Adaptor card with pass-through and non pass-through vias

Claim 2

An adaptor card, comprising: a dielectric structure having a pair of opposing surfaces; and a pass-through via and a non pass-through via, each extending through said structure in a straight line perpendicular to said opposing surfaces, said pass-through via comprises a pass-through socket at one end of said pass-through via and a pass-through plug at the opposite end of said pass-through via, said non pass-through via comprises a non pass-through socket at one end of said non pass-through via and a non pass-through plug at the opposite end of said non pass-through via, wherein said non pass-through plug extends from one of said pair of opposing surfaces a lesser distance than said pass-through plug.

Claim 3

The adaptor card as recited in claim 1, further comprising: a signal converter connected to said dielectric structure and electrically coupled between said pass-through via and said non pass-through via.

Claim 4

The adaptor card as recited in claim 2, wherein said signal converter is adapted for receiving a signal from said pass-through via and for converting said signal and routing said converted signal to said non pass-through via.

Claim 5

The adaptor card as recited in claim 3, wherein said signal comprises a non-critical timing signal.

Claim 6

The adaptor card as recited in claim 3, wherein said signal comprises a steady state voltage level, and said signal converter is adapted for converting said voltage level to a dissimilar voltage level.

Claim 7

The adaptor card as recited in claim 1, wherein said pass-through via and said non passe through via extend through said structure in parallel spaced relation to one another.

Claim 8

The adaptor card as recited in claim 1, wherein said pass-through plug is adapted for mechanical coupling to a printed circuit board and for electrical coupling to a conductor embedded within said board.

Claim 9

The adaptor card as recited in claim 1, wherein said pass-through plug is adapted for mechanical coupling to a printed circuit board and for electrical coupling to a fly wire routed from said board.

Claim 10

The adaptor card as recited in claim 1, wherein the distal end of said non pass-through plug is spaced from a printed circuit board outer surface during times in which said pass-through plug is inserted into said board.

Claim 11

An interconnect structure for adapting a signal sent between a printed circuit board and an integrated circuit comprising: a printed circuit board comprising a plurality of conductors arranged within said board and a plurality of board sockets electrically connected to one end of said conductors; an adaptor card comprising a plurality of pass-through vias and non pass-through vias, wherein said plurality of pass-through vias are mechanically and electrically connected to respective said plurality of board sockets, and wherein said plurality of non pass-through vias are spaced from respective said plurality of board sockets; an integrated circuit comprising a plurality of pins connected to respective said plurality of pass-through and non pass-through vias; and a signal converter configured upon said adaptor card and electrically coupled between at least one of said plurality of pass-through vias and at least one of said plurality of non pass-through vias, wherein said signal converter is adapted for receiving a signal from said pass-through vias and for converting said signal and routing said converted signal to said non pass-through vias.

Claim 12

An interconnect structure for adapting a signal sent between a printed circuit board and an integrated circuit comprising: a printed circuit board comprising a plurality of conductors arranged within said board and a plurality of board sockets electrically connected to one end of said conductors; an adaptor card comprising a plurality of pass-through vias and non pass-through vias, wherein said plurality of pass-through vias are mechanically and electrically connected to respective said plurality of board sockets, and wherein said plurality of non pass-through vias are spaced from respective said plurality of board sockets; an integrated circuit comprising a plurality of pins connected to respective said plurality of pass-through and non pass-through vias; and a signal converter configured upon said adaptor card and electrically coupled between at least one of said plurality of pass-through vias and at least one of said plurality of non pass-through vias, wherein said signal converter is adapted for receiving a signal from said pass-through vias and for converting said signal and routing said converted signal to said non pass-through vias.

Claim 13

The interconnect structure as recited in claim 10, wherein said integrated circuit is hermetically sealed within a pin-grid array package comprising said plurality of pins extending from one surface of said package.

Claim 14

The interconnect structure as recited in claim 10, wherein said pass-through vias and non pass-through vias are configured within openings placed through said adaptor card, whereby said pass-through vias and non pass-through vias extend through said openings in a straight line perpendicular to opposing surfaces of said card.

