US5431332A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for solder sphere placement using an air knife
Assignee: NXP USA Inc
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Filing: 1994-02-07
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Granted: 1995-07-11
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Expires: 2014-02-07
Abstract
Abstract A station (10) in a manufacturing line (12) for the accurate placement of solder balls (30) on a ball grid array package and for the removal of excess solder balls comprises a substrate (4) having an array of solder pads (7), and an adhesion layer (8) on the solder pads. The station further comprises a stencil (16) placed on top of the substrate and having a height between 1/4 times the diameter of one of the solder balls and 5/4 times the diameter of one of the balls, the stencil having an array of apertures (18) corresponding to the array of solder pads and substantially exposing each of the solder pads of the array, a pallet (2) for holding and transporting the substrate to the stencil and further along the manufacturing line, a dispenser (26) for pouring solder balls in bulk over the stencil, a vibration device (20) coupled to the station for urging the solder balls into the apertures of the stencil and onto the adhesion layer above the solder pads, and a moving directed column of air (24) across the surface of the stencil to remove excess solder balls from the stencil.
Inventors
- 👤 Thomas P. Kirby
- 👤 Jonathon G. Greenwood
- 👤 Edward Juchniewicz
- 👤 Ovidiu Neiconi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 10:48
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/20; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H10; H10W; H10W70/00; H10W70/099; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/05; H05K2203/0548; H05K2203/0557; H05K2203/08; H05K2203/081; H10W72/00; H10W72/01; H10W72/011; H10W72/0112; H10W72/012; H10W72/01204; H10W72/01221; H10W72/01225
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
98 words
A method of solder bumping an array of solder pads on a substrate, comprising the steps of: applying an adhesion layer to the solder pads in the array of solder pads; placing a stencil over the substrate, the stencil having an array of apertures corresponding to the array of solder pads, each aperture exposing a substantial portion of each of the solder pads in the array; applying solder balls in bulk onto the stencil, wherein the stencil allows only one solder ball per aperture; and removing excess solder balls by using gravity by tilting the stencil and substrate.
Claim 2
Independent Claim
98 words
A method of solder bumping an array of solder pads on a substrate, comprising the steps of: applying an adhesion layer to the solder pads in the array of solder pads; placing a stencil over the substrate, the stencil having an array of apertures corresponding to the array of solder pads, each aperture exposing a substantial portion of each of the solder pads in the array; applying solder balls in bulk onto the stencil, wherein the stencil allows only one solder ball per aperture; and removing excess solder balls by using gravity by tilting the stencil and substrate.
Claim 3
Dependent Claim
26 words
The method of claim 1, wherein the step of removing excess solder balls includes the step of brushing the excess balls off the stencil before tilting.
Claim 4
Dependent Claim
24 words
The method of claim 1, wherein the step of removing excess solder balls includes the step of blowing the excess balls off the stencil.
Claim 5
Dependent Claim
21 words
The method of claim 1, wherein the method further comprises the step of fixing the stencil and substrate on a pallet.
Claim 6
Dependent Claim
27 words
The method of claim 1, wherein the method further comprises the steps of removing the stencil and reflowing the solder balls onto the array of solder pads.
Claim 7
Dependent Claim
38 words
The method of claim 1, wherein the step of applying solder balls includes the step of using a vibrator to urge the placement of the solder balls into the aperture of the stencil and onto the adhesion layer.
Claim 8
Dependent Claim
13 words
The method of claim 1, wherein the adhesion layer comprises a tacky flux.
Claim 9
Independent Claim
102 words
A method of solder bumping an array of solder pads on a substrate, comprising the steps of: applying an adhesion layer to the solder pads in the array of solder pads; placing a stencil over the substrate, the stencil having an array of apertures corresponding to the array of solder pads, each aperture exposing a substantial portion of each of the solder pads in the array; applying solder balls in bulk onto the stencil, wherein the stencil allows only one solder ball per aperture; and removing excess solder balls by using a directed column of air across the surface of the stencil.
Claim 10
Independent Claim
102 words
A method of solder bumping an array of solder pads on a substrate, comprising the steps of: applying an adhesion layer to the solder pads in the array of solder pads; placing a stencil over the substrate, the stencil having an array of apertures corresponding to the array of solder pads, each aperture exposing a substantial portion of each of the solder pads in the array; applying solder balls in bulk onto the stencil, wherein the stencil allows only one solder ball per aperture; and removing excess solder balls by using a directed column of air across the surface of the stencil.
Claim 11
Dependent Claim
25 words
The method of claim 8, wherein the step of removing excess solder balls further includes the step of brushing the excess balls off the stencil.
Claim 12
Dependent Claim
47 words
The method of claim 8, wherein the method further comprises the steps of registering the substrate onto a pallet and then registering the substrate and pallet to the stencil by matching the array of apertures of the stencil to the array of solder pads on the substrate.
