US5435481A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Soldering process
Assignee: NXP USA Inc
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Filing: 1994-01-18
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Granted: 1995-07-25
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Expires: 2014-01-18
Abstract
Abstract A soldering process for use with solder clad printed circuit boards (10) uses a pin transfer means to apply a tacking agent to the substrate. An array of pins (24) is dipped into a film of tacking agent (22). The pins are removed from the tacking agent (26) carrying with them a predetermined amount of tacking agent. The pins are then contacted (27) to the printed circuit board and removed (28). During this process, a predetermined amount of tacking agent is deposited at selective locations on the printed circuit board. A component is placed (30) on the printed circuit board in the tacking agent and the circuit board and component are heated (40) in order to reflow the solder and effect the solder joint between the component and the board.
Inventors
- 👤 Francisco da Costa Alves
- 👤 William B. Mullen, III
- 👤 John M. Nickelsen, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:52
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/20; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3489; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10719; H05K2201/10727; H05K2201/10734; H05K2203/00; H05K2203/04; H05K2203/0485; H05K3/3442; H05K3/3465; H05K3/3473; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
193 words
A soldering process, comprising: providing a component having at least one solderable surface, providing a circuit carrying substrate having a plurality of solderable portions that are clad with solder in an amount sufficient to effect a solder joint between the component solderable surface and the solderable portion of the substrate when sufficiently heated, providing a thin film of tacking agent, and providing a plurality of pins; dipping the plurality of pins into the thin film of tacking agent so as to deposit a portion of the tacking agent on each pin; removing the plurality of pins from the thin film of tacking agent; contacting the plurality of pins to the circuit carrying substrate solderable portions so as to transfer the deposited tacking agent from each pin to each respective solderable portion; and removing the plurality of pins from the circuit carrying substrate solderable portions; substantially simultaneously depositing a predetermined amount of tacking agent on each of the circuit carrying substrate solderable portions; placing the solderable surface of the component on the tacking agent; and heating the circuit carrying substrate and the component in order to solder the component to the circuit carrying substrate.
Claim 2
Dependent Claim
193 words
A soldering process, comprising: providing a component having at least one solderable surface, providing a circuit carrying substrate having a plurality of solderable portions that are clad with solder in an amount sufficient to effect a solder joint between the component solderable surface and the solderable portion of the substrate when sufficiently heated, providing a thin film of tacking agent, and providing a plurality of pins; dipping the plurality of pins into the thin film of tacking agent so as to deposit a portion of the tacking agent on each pin; removing the plurality of pins from the thin film of tacking agent; contacting the plurality of pins to the circuit carrying substrate solderable portions so as to transfer the deposited tacking agent from each pin to each respective solderable portion; and removing the plurality of pins from the circuit carrying substrate solderable portions; substantially simultaneously depositing a predetermined amount of tacking agent on each of the circuit carrying substrate solderable portions; placing the solderable surface of the component on the tacking agent; and heating the circuit carrying substrate and the component in order to solder the component to the circuit carrying substrate.
Claim 3
Dependent Claim
19 words
The soldering process as described in claim 1, wherein the solderable surface of the component is clad with solder.
Claim 4
Dependent Claim
15 words
The soldering process as described in claim 1, wherein the component is a chip carrier.
Claim 5
Dependent Claim
31 words
The soldering process as described in claim 1, wherein the solderable portions of the circuit carrying substrate are clad with a layer of solder between 0.02 mm and 0.2 mm thick.
Claim 6
Dependent Claim
17 words
The soldering process as described in claim 1, wherein the step of heating comprises reflowing the solder.
Claim 7
Dependent Claim
40 words
The soldering process as described in claim 1, wherein the partial step of providing a thin film of tacking agent comprises a step of creating a thin film of the tacking agent on a smooth substrate using a doctor blade.
Claim 8
Dependent Claim
17 words
The soldering process as described in claim 1, wherein the tacking agent is a high viscosity material.
Claim 9
Dependent Claim
21 words
The soldering process as described in claim 7, wherein the viscosity of the tacking agent is between 20 and 1500 centipoise.
Claim 10
Dependent Claim
189 words
A soldering process, comprising: providing a component having at least one solderable surface that is clad with solder, providing a circuit carrying substrate having a plurality of solderable portions that are clad with a layer of solder between 0.02 mm and 0.2 mm thick, providing a thin film of a high viscosity tacking agent on a substrate using a doctor blade, and providing a plurality of pins; dipping the plurality of pins into the thin film of tacking agent so as to deposit a portion of the tacking agent on each pin; removing the plurality of pins from the thin film of tacking agent; contacting the plurality of pins to the circuit carrying substrate solderable portions so as to transfer the deposited tacking agent from each pin to each respective solderable portion; and removing the plurality of pins from the circuit carrying substrate solderable portions; substantially simultaneously depositing a predetermined amount of tacking agent on each of the circuit carrying substrate solderable portions; placing the solderable surface of the component on the tacking agent; and reflowing the solder in order to solder the component to the circuit carrying substrate.
Claim 11
Dependent Claim
189 words
A soldering process, comprising: providing a component having at least one solderable surface that is clad with solder, providing a circuit carrying substrate having a plurality of solderable portions that are clad with a layer of solder between 0.02 mm and 0.2 mm thick, providing a thin film of a high viscosity tacking agent on a substrate using a doctor blade, and providing a plurality of pins; dipping the plurality of pins into the thin film of tacking agent so as to deposit a portion of the tacking agent on each pin; removing the plurality of pins from the thin film of tacking agent; contacting the plurality of pins to the circuit carrying substrate solderable portions so as to transfer the deposited tacking agent from each pin to each respective solderable portion; and removing the plurality of pins from the circuit carrying substrate solderable portions; substantially simultaneously depositing a predetermined amount of tacking agent on each of the circuit carrying substrate solderable portions; placing the solderable surface of the component on the tacking agent; and reflowing the solder in order to solder the component to the circuit carrying substrate.
Claim 12
Dependent Claim
27 words
The soldering process as described in claim 9, wherein the step of dipping comprises immersing the pins into the thin film until the pins contact the substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-07-24 | 1999-01-23 | 1999-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-07-24 | 2003-01-23 | 2003-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-07-24 | 2007-01-23 | 2007-07-25 | $7700.00 | Window Closed / Lapsed |