US5433840A
Expired / Lapsed
US
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Acid bath for the galvanic deposition of copper, and the use of such a bath
Assignee: Atotech Deutschland GmbH and Co KG
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Filing: 1992-07-22
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Granted: 1995-07-18
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Expires: 2012-07-22
Abstract
Abstract PCT No. PCT/DE92/00605 Sec. 371 Date Apr. 6, 1994 Sec. 102(e) Date Apr. 6, 1994 PCT Filed Jul. 22, 1992 PCT Pub. No. WO93/03204 PCT Pub. Date Feb. 18, 1993.An aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed circuits. The bath is characterized by a content of polyalkylene glycol ether. When combined with thio compounds containing water-soluble groups, these additions produce an electrolyte with excellent stability. Polymeric phenazonium compounds, polymeric nitrogen compounds and/or thio compounds containing nitrogen may also be successfully combined, in addition, depending on the desired properties.
Inventors
- 👤 Wolfgang Dahms
- 👤 Horst Westphal
- 👤 Michael Jonat
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 15:58
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
64 words
An aqueous acid bath for the galvanic deposition of bright, smooth copper coats comprising: a polyalkylene glycol ether of the formula ##STR2## where n=8-800, and m=0-50, R 1 is a lower alkyl group having one to four carbon atoms, R 2 is an aliphatic chain or an aromatic group, and a is 1 or 2; a copper salt; an acid; and optionally, chloride ions.
Claim 2
Dependent Claim
64 words
An aqueous acid bath for the galvanic deposition of bright, smooth copper coats comprising: a polyalkylene glycol ether of the formula ##STR2## where n=8-800, and m=0-50, R 1 is a lower alkyl group having one to four carbon atoms, R 2 is an aliphatic chain or an aromatic group, and a is 1 or 2; a copper salt; an acid; and optionally, chloride ions.
Claim 3
Dependent Claim
10 words
An aqueous acid bath according to claim 1, wherein n=14-90.
Claim 4
Dependent Claim
23 words
An aqueous acid bath according to claim 1, wherein the polyalkylene glycol ether is present in a concentration of 0.005 to 30 g/liter.
Claim 5
Dependent Claim
59 words
An aqueous acid bath according to claim 1, wherein the polyalkylene glycol ether is selected from the group consisting of: dimethyl polyethylene glycol ether; dimethyl polypropylene glycol ether; di-tert.-butyl polyethylene glycol ether; stearyl monomethyl polyethylene glycol ether; nonylphenol monomethyl polyethylene glycol ether; polyethylene polypropylene dimethyl glycol ether; octyl monomethyl polyalkylene ether; dimethyl-bis(polyalkyleneglycol)octylene ether; and 3-naphthol monomethyl polyethylene glycol ether.
Claim 6
Dependent Claim
19 words
An aqueous acid bath according to claim 1, further comprising at least one thio compound or a mixture thereof.
Claim 7
Dependent Claim
73 words
An aqueous acid bath according to claim 5, wherein the thio compound is selected from the group consisting of: 3-mercaptopropaneo 1 -sulfonic acid, sodium salt; thiophosphoric acid-O-ethyl-bis-(ω-sulfopropyl)ester, disodium salt; thiophosphoric acid-tris-(ω-sulfopropyl)ester, trisodium salt; thioglycolic acid; ethylene dithio dipropyl sulfonic acid, sodium salt; bis-(ω-sulfopropyl)disulfide, disodium salt; bis-(ω-sulfopropyl)sulfide, disodium salt; O-ethyl dithiocarbonic acid-S-(ω-sulfopropyl)ester, potassium salt 3(benzothiazolyl-2-thio)propylsulfonic acid, sodium salt; bis-(ω-sulfohydroxypropyl)disulfide, disodium salt; bis-(ω-sulfobutyl)disulfide, disodium salt; bis-(p-sulfophenyl)disulfide, disodium salt; methyl-(ω-sulfopropyl)disulfide, disodium salt; and methyl-(ω-sulfopropyl)trisulfide, disodium salt.
