Probing apparatus having an automatic probe card install mechanism and a semiconductor wafer testing system including the same

Claim 1

A probing apparatus arrangement comprising a plurality of probing apparatuses (11A-11N) for measuring electrical characteristics of a plurality of semiconductor wafers (9) by bringing probes of a probe card (1) suitable for each semiconductor wafer into contact with electrode pads of the respective wafer to be tested, wherein each probing apparatus comprises moving means (41-45) for receiving a probe card (1), for carrying said probe card to a position just below a pin socket (3) to which the probe card is to be attached, and for lifting said probe card, and attaching means (5) for attaching the lifted probe card to said pin socket, said apparatus arrangement further comprising: a probe card storing means (102) for storing a plurality of probe cards (1), each in a probe card holder (2), to be commonly used in said plurality of probing apparatuses; an automated probe card transporting means (101) for picking out one of said probe cards stored in said probe card storing means (102) and transporting the same to a respective probing apparatus (11A); and a control means (105) for controlling said automated probe card transporting means (101) to pick out from said probe card storing means (102) one of said probe cards corresponding to a kind of semiconductor wafer to be tested in said respective probing apparatus (11A) and to transfer the same to the moving means (41-45) of said respective probing apparatus (11A).