Method for controlling warpage of blade for slicer

Abstract

Abstract PURPOSE:To reduce cutting allowance and improve cutting speed by holding a blade from both side and controlling warpage thereof. CONSTITUTION:A blade 1 for slicer has the structure of internal circumference blade type and is rotated by a motor at a high speed through a belt 3. Meanwhile, a silicon single crystal 4 to be cut is placed on a support table 5 which can be moved horizontally pitch by pitch and also moved vertically and is then sent to the internal circumferential opening of blade 1. A blade displacement sensor 6 which detects displacement (or warpage) of blade 1 is provided adjacently to the blade 1. A control means 7 which is provided to the one point, or several points or entire part of circumference of both side surfaces of blade 1 generates air flow or magnetic field toward both side surfaces of blade 1 in order to realize forced control of displacement or warpage on the non-contact basis. Thereby, displacement or warpage of blade 1 can be controlled in optimum. Accordingly, the cutting allowance can be reduced and cutting speed can also be improved.

Inventors

• 👤 Ryosaku Chikaoka
• 👤 近岡　良作
• 👤 Hajime Yui
• 👤 肇 油井
• 👤 Nobuo Tabata
• 👤 田畑　命生
• 👤 Kazuhiko Takahashi
• 👤 和彦 高橋
• 👤 Toshio Murayama
• 👤 村山　利雄

Bibliographic Details