Claim 8
Dependent Claim
22 words
An aqueous acid bath according to claim 5, wherein the thio compound is present in a concentration of 0.0005 to 0.4 g/liter.
Claim 9
Dependent Claim
22 words
An aqueous acid bath according to claim 6, wherein the thio compound is present in a concentration of 0.0005 to 0.4 g/liter.
Claim 10
Dependent Claim
16 words
An aqueous acid bath according to claim 1, further comprising at least one polymeric phenazonium compound.
Claim 11
Dependent Claim
56 words
An aqueous acid bath according to claim 9, wherein the polymeric phenazonium compound is selected from the group consisting of: poly(6-methyl-7-dimethylamino-5-phenyl phenazonium sulfate); poly(2-methyl-7-diethylamino-5-phenyl phenazonium chloride); poly(2-methyl-7-dimethylamino-5-phenyl phenazonium sulfate); poly(5-methyl-7-dimethylamino phenazonium acetate); poly(2-methyl-7-anilino-5-phenyl phenazonium sulfate); poly(2-methyl-7-dimethylamino phenazonium sulfate); poly(7-methylamino-5-phenyl phenazonium acetate); poly(7-ethylamino-2,5-diphenyl phenazonium chloride); poly(2,8-dimethyl-7-diethylamino-5-p-tolyl-phenazonium chloride); poly(2,5,8-triphenyl-7-dimethylamino phenazonium sulfate); poly(2,8-dimethyl-7-amino-5-phenyl phenazonium sulfate); and poly(7-dimethylamino-5-phenyl phenazonium chloride).
Claim 12
Dependent Claim
23 words
An aqueous acid bath according to claim 9, wherein the polymeric phenazonium compound is present in a concentration of 0.0001 to 0.5 g/liter.
Claim 13
Dependent Claim
23 words
An aqueous acid bath according to claim 10, wherein the polymeric phenazonium compound is present in a concentration of 0.0001 to 0.5 g/liter.
Claim 14
Dependent Claim
15 words
An aqueous acid bath according to claim 1, further comprising at least one thiourea derivative.
Claim 15
Dependent Claim
39 words
An aqueous acid bath according to claim 10, wherein the thiourea derivative is selected from the group consisting of: N-acetylthiourea; N-trifluoroacetylthiourea; N-ethylthiourea; N-cyanoacetylthiourea; N-allylthiourea; o-tolylthiourea; N,N'-butylene thiourea; thiazolidine thiol(2); 4-thiazoline thiol(2); imidazolidine thiol(2) (N,N'-ethylene thiourea); 4-methyl-2-pyrimidine thiol; and 2-thiouracil.
Claim 16
Dependent Claim
22 words
An aqueous acid bath according to claim 13, wherein the thiourea derivative is present in a concentration of 0.0001 to 0.5 g/liter.
Claim 17
Dependent Claim
22 words
An aqueous acid bath according to claim 14, wherein the thiourea derivative is present in a concentration of 0.0001 to 0.5 g/liter.
Claim 18
Dependent Claim
16 words
An aqueous acid bath according to claim 1, further comprising at least one polymeric nitrogen compound.
Claim 19
Dependent Claim
32 words
An aqueous acid bath according to claim 17, wherein the polymeric nitrogen compound is selected from the group consisting of: polyethylenimine; polyethylenimide; polyacrylic acid amide; polypropylenimine; polybutylenimine; N-methylpolyethylenimine; N-acetylpolyethylenimine; and N -butylpolyethylenimine.
Claim 20
Dependent Claim
23 words
An aqueous acid bath according to claim 17, wherein the polymeric nitrogen compound is present in a concentration of 0.0001 to 0.5 g/liter.
Claim 21
Dependent Claim
23 words
An aqueous acid bath according to claim 18, wherein the polymeric nitrogen compound is present in a concentration of 0.0001 to 0.5 g/liter.
