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Process for setting the frequency of a silicon microresonator

Assignee: United States Department of the Army
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Filing: 1994-09-13
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Granted: 1995-09-19
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Expires: 2014-09-13
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Abstract

Abstract A silicon chip which is used as a microresonator, filter or the like and which may include an integrated circuit, has its resonant frequency adjusted by increasing its thickness in an ozone-rich atmosphere which may be supplemented by ultraviolet light and/or heat. The process lends itself to low cost, mass production techniques.

Inventors

  • 👤 John R. Vig

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 02:48
CPC Classifications
C; C23; C23C; C23C8/00; C23C8/06; C23C8/08; C23C8/10; C23C8/12; H; H03; H03H; H03H3/00; H03H3/007; H03H3/013

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 97 words
Process for fixing the resonant frequency of a silicon microresonator body which consists of a thin chip of silicon which resonates at a frequency which is at least partly related to the thickness of the chip which comprises the steps of: forming said chip to an initial thickness; attaching resonant frequency monitoring means to said chip; exposing said chip to an ozone-rich atmosphere to cause growth of oxide on said chip to cause a change in the resonant frequency of said chip until the resonant frequency is reached, and then removing said chip from said ozone-rich atmosphere.
Claim 2
Dependent Claim 97 words
Process for fixing the resonant frequency of a silicon microresonator body which consists of a thin chip of silicon which resonates at a frequency which is at least partly related to the thickness of the chip which comprises the steps of: forming said chip to an initial thickness; attaching resonant frequency monitoring means to said chip; exposing said chip to an ozone-rich atmosphere to cause growth of oxide on said chip to cause a change in the resonant frequency of said chip until the resonant frequency is reached, and then removing said chip from said ozone-rich atmosphere.
Claim 3
Dependent Claim 14 words
The process of claim 1 wherein said process is carried out at room temperature.
Claim 4
Dependent Claim 12 words
The process of claim 1 wherein said chip includes an integrated circuit.
Claim 5
Dependent Claim 24 words
The process of claim 1 which further includes the application of ultraviolet light to said chip when said chip is in said ozone-rich atmosphere.
Claim 6
Dependent Claim 14 words
The process of claim 4 wherein said process is carried out at room temperature.
Claim 7
Dependent Claim 12 words
The process of claim 4 wherein said chip includes an integrated circuit.
Claim 8
Dependent Claim 18 words
The process of claim 1 which further includes the heating of said atmosphere of ozone above room temperature.
Claim 9
Dependent Claim 12 words
The process of claim 7 wherein said chip includes an integrated circuit.
Claim 10
Dependent Claim 24 words
The process of claim 7 which further includes the application of ultraviolet light to said chip when said chip is in said ozone-rich atmosphere.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-09-18 1999-03-20 1999-09-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-09-18 2003-03-20 2003-09-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-09-18 2007-03-20 2007-09-19 $7700.00 Window Closed / Lapsed

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