Claim 13
Dependent Claim
27 words
The method of claim 8, wherein the method further comprises the steps of removing the stencil and reflowing the solder balls onto the array of solder pads.
Claim 14
Dependent Claim
13 words
The method of claim 8, wherein the adhesion layer comprises a tacky flux.
Claim 15
Dependent Claim
38 words
The method of claim 8, wherein the step of applying solder balls includes the step of using a vibrator to urge the placement of the solder balls into the aperture of the stencil and onto the adhesion layer.
Claim 16
Dependent Claim
153 words
A station in a manufacturing line for the accurate placement of solder balls on a ball grid array package and for the removal of excess solder balls, comprising: a substrate having an array of solder pads; an adhesion layer on the solder pads; a stencil placed on top of the substrate which allows only one solder ball to contact each solder pad, the stencil having an array of apertures corresponding to the array of solder pads and substantially exposing each of the solder pads of the array; a pallet for holding and transporting the substrate to the stencil and further along the manufacturing line; a dispenser for pouring solder balls in bulk over the stencil; a vibration device coupled to the station for urging the solder balls into the apertures of the stencil and onto the adhesion layer above the solder pads; and a means for removing excess solder balls from the stencil.
Claim 17
Dependent Claim
153 words
A station in a manufacturing line for the accurate placement of solder balls on a ball grid array package and for the removal of excess solder balls, comprising: a substrate having an array of solder pads; an adhesion layer on the solder pads; a stencil placed on top of the substrate which allows only one solder ball to contact each solder pad, the stencil having an array of apertures corresponding to the array of solder pads and substantially exposing each of the solder pads of the array; a pallet for holding and transporting the substrate to the stencil and further along the manufacturing line; a dispenser for pouring solder balls in bulk over the stencil; a vibration device coupled to the station for urging the solder balls into the apertures of the stencil and onto the adhesion layer above the solder pads; and a means for removing excess solder balls from the stencil.
Claim 18
Dependent Claim
17 words
The station of claim 14, wherein the adhesion layer on the solder pads comprises a tacky flux.
Claim 19
Dependent Claim
24 words
The station of claim 14, wherein the dispenser for pouring solder balls also serves as a reservoir where the excess solder balls are retained.
Claim 20
Dependent Claim
23 words
The station of claim 14, wherein the means for removing comprises a moving directed column of air across the surface of the substrate.
Claim 21
Dependent Claim
29 words
The station of claim 14, wherein the means for removing comprises a device for tilting the stencil and substrate to allow the solder balls to roll off with gravity.
Claim 22
Dependent Claim
179 words
A station for the in a manufacturing line for the accurate placement of solder balls on a ball grid array package and for the removal of excess solder balls, comprising: a substrate having an array of solder pads; an adhesion layer on the solder pads; a stencil placed on top of the substrate and having a height between 1/4 times the diameter of one of the solder balls and 5/4 times the diameter of one of the balls, the stencil having an array of apertures corresponding to the array of solder pads and substantially exposing each of the solder pads of the array; a pallet for holding and transporting the substrate to the stencil and further along the manufacturing line; a dispenser for pouring solder balls in bulk over the stencil; a vibration device coupled to the station for urging the solder balls into the apertures of the stencil and onto the adhesion layer above the solder pads; and a moving directed column of air across the surface of the substrate to remove excess solder balls from the stencil.
Claim 23
Dependent Claim
179 words
A station for the in a manufacturing line for the accurate placement of solder balls on a ball grid array package and for the removal of excess solder balls, comprising: a substrate having an array of solder pads; an adhesion layer on the solder pads; a stencil placed on top of the substrate and having a height between 1/4 times the diameter of one of the solder balls and 5/4 times the diameter of one of the balls, the stencil having an array of apertures corresponding to the array of solder pads and substantially exposing each of the solder pads of the array; a pallet for holding and transporting the substrate to the stencil and further along the manufacturing line; a dispenser for pouring solder balls in bulk over the stencil; a vibration device coupled to the station for urging the solder balls into the apertures of the stencil and onto the adhesion layer above the solder pads; and a moving directed column of air across the surface of the substrate to remove excess solder balls from the stencil.
Claim 24
Dependent Claim
23 words
The station of claim 19, wherein the stencil comprises a thin metallic surface having a height substantially the diameter of the solder balls.
Claim 25
Dependent Claim
13 words
The station of claim 19, wherein the stencil comprises a nickel plated surface.
Claim 26
Dependent Claim
24 words
The station of claim 19, wherein the dispenser for pour solder balls also serves as a reservoir where the excess solders balls are retained.
Claim 27
Dependent Claim
16 words
The station of claim 19, wherein the moving directed column of air comprises an air knife.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-07-10 | 1999-01-09 | 1999-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-07-10 | 2003-01-09 | 2003-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-07-10 | 2007-01-09 | 2007-07-11 | $7700.00 | Window Closed / Lapsed |