Cooling of semiconductor power modules by flushing with dielectric liquid

Claim 1

A cooling system for an electronic semiconductor power module (10) comprising: a housing (12) with a bottom formed by plenum (14) and with a back wall (26), wherein said bottom of said housing (12) contains a first group (18) of nozzle holes, a second group (20) of nozzle holes and a third group (23) of nozzle holes; a base plate (24) mounted on standoffs (23, 25) in said housing (12) to position said base plate (24) away from said back wall (26) of said housing (12); a printed wiring board (28) carrying printed wiring, wherein said printed wiring board (28) is supported by said base plate (24) in said housing (12); a first plurality of semiconductor dies (30, 32, 34) mounted on a side of said printed wiring board (28) in a first upright row above said first group (18) of nozzle holes; a second plurality of semiconductor dies (36, 38, 40) mounted on said side of said printed wiring board (28) in a second upright row above said second group (20) of nozzle holes; input connection (16) mounted in said plenum (14) for providing liquid dielectric cooling liquid through which dielectric liquid is flowed into said plenum (14); output connection (22) mounted in said plenum (14) for dispelling liquid dielectric cooling liquid through which dielectric liquid is flowed out of said plenum (14); electrical conductors (42, 44) mounted on said printed wiring board (28) to which the first plurality (30, 32, 34) and the second plurality (36, 38, 40) are connected by wires for electrical connection; wherein dielectric fluid is directed from said first group (18) of nozzle holes directly across the first plurality of semiconductor dies (30, 32, 34), dielectric fluid is directed from the second group (20) of nozzle holes directly across the second plurality of semiconductor dies (36, 38, 40), and dielectric fluid is directed behind said base plate (24) from the third group (27) of nozzle holes.