Phase change cooling of semiconductor power modules

Claim 2

A semiconductor cooling system (10) comprising: a base (14) with an upper mounting surface (16), said base having a plurality of fins (18) integrally formed therewith and extending out of said base (14) on a side opposite said mounting surface (16); a cold plate (40)in connection with said base (14) for extracting heat from said base (14); a semiconductor wafer (20) mounted on said base (40), said semiconductor wafer (20) having a critically high temperature at which reduction in functionality of said semiconductor wafer (20) occurs; an electronic stack (22) mounted on said semiconductor wafer (20), said stack (22) having semiconductor electronic components thereon; a housing (12) surrounding said semiconductor wafer (20) enclosing said semiconductor wafer (20) and leaving a space (28) around said semiconductor wafer (20); and a phase change material within said housing (12) around said semiconductor wafer (20), said phase change material changing from a lower energy state to a higher energy state a temperature below the critically high temperature of said semiconductor wafer (20).

Claim 3

The semiconductor cooling system of claim 1 wherein said phase change material is a dielectric material.

Claim 4

The semiconductor cooling system of claim 2 wherein said phase change material is an organic material which changes from a more solid form to a more liquid form with an increase in temperature at the transition temperature, with absorption of heat.

Claim 5

The semiconductor cooling system of claim 3 wherein said phase change material is a paraffin selected from the group consisting of triacontane (C 30 H 62 ), Dotricontane-C 32 H 66 , Tritriacontane-C 33 H 68 , etc.

Claim 6

The semiconductor cooling system of claim 3 wherein said phase change material is a non-paraffin organic material selected from the group consisting of Beeswax, Oxazoline wax and Acetamide-C 2 H 5 ON.

Claim 7

The semiconductor cooling system of claim 3 wherein said semiconductor wafer has wire leads extending therefrom and into said organic phase change material so as to conduct heat from said semiconductor wafer into said organic phase change material.

Claim 8

The semiconductor cooling system of claim 6 wherein at least some of said wires attached to said wafer serve only as heat paths from said wafer into said organic phase change material.

Claim 9

A semiconductor cooling system (10) comprising: a base (14) With an upper mounting surface (16), said base (14) having a plurality of fins (18) integrally formed therewith and extending out of said base (14) on a side opposite said mounting surface (16); a semiconductor wafer (20) having a critically high temperature above which semiconductor life is reduced mounted on said base (14), said semiconductor wafer (20) having exposed electric leads (44) thereon; an electronic stack (22) mounted on said semiconductor wafer (20), said stack (22) having semiconductor electronic components thereon; a housing (12) mounted on said base (14) and surrounding said semiconductor wafer (20) and enclosing said semiconductor wafer (20) with a space (28) within said housing (12) around said semiconductor wafer (20); and a phase change material within said housing (12) and in contact with said semiconductor wafer (20) and said leads (44), said phase change material having a transition temperature from a lower energy state to a higher energy state at a temperature below the critical temperature of said semiconductor wafer (20).

Claim 10

A semiconductor cooling system (10) comprising: a base (14) With an upper mounting surface (16), said base (14) having a plurality of fins (18) integrally formed therewith and extending out of said base (14) on a side opposite said mounting surface (16); a semiconductor wafer (20) having a critically high temperature above which semiconductor life is reduced mounted on said base (14), said semiconductor wafer (20) having exposed electric leads (44) thereon; an electronic stack (22) mounted on said semiconductor wafer (20), said stack (22) having semiconductor electronic components thereon; a housing (12) mounted on said base (14) and surrounding said semiconductor wafer (20) and enclosing said semiconductor wafer (20) with a space (28) within said housing (12) around said semiconductor wafer (20); and a phase change material within said housing (12) and in contact with said semiconductor wafer (20) and said leads (44), said phase change material having a transition temperature from a lower energy state to a higher energy state at a temperature below the critical temperature of said semiconductor wafer (20).

Claim 11

The semiconductor cooling system of claim 8 wherein said phase change material changes from a more solid state to a more liquid state as it absorbs heat at its transition temperature.

Claim 12

The semiconductor cooling system of claim 9 wherein said phase change material is in contact with said base and said means to remove heat is connected to remove heat from said base so that when said means to remove heat removes heat from said phase change material and it reduces said phase change material to a temperature below its transition temperature, said means to remove heat removes heat from said phase change material to lower it to its lower energy state.

Claim 13

The semiconductor cooling system of claim 10 wherein said phase change material is dielectric.

Claim 14

The semiconductor cooling system of claim 11 wherein said phase change material is a paraffin selected from the group consisting of triacontane (C 30 H 62 ), Dotricontane-C 32 H 66 , Tritriacontane-C 33 H 68 , etc.

Claim 15

The semiconductor cooling system of claim 11 wherein said phase change material is a non-paraffin organic material selected from the group consisting of Beeswax, Oxazoline wax and Acetamide-C 2 H 5 ON.

Claim 16

The semiconductor cooling system of claim 8 wherein said semiconductor wafer has wire leads extending therefrom and into said organic phase change material so as to conduct heat from said semiconductor wafer into said organic phase change material.

Claim 17

The semiconductor cooling system of claim 14 wherein at least some of said wires attached to said wafer serve only as heat paths from said wafer into said organic phase change material.

Claim 18

The semiconductor cooling system of claim 8 wherein said semiconductor wafer is in the power control system of an electric vehicle and the temperature reached by said semiconductor wafer in normal operation is below said transitional temperature and said transitional temperature is reached by said semiconductor wafer only when said electrical vehicle subjects said semiconductor wafer to peak loads.

Claim 19

The semiconductor cooling system of claim 15 wherein said semiconductor wafer is in the power control system of an electric vehicle and the temperature reached by said semiconductor wafer in normal operation is below said transitional temperature and said transitional temperature is reached by said semiconductor wafer only when said electrical vehicle subjects said semiconductor wafer to peak loads.