US5458526A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of slicing a semiconductor wafer and an apparatus
Assignee: Tokyo Seimitsu Co Ltd
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Filing: 1993-05-24
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Granted: 1995-10-17
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Expires: 2013-05-24
Abstract
Abstract The present invention aims at proposing a method of slicing a semiconductor wafer and an apparatus therefor which can manufacture a bowl-shaped wafer. When the blade displacement is detected with the sensor 32, the displacement value of the blade 14 to the outer peripheral edge of the ingot 18 is obtained by the control unit 26. The air pad 30 is moved under controlling the air pressure control device 36 by the control unit 26 to make the blade displacement at the outer peripheral edge zero. As a result of this, the displacement of the wafer at the outer peripheral edge becomes zero, so that a bowl-shaped wafer can be manufactured.
Inventors
- 👤 Shuichi Tsukada
- 👤 Takeshi Doi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 18:23
CPC Classifications
H; H10; H10P; H10P52/00; B; B23; B23D; B23D59/00; B23D59/001; B23D59/002; B28; B28D; B28D5/00; B28D5/02; B28D5/022; B28D5/028
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
154 words
A method of slicing a semiconductor wafer, wherein a cutting edge is mounted on a rotatable spindle, a semiconductor material is pressed on the cutting edge, the cutting edge and the semiconductor material are moved one relative to the other in a manner causing them to come closer together, and the semiconductor material is cut into thin pieces, said method comprising the steps of sensing an axial displacement of the cutting edge by a sensor and cutting the wafer while correcting the displacement by an air pad, characterized in that, for producing a bowl-shaped wafer, said air pad is controlled in such a manner that the displacement value of the cutting edge at the circumferential edge of the wafer to be cut becomes zero from the positional relationship between said sensor and said air pad relative to the circumferential edge of the semiconductor material to be cut, which edge is changeable during the cutting.
Claim 2
Independent Claim
154 words
A method of slicing a semiconductor wafer, wherein a cutting edge is mounted on a rotatable spindle, a semiconductor material is pressed on the cutting edge, the cutting edge and the semiconductor material are moved one relative to the other in a manner causing them to come closer together, and the semiconductor material is cut into thin pieces, said method comprising the steps of sensing an axial displacement of the cutting edge by a sensor and cutting the wafer while correcting the displacement by an air pad, characterized in that, for producing a bowl-shaped wafer, said air pad is controlled in such a manner that the displacement value of the cutting edge at the circumferential edge of the wafer to be cut becomes zero from the positional relationship between said sensor and said air pad relative to the circumferential edge of the semiconductor material to be cut, which edge is changeable during the cutting.
Claim 3
Dependent Claim
75 words
The method of slicing a semiconductor wafer as set forth in claim 1, wherein said air pad is controlled in such a manner that the displacement value of the cutting edge at the circumferential edge of the wafer to be cut becomes zero by the rotational speed control of said cutting edge, the delivery speed control of said semiconductor material and the displacement value control of said cutting edge at the position of said sensor.
Claim 4
Dependent Claim
67 words
The method of slicing a semiconductor wafer as set forth in claim 1, wherein said air pad is controlled in such a manner that the displacement value of the cutting edge at the circumferential edge of the wafer to be cut becomes zero by the delivery speed control of said semiconductor material and the displacement value control of said cutting edge at the position of said sensor.
Claim 5
Dependent Claim
67 words
The method of slicing a semiconductor wafer as set forth in claim 1, wherein said air pad is controlled in such a manner that the displacement value of the cutting edge at the circumferential edge of the wafer to be cut becomes zero by the rotational speed control of said cutting edge and the displacement value control of said cutting edge at the position of said sensor.
Claim 6
Independent Claim
200 words
An apparatus for slicing a semiconductor wafer, wherein a cutting edge is mounted on a rotatable spindle, a semiconductor material is pressed on the cutting edge, the cutting edge and the semiconductor material are moved to relatively one relative to the other in a manner causing them to come closer together, and the semiconductor material is cut into thin pieces, said apparatus comprising a sensor for sensing an axial displacement of the cutting edge by a sensor and an air pad for correcting the displacement, and means for establishing a control relationship between the axial displacement of the blade and a cut-in distance value of the blade relative to the semiconductor material, characterized in that said apparatus further comprises a control system for controlling said air pad in such a manner that the displacement value of the cutting edge at the circumferential edge of the wafer to be cut becomes zero from the positional relationship between said sensor and said air pad relative to the circumferential edge of the semiconductor material to be cut, which edge is changeable during the cutting, based upon the control relationship established by said means for establishing, as a means for producing a bowl-shaped wafer.
Claim 7
Independent Claim
200 words
An apparatus for slicing a semiconductor wafer, wherein a cutting edge is mounted on a rotatable spindle, a semiconductor material is pressed on the cutting edge, the cutting edge and the semiconductor material are moved to relatively one relative to the other in a manner causing them to come closer together, and the semiconductor material is cut into thin pieces, said apparatus comprising a sensor for sensing an axial displacement of the cutting edge by a sensor and an air pad for correcting the displacement, and means for establishing a control relationship between the axial displacement of the blade and a cut-in distance value of the blade relative to the semiconductor material, characterized in that said apparatus further comprises a control system for controlling said air pad in such a manner that the displacement value of the cutting edge at the circumferential edge of the wafer to be cut becomes zero from the positional relationship between said sensor and said air pad relative to the circumferential edge of the semiconductor material to be cut, which edge is changeable during the cutting, based upon the control relationship established by said means for establishing, as a means for producing a bowl-shaped wafer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-16 | 1999-04-17 | 1999-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-16 | 2003-04-17 | 2003-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-16 | 2007-04-17 | 2007-10-17 | $7700.00 | Window Closed / Lapsed |