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Method of clocking integrated circuit chips

Assignee: International Business Machines Corp
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Filing: 1994-07-25
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Granted: 1995-07-04
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Expires: 2014-07-25
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Abstract

Abstract A method of clocking integrated circuit chips. A pulsed laser striking an integrated circuit module substrate is diffused through the substrate and exits the opposite surface as diffused light pulses. An integrated circuit chip mounted on the top surface of the substrate has optical receivers. The optical receivers receive pulsed energy from the diffused light pulses, converting pulsed light to electrical pulses that clock the chip.

Inventors

  • 👤 Robert R. Shaw
  • 👤 David T.-M. Shen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 05:37
CPC Classifications
H; H04; H04B; H04B10/00; H04B10/80; H04B10/801; G; G06; G06F; G06F1/00; G06F1/04; G06F1/10; G06F1/105

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 64 words
An integrated circuit assembly comprising: a substrate having at least one chip location on a side for mounting an integrated circuit chip; at least one integrated circuit chip having at least one optical receiver, said chip being mounted on said substrate in one said chip location; and a pulsed laser broadcasting pulses at said substrate and located at a predetermined distance from said substrate.
Claim 2
Dependent Claim 64 words
An integrated circuit assembly comprising: a substrate having at least one chip location on a side for mounting an integrated circuit chip; at least one integrated circuit chip having at least one optical receiver, said chip being mounted on said substrate in one said chip location; and a pulsed laser broadcasting pulses at said substrate and located at a predetermined distance from said substrate.
Claim 3
Dependent Claim 24 words
The integrated circuit arrangement of claim 1 wherein said pulsed laser is located on a side of said substrate opposite said chip mounting locations.
Claim 4
Dependent Claim 21 words
The integrated circuit arrangement assembly of claim 1 wherein said pulsed laser is broadcasting pulses at an edge of said substrate.
Claim 5
Dependent Claim 16 words
The integrated circuit arrangement of claim 1 wherein said predetermined distance is less than 1 cm.
Claim 6
Dependent Claim 18 words
The integrated circuit assembly of claim 1 wherein said substrate is comprised of Al 2 O 3 .
Claim 7
Dependent Claim 26 words
The integrated circuit assembly of claim 1 further comprising a plurality of light vias in said substrate, between said pulsed laser and said integrated circuit chips.
Claim 8
Dependent Claim 16 words
The integrated circuit assembly of claim 1 wherein said substrate is comprised of SiO 2 .
Claim 9
Dependent Claim 20 words
The integrated circuit assembly of claim 1 wherein said substrate is comprised of MgO - Al 2 O 3 .
Claim 10
Dependent Claim 14 words
The integrated circuit assembly of claim 1 wherein said substrate is comprised of MgO.
Claim 11
Dependent Claim 14 words
The integrated circuit assembly of claim 1 wherein said substrate is composed of mullite.
Claim 12
Dependent Claim 14 words
The integrated circuit assembly of claim 1 wherein said substrate is composed of cordierite.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-07-03 1999-01-02 1999-07-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-07-03 2003-01-02 2003-07-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-07-03 2007-01-02 2007-07-04 $7700.00 Window Closed / Lapsed

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