a conductive layer formed on said second principal surface.
Claim 14
Dependent Claim
81 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a printed conductive circuit layer formed at specified places on said at least one principal surface of said insulating film, a metallic layer formed on said printed conductive circuit layer, a first insulating layer formed at specified places on said insulating film and said metallic layer, a conductive layer formed on said first insulating layer for shielding, and a second insulating layer formed on said conductive layer.
Claim 15
Dependent Claim
81 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a printed conductive circuit layer formed at specified places on said at least one principal surface of said insulating film, a metallic layer formed on said printed conductive circuit layer, a first insulating layer formed at specified places on said insulating film and said metallic layer, a conductive layer formed on said first insulating layer for shielding, and a second insulating layer formed on said conductive layer.
Claim 16
Dependent Claim
53 words
A flexible wiring board according to claim 1, further comprising: a second printed conductive circuit layer formed at specified places on a second principal surface of said insulating film, a second metallic layer formed on said printed conductive circuit layer, and a second insulating layer formed at specified places on said metallic layer.
Claim 17
Dependent Claim
59 words
A flexible wiring board having: an insulating film having at least one principal surface; a conductive circuit layer formed at specified areas on said at least one principal surface; an insulating layer formed on said conductive circuit layer; and an adhesive material layer disposed at specified areas on said insulating film, said conductive circuit layer and said insulating layer.
Claim 18
Dependent Claim
59 words
A flexible wiring board having: an insulating film having at least one principal surface; a conductive circuit layer formed at specified areas on said at least one principal surface; an insulating layer formed on said conductive circuit layer; and an adhesive material layer disposed at specified areas on said insulating film, said conductive circuit layer and said insulating layer.
Claim 19
Dependent Claim
21 words
The flexible wiring board according to claim 10, wherein a mold release material layer is disposed on said adhesive material layer.
Claim 20
Dependent Claim
118 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a first printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulating film, a first metallic layer formed on said first printed conductive circuit layer, said metallic layer having through-hole lands and external connecting terminals; a first flexible insulating layer formed on said insulating film and on said first metallic layer, said insulating layer having holes exposing said through-hole lands and exposing said external connecting terminals; a second printed conductive circuit layer formed on said insulating layer in connection with said through-hole lands, and a second metallic layer formed on said second printed conductive circuit layer.
Claim 21
Dependent Claim
118 words
A flexible wiring board comprising: an insulating film having at least one principal surface; a first printed conductive circuit layer formed at specified areas on said at least one principal surface of said insulating film, a first metallic layer formed on said first printed conductive circuit layer, said metallic layer having through-hole lands and external connecting terminals; a first flexible insulating layer formed on said insulating film and on said first metallic layer, said insulating layer having holes exposing said through-hole lands and exposing said external connecting terminals; a second printed conductive circuit layer formed on said insulating layer in connection with said through-hole lands, and a second metallic layer formed on said second printed conductive circuit layer.
Claim 22
Dependent Claim
66 words
The flexible wiring board according to claim 12, which comprises: a second insulating layer formed on said second metallic layer, said second insulating layer having openings exposing said through-hole lands and said external connecting terminals, a third printed conductive circuit layer formed on said second insulating layer in connection with said through-hole lands, and a third metallic layer formed on said third printed conductive circuit layer.
Claim 23
Dependent Claim
70 words
A flexible wiring board having: an insulating film having at least one principal surface; a conductive circuit layer formed at specified areas on said at least one principal surface; an insulating layer formed on said conductive circuit layer; an adhesive material layer disposed at specified areas on said insulating film, said conductive circuit layer and said insulating layer; and a mold release material layer disposed on said adhesive material layer.
Claim 24
Dependent Claim
70 words
A flexible wiring board having: an insulating film having at least one principal surface; a conductive circuit layer formed at specified areas on said at least one principal surface; an insulating layer formed on said conductive circuit layer; an adhesive material layer disposed at specified areas on said insulating film, said conductive circuit layer and said insulating layer; and a mold release material layer disposed on said adhesive material layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-23 | 1999-04-24 | 1999-10-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-23 | 2003-04-24 | 2003-10-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-23 | 2007-04-24 | 2007-10-24 | $7700.00 | Window Closed / Lapsed |