US5453148A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesive for connecting a circuit member to a substrate
Assignee: Industrial Technology Research Institute
•
Filing: 1993-10-05
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Granted: 1995-09-26
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Expires: 2013-10-05
Abstract
Abstract An uniaxial adhesive for connecting a circuit member having a plurality of laterally spaced conductive terminals to a substrate including a mounting space having a plurality of laterally spaced conductive paths contains at least 10 percent by weight of compressible hollow conductive particles and a nonconductive polymeric resin. Magnetic field and pressure are applied to the adhesive to gather, concentrate and deform the hollow conductive particles between the conductive terminals and the conductive paths so as to assure excellent electrical connections therebetween.
Inventors
- 👤 Neng-hsing Lu
- 👤 Ning Yang
- 👤 J. C. Deng
- 👤 Dick Liao
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:39
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/08; H05K2201/083; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/10; H05K2203/104
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
52 words
An adhesive for connecting a circuit member having a plurality of spaced conductive terminals to a substrate, comprising: a) at least 10 percent by weight of compressible hollow conductive particles which are made of soft magnetic materials; and b) a nonconductive polymeric resin in which the compressible hollow conductive particles are dispersed.
Claim 2
Dependent Claim
52 words
An adhesive for connecting a circuit member having a plurality of spaced conductive terminals to a substrate, comprising: a) at least 10 percent by weight of compressible hollow conductive particles which are made of soft magnetic materials; and b) a nonconductive polymeric resin in which the compressible hollow conductive particles are dispersed.
Claim 3
Dependent Claim
30 words
The adhesive as claimed in claim 1, wherein the soft magnetic materials are selected from the group consisting of nickel, iron, cobalt, samarium, aluminum, platinum, lead, antimony, and alloys thereof.
Claim 4
Dependent Claim
14 words
The adhesive as claimed in claim 2, wherein the soft magnetic material is nickel.
Claim 5
Dependent Claim
19 words
The adhesive as claimed in claim 2, wherein the soft magnetic material is an alloy of nickel and copper.
Claim 6
Dependent Claim
21 words
The adhesive as claimed in claim 1, wherein the amount of the compressible hollow conductive particles is 10-25 percent by weight.
Claim 7
Dependent Claim
36 words
The adhesive as claimed in claim 1, wherein the nonconductive polymeric resin is selected from the group consisting of epoxy resin, acrylic resin, polyester resin, silicone resin, phenoxy resin, polyurethane resin, polysulfide, cyanoacrylate and UV-curable polymer.
Claim 8
Dependent Claim
15 words
The adhesive as claimed in claim 6, wherein the nonconductive polymeric resin is epoxy resin.
Claim 9
Independent Claim
200 words
A method of connecting a circuit member having a plurality of spaced conductive terminals to a substrate including a mounting surface having a plurality of spaced conductive paths, the method comprising: a) applying an adhesive including at least 10 percent by weight of compressible hollow conductive particles which are made of soft magnetic materials and a nonconductive polymeric resin in which the compressible hollow conductive particles are dispersed over the mounting surface of the substrate; b) mounting the circuit member on the adhesive while vertically aligning the conductive terminals over preselected ones of the conductive paths; c) applying a magnetic field vertically to the combination of the mounting surface, the adhesive and the circuit member to gather the conductive particles between the conductive terminals and the conductive paths; d) applying a pressure against the circuit member under the magnetic field to cause a flow of the adhesive out from between the conductive terminals and the conductive paths, whereby the concentration of the conductive particles between the conductive terminals and the conductive paths increases and the conductive particles deform to promote reliable electrical connection by increasing contact area between the conductive terminals and the conductive paths; and e) hardening the adhesive.
Claim 10
Independent Claim
200 words
A method of connecting a circuit member having a plurality of spaced conductive terminals to a substrate including a mounting surface having a plurality of spaced conductive paths, the method comprising: a) applying an adhesive including at least 10 percent by weight of compressible hollow conductive particles which are made of soft magnetic materials and a nonconductive polymeric resin in which the compressible hollow conductive particles are dispersed over the mounting surface of the substrate; b) mounting the circuit member on the adhesive while vertically aligning the conductive terminals over preselected ones of the conductive paths; c) applying a magnetic field vertically to the combination of the mounting surface, the adhesive and the circuit member to gather the conductive particles between the conductive terminals and the conductive paths; d) applying a pressure against the circuit member under the magnetic field to cause a flow of the adhesive out from between the conductive terminals and the conductive paths, whereby the concentration of the conductive particles between the conductive terminals and the conductive paths increases and the conductive particles deform to promote reliable electrical connection by increasing contact area between the conductive terminals and the conductive paths; and e) hardening the adhesive.
Claim 11
Dependent Claim
21 words
The method as claimed in claim 8, wherein, in step c), the applied magnetic field ranges from 200 to 5000 Gauss.
Claim 12
Dependent Claim
34 words
The method as claimed in claim 8, wherein the soft magnetic materials are selected from the group selected from the group consisting of nickel, iron, cobalt, samarium, aluminum, platinum, lead, antimony, and alloys thereof.
Claim 13
Dependent Claim
14 words
The method as claimed in claim 10, wherein the soft magnetic material is nickel.
Claim 14
Dependent Claim
24 words
The method as claimed in claim 8, wherein, in step a), the amount of the compressible hollow conductive particles is 10-25 percent by weight.
Claim 15
Dependent Claim
37 words
The method as claimed in claim 8, wherein, in step a), the nonconductive polymeric resin is selected from the group consisting of epoxy resin, polyester resin, acrylate resin, silicone resin, phenoxy resin, polysulfide, and ultraviolet hardenable resin.
Claim 16
Dependent Claim
15 words
The method as claimed in claim 13, wherein the nonconductive polymeric resin is epoxy resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-09-25 | 1999-03-27 | 1999-09-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-09-25 | 2003-03-27 | 2003-09-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-09-25 | 2007-03-27 | 2007-09-26 | $7700.00 | Window Closed / Lapsed |