Cooling mechanism for electronic component

Abstract

Abstract PURPOSE:To obtain stable cooling effects without entering into a film boiling condition by a method wherein a jet nozzle for jetting a liquid cooling medium within a hermetically sealing case, and a discharging hole for discharging the jetted liquid cooling medium are provided. CONSTITUTION:A printed substrate 1 is held in a flange 10 and coated with a casing 4 fixed at the flange 10. In the casing 4, a jet nozzle 5-i is so provided as to oppose to each heat sink 3-i, and each the jet nozzle 5-i is connected to an external cooling medium supply source by a piping 6. When the cooling medium reaches the jet nozzle 5-i through the piping 6, it is blown against the heat sink 3-i in a misty condition and at a high speed. Then, an old cooling medium is gradually filled up within the casing 4 and is lastly discharged from a second cooling medium outlet 9 through a first cooling medium outlet 8, successively.

Inventors

• 👤 Tsukasa Mizuno
• 👤 司 水野

Bibliographic Details