US5429912A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of dispensing fluid onto a wafer
Assignee: GlobalFoundries Singapore Pte Ltd
•
Filing: 1993-08-02
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Granted: 1995-07-04
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Expires: 2013-08-02
Abstract
Abstract A method for dispensing fluids on a semiconductor wafer wherein a wafer is mounted on a rotatable chunk, a fluid to be dispensed is introduced into a