US5446960A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Alignment apparatus and method for placing modules on a circuit board
Assignee: International Business Machines Corp
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Filing: 1994-02-15
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Granted: 1995-09-05
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Expires: 2014-02-15
Abstract
Abstract An alignment apparatus and method that provides a pick and placement tool that picks matrix leaded modules from trays, places the modules into a self-aligning nest, picks the modules from the nest and places them on a printed circuit board. The specific location and orientation of the nest with respect to a printed circuit board is known by the pick and placement tool. Once the nest has aligned the module, the tool picks the module from the nest and places it in the appropriate location on the printed circuit board. The nest has sloped sides that angle toward that bottom and are slippery. These sides funnel the module toward the bottom of the nest and correct gross misalignment. At the bottom inside of the nest are locating features into which the leads of the module fit. Between the locating features are slip surfaces so that the module leads slide into the locating features, correcting fine misalignment. Embodiments of the nest work for matrix leaded modules, including ball grid array, column grid array, and land grid array modules.
Inventors
- 👤 Phillip D. Isaacs
- 👤 Thomas D. Kidd
- 👤 Bradley H. Redfield
- 👤 Jeffrey L. Stone
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:34
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/02; H05K13/022; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49764; Y10T29/49778; Y10T29/4978; Y10T29/49826; Y10T29/49895; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53178; Y10T29/53261
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
84 words
A method for aligning a matrix leaded module on a circuit board, comprising the steps of: picking the module for assembly; placing the module into a self-aligning nest, wherein the nest has angled sides, the sides having slip surfaces, and locating features on the inside bottom of the nest for aligning the module leads; removing the module from the nest with a placement head, the placement head having a known position with respect to the nest; and placing the module on the circuit board.
Claim 2
Independent Claim
84 words
A method for aligning a matrix leaded module on a circuit board, comprising the steps of: picking the module for assembly; placing the module into a self-aligning nest, wherein the nest has angled sides, the sides having slip surfaces, and locating features on the inside bottom of the nest for aligning the module leads; removing the module from the nest with a placement head, the placement head having a known position with respect to the nest; and placing the module on the circuit board.
Claim 3
Dependent Claim
20 words
The method of claim 1 wherein the locating features are depressions for receiving leads of a ball grid array module.
Claim 4
Dependent Claim
20 words
The method of claim 1 wherein the locating features are depressions for receiving leads from a column grid array module.
Claim 5
Dependent Claim
19 words
The method of claim 1 wherein the placement head removes the module from the nest using a vacuum nozzle.
Claim 6
Dependent Claim
39 words
A nest apparatus for self-aligning a matrix leaded module, comprising: alignment means for aligning the nest to a known position; angled sides with slip surfaces; and locating features on inside bottom of the nest for aligning the module leads.
Claim 7
Dependent Claim
39 words
A nest apparatus for self-aligning a matrix leaded module, comprising: alignment means for aligning the nest to a known position; angled sides with slip surfaces; and locating features on inside bottom of the nest for aligning the module leads.
Claim 8
Dependent Claim
22 words
The apparatus of claim 5 wherein the locating features further comprise depressions for accepting the leads of a ball grid array module.
Claim 9
Dependent Claim
20 words
The apparatus of claim 5 wherein the locating features are depressions for receiving leads from a column grid array module.
Claim 10
Dependent Claim
16 words
The apparatus of claim 5 wherein the alignment means comprises alignment pins connected to a shuttle.
Claim 11
Independent Claim
110 words
An apparatus for assembling matrix leaded modules on a circuit board, comprising; a tray elevator; a plurality of trays, holding a plurality of modules, mounted in the tray elevator; a shuttle, disposed adjacent to the tray elevator; a transfer head, for transporting a module from the tray to the shuttle; a self-aligning nest mounted on the shuttle, the nest having angled sides, the sides having slip surfaces, and locating features on the inside bottom of the nest for aligning the module leads; and a placement head, having a known orientation with respect to the nest, which picks the module from the nest and places the module on a circuit board.
Claim 12
Independent Claim
110 words
An apparatus for assembling matrix leaded modules on a circuit board, comprising; a tray elevator; a plurality of trays, holding a plurality of modules, mounted in the tray elevator; a shuttle, disposed adjacent to the tray elevator; a transfer head, for transporting a module from the tray to the shuttle; a self-aligning nest mounted on the shuttle, the nest having angled sides, the sides having slip surfaces, and locating features on the inside bottom of the nest for aligning the module leads; and a placement head, having a known orientation with respect to the nest, which picks the module from the nest and places the module on a circuit board.
Claim 13
Dependent Claim
16 words
The apparatus of claim 9 wherein the nest is mounted on the shuttle with alignment pins.
References Cited (Backward Citations)
US3931922A
Cited
US3868765A
Cited
US3868764A
Cited
US4342090A
Cited
US4476626A
Cited
US4479298A
Cited
US4633584A
Cited
US4722135A
Cited
US4670981A
Cited
US4776080A
Cited
US4810154A
Cited
US5074036A
Cited
US5153983A
Cited
US5128834A
Cited
US5048178A
Cited
US5208976A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-09-04 | 1999-03-06 | 1999-09-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-09-04 | 2003-03-06 | 2003-09-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-09-04 | 2007-03-06 | 2007-09-05 | $7700.00 | Window Closed / Lapsed |