US5459350A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin sealed type semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1994-10-05
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Granted: 1995-10-17
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Expires: 2014-10-05
Abstract
Abstract A resin sealed semiconductor device includes a current-detecting resistance for detecting current flowing in a semiconductor element that is a metallic resistance having a coefficient of thermal expansion almost equal to that of the lead frame. Compared to a conventional ceramic chip resistance, its coefficient of thermal expansion differs less from that of the lead frame, thereby preventing deterioration caused by heat stress.
Inventors
- 👤 Shoji Date
- 👤 Ziro Honda
- 👤 Toshiya Nakano
- 👤 Hazime Kato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:01
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/481; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/547; H10W72/5473; H10W72/5475; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/921; H10W72/926; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/753; H10W90/756
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
94 words
A resin sealed semiconductor device comprising: a lead frame including a die pad and leads and having a coefficient of thermal expansion; a semiconductor element mounted on said die pad; a controlling semiconductor element for controlling said semiconductor element mounted on said lead frame; a current-detecting resistance for detecting current flowing in said semiconductor element, said current-detecting resistance being mounted on said leads; and a sealing resin encapsulating said lead frame, said semiconductor element, said controlling semiconductor element, and said current-detecting resistance wherein said current-detecting resistance portion of a lead of said lead frame.
Claim 2
Dependent Claim
94 words
A resin sealed semiconductor device comprising: a lead frame including a die pad and leads and having a coefficient of thermal expansion; a semiconductor element mounted on said die pad; a controlling semiconductor element for controlling said semiconductor element mounted on said lead frame; a current-detecting resistance for detecting current flowing in said semiconductor element, said current-detecting resistance being mounted on said leads; and a sealing resin encapsulating said lead frame, said semiconductor element, said controlling semiconductor element, and said current-detecting resistance wherein said current-detecting resistance portion of a lead of said lead frame.
Claim 3
Dependent Claim
19 words
The device of claim 1 wherein said portion of a lead of said lead frame has a concave section.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-16 | 1999-04-17 | 1999-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-16 | 2003-04-17 | 2003-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-16 | 2007-04-17 | 2007-10-17 | $7700.00 | Window Closed / Lapsed |