Claim 22
Independent Claim
134 words
A method for strengthening conductors of printed circuits, comprising the steps of: (a) providing an aqueous acid bath containing a polyalkylene glycol ether of the formula ##STR3## where n=8-800, and m=0-50, R 1 is a lower alkyl group having one to four carbon atoms, R 2 is an aliphatic chain or an aromatic group, and a is 1 or 2, a copper salt, an acid, and optionally, chloride ions; (b) immersing the printed circuit in the aqueous acidic bath; and (c) galvanizing the printed circuit to deposit a bright, smooth copper coat. ##STR4## where n=8-800, and m=0-50, R 1 is a lower alkyl group having one to four carbon atoms, R 2 is an aliphatic chain or an aromatic group and a is 1 or 2; a copper salt; an acid; and optionally, chlorideions,
Claim 23
Independent Claim
134 words
A method for strengthening conductors of printed circuits, comprising the steps of: (a) providing an aqueous acid bath containing a polyalkylene glycol ether of the formula ##STR3## where n=8-800, and m=0-50, R 1 is a lower alkyl group having one to four carbon atoms, R 2 is an aliphatic chain or an aromatic group, and a is 1 or 2, a copper salt, an acid, and optionally, chloride ions; (b) immersing the printed circuit in the aqueous acidic bath; and (c) galvanizing the printed circuit to deposit a bright, smooth copper coat. ##STR4## where n=8-800, and m=0-50, R 1 is a lower alkyl group having one to four carbon atoms, R 2 is an aliphatic chain or an aromatic group and a is 1 or 2; a copper salt; an acid; and optionally, chlorideions,
Claim 24
Independent Claim
95 words
A method for producing bright, smooth copper coats on printed circuits, comprising the steps of: (a) providing an aqueous acid bath containing a polyalkylene glycol ether of the formula ##STR5## where n=8-800, and m=0-50, R 1 is a lower alkyl group having one to four carbon atoms, R 2 is an aliphatic chain or an aromatic group, and a is 1 or 2; a copper salt, an acid, and optionally, chloride ions; (b) immersing the printed circuit in the aqueous acidic bath; and (c) galvanizing the printed circuit to deposit a bright, smooth, copper coat.
Claim 25
Independent Claim
95 words
A method for producing bright, smooth copper coats on printed circuits, comprising the steps of: (a) providing an aqueous acid bath containing a polyalkylene glycol ether of the formula ##STR5## where n=8-800, and m=0-50, R 1 is a lower alkyl group having one to four carbon atoms, R 2 is an aliphatic chain or an aromatic group, and a is 1 or 2; a copper salt, an acid, and optionally, chloride ions; (b) immersing the printed circuit in the aqueous acidic bath; and (c) galvanizing the printed circuit to deposit a bright, smooth, copper coat.
Claim 26
Dependent Claim
51 words
An aqueous acid bath according to claim 1, wherein the copper salt is present in a concentration of from 20 to 250 g/liter, the acid is present in a concentration of from 50 to 350 g/liter, and the chloride ions are present in a concentration of from 0.01 to 0.18 g/liter.
Claim 27
Dependent Claim
55 words
The method for strengthening conductors of printed circuits according to claim 21, wherein the copper salt is present in a concentration of from 20 to 250 g/liter, the acid is present in a concentration of from 50 to 350 g/liter, and the chloride ions are present in a concentration of from 0.01 to 0.18 g/liter.
Claim 28
Dependent Claim
55 words
The method for producing bright, smooth copper coats according to claim 22, wherein the copper salt is present in a concentration of from 20 to 250 g/liter, the acid is present in a concentration of from 50 to 350 g/liter, and the chloride ions are present in a concentration of from 0.01 to 0.18 g/liter.
References Cited (Backward Citations)
CA633957A
Cited
DE1521062A1
Cited
DE1293749B
Cited
DE2039831A1
Cited
US3743584A
Cited
DE2746938A1
Cited
EP0071512A1
Cited
DE3420999A1
Cited
US4820388A
Cited
US5328589A
Cited
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