US5074036A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of die bonding semiconductor chip by using removable frame
Assignee: Samsung Electronics Co Ltd
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Filing: 1990-10-31
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Granted: 1991-12-24
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Expires: 2010-10-31
Abstract
Abstract A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.
Inventors
- 👤 Thomas J. Dunaway
- 👤 Richard K. Spielberger
- 👤 Lori A. Dicks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:14
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/073; H10W72/07302; H10W72/07304; H10W72/07331; H10W72/07336; H10W72/07337; H10W72/075; H10W72/07551; H10W72/07554; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/541; H10W72/5445; H10W72/547; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/755; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/1092; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49133
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
156 words
A low cost high throughput method of die bonding a semiconductor chip to a package die bond pad, comprising: a) providing a semiconductor chip package having a chip mounting cavity configured with a die bond pad; b) providing bonding material for placement between the semiconductor chip and the die bond pad; c) placing a removable frame into the package cavity, the frame comprising top and bottom surfaces, an outer section, and an inner section, the outer section comprising means for achieving substantially slidable contact with peripheral walls of the package cavity, and the inner section defining a central aperture extending through the frame, the inner section comprising means for defining a wide upper opening and a narrower lower opening; d) placing the semiconductor chip through the aperture of the frame, thereby causing the semiconductor chip to be in contact with the bonding material; e) curing the bonding material; and f) removing the frame from the cavity.
Claim 2
Dependent Claim
156 words
A low cost high throughput method of die bonding a semiconductor chip to a package die bond pad, comprising: a) providing a semiconductor chip package having a chip mounting cavity configured with a die bond pad; b) providing bonding material for placement between the semiconductor chip and the die bond pad; c) placing a removable frame into the package cavity, the frame comprising top and bottom surfaces, an outer section, and an inner section, the outer section comprising means for achieving substantially slidable contact with peripheral walls of the package cavity, and the inner section defining a central aperture extending through the frame, the inner section comprising means for defining a wide upper opening and a narrower lower opening; d) placing the semiconductor chip through the aperture of the frame, thereby causing the semiconductor chip to be in contact with the bonding material; e) curing the bonding material; and f) removing the frame from the cavity.
Claim 3
Dependent Claim
18 words
The method of claim 1 wherein the step of providing bonding material comprises providing an adhesive bonding material.
Claim 4
Dependent Claim
15 words
The method according to claim 2 wherein the curing step comprises heating the bonding material.
Claim 5
Dependent Claim
108 words
A low cost method of die bonding a semiconductor chip to a package die bond pad, comprising: a) providing a semiconductor chip package having a chip mounting cavity configured with a die bond pad; b) providing bonding material for placement between the semiconductor chip and the die bond pad; c) placing a removable frame having at least one aperture into the package cavity; d) placing the semiconductor chip through a selected aperture of the frame, thereby causing semiconductor chip to be in contact with the bonding material; e) curing the bonding material, thereby bonding the semiconductor chip to the package; and f) removing the frame from the cavity.
Claim 6
Dependent Claim
108 words
A low cost method of die bonding a semiconductor chip to a package die bond pad, comprising: a) providing a semiconductor chip package having a chip mounting cavity configured with a die bond pad; b) providing bonding material for placement between the semiconductor chip and the die bond pad; c) placing a removable frame having at least one aperture into the package cavity; d) placing the semiconductor chip through a selected aperture of the frame, thereby causing semiconductor chip to be in contact with the bonding material; e) curing the bonding material, thereby bonding the semiconductor chip to the package; and f) removing the frame from the cavity.
Claim 7
Dependent Claim
121 words
A low cost method for adhesive bonding of a semiconductor chip to a semiconductor package die bond pad, comprising the steps of: a) providing a semiconductor chip package having a chip mounting cavity comprising walls surrounding a die bond pad; b) providing bonding material for placement between the semiconductor chip and the bonding pad; c) placing a removable frame having a central aperture into slidable contact with walls of the package cavity; d) orienting a semiconductor chip to the aperture of the frame; e) placing the semiconductor chip through the frame aperture into contact with the bonding material; f) curing the bonding material, thereby bonding the semiconductor chip to the die bond pad; and g) removing the frame from the cavity.
Claim 8
Dependent Claim
121 words
A low cost method for adhesive bonding of a semiconductor chip to a semiconductor package die bond pad, comprising the steps of: a) providing a semiconductor chip package having a chip mounting cavity comprising walls surrounding a die bond pad; b) providing bonding material for placement between the semiconductor chip and the bonding pad; c) placing a removable frame having a central aperture into slidable contact with walls of the package cavity; d) orienting a semiconductor chip to the aperture of the frame; e) placing the semiconductor chip through the frame aperture into contact with the bonding material; f) curing the bonding material, thereby bonding the semiconductor chip to the die bond pad; and g) removing the frame from the cavity.
Claim 9
Dependent Claim
15 words
The method according to claim 5 wherein the curing step comprises heating the bonding material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-12-23 | 1995-06-24 | 1995-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-12-23 | 1999-06-24 | 1999-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-12-23 | 2003-06-24 | 2003-12-24 | $7700.00 | Window Closed / Lapsed |