Claim 15

The interconnect structure as recited in claim 12, wherein said pass-through vias and non pass-through vias are configured within said openings in parallel spaced relation to one another.

Claim 16

The interconnect structure as recited in claim 10, wherein each said pass-through via is in direct alignment between one of said plurality of integrated circuit pins and one of said plurality of board sockets, and wherein each of said non pass-through via is in direct alignment between one of said plurality of integrated circuit pins and a spaced one of said plurality of board sockets.

Claim 17

The interconnect structure as recited in claim 10, wherein at least one of said pass-through vias is adapted for electrical coupling to a conductor embedded within said printed circuit board.

Claim 18

The interconnect structure as recited in claim 10, wherein at least one of said pass-through vias is adapted for electrical coupling to a fly wire routed from said printed circuit board.

Claim 19

The interconnect structure as recited in claim 10, wherein said signal comprises a noncritical timing signal.

Claim 20

The interconnect structure as recited in claim 10, wherein said signal comprises a steady state voltage level, and said signal converter is adapted for converting said voltage level to a dissimilar voltage level.

Claim 21

The interconnect structure as recited in claim 10, wherein said signal comprises a steady state voltage level, and said signal converter comprises a linear regulator placed between a pair of capacitors for converting said voltage level to a lesser voltage level.

Claim 22

An interconnect structure for converting a voltage signal upon a printed conductor within a printed circuit board to a lesser voltage level sent to an integrated circuit, comprising: a printed circuit board comprising a plurality of primed conductors and a plurality of board sockets electrically connected to one end of said conductors, wherein said conductors are adapted to receive a voltage signal; an integrated circuit hermetically sealed within a pin-grid array package comprising a plurality of pins extending from one surface of said package and electrically connected to said integrated circuit; an adaptor card comprising a plurality of openings arranged through opposing surfaces of said card in direct alignment between said board sockets and said integrated circuit pin, wherein said openings are configured to receive pass-through vias and non pass-through vias which extend in parallel spaced relation to each other through said openings in a straight line perpendicular to said opposing surfaces; a select one of said plurality of pass-through vias is coupled between one of said plurality of integrated circuit pins and one of said plurality of board sockets to receive said voltage signal; and a signal converter configured upon said adaptor card and electrically coupled between said select one of the pass-through vias and at least one of said plurality of non pass-through vias, wherein said signal converter is adapted for receiving said voltage signal from said pass-through via and for converting said signal to a lesser voltage level and for routing said converted signal to said non pass-through vias, wherein said non pass-through vias are coupled to respective plurality of integrated circuit pins to complete the connection of said voltage signal and converted voltage signal from said printed conductor to said integrated circuit.

Claim 23

An interconnect structure for converting a voltage signal upon a printed conductor within a printed circuit board to a lesser voltage level sent to an integrated circuit, comprising: a printed circuit board comprising a plurality of primed conductors and a plurality of board sockets electrically connected to one end of said conductors, wherein said conductors are adapted to receive a voltage signal; an integrated circuit hermetically sealed within a pin-grid array package comprising a plurality of pins extending from one surface of said package and electrically connected to said integrated circuit; an adaptor card comprising a plurality of openings arranged through opposing surfaces of said card in direct alignment between said board sockets and said integrated circuit pin, wherein said openings are configured to receive pass-through vias and non pass-through vias which extend in parallel spaced relation to each other through said openings in a straight line perpendicular to said opposing surfaces; a select one of said plurality of pass-through vias is coupled between one of said plurality of integrated circuit pins and one of said plurality of board sockets to receive said voltage signal; and a signal converter configured upon said adaptor card and electrically coupled between said select one of the pass-through vias and at least one of said plurality of non pass-through vias, wherein said signal converter is adapted for receiving said voltage signal from said pass-through via and for converting said signal to a lesser voltage level and for routing said converted signal to said non pass-through vias, wherein said non pass-through vias are coupled to respective plurality of integrated circuit pins to complete the connection of said voltage signal and converted voltage signal from said printed conductor to said integrated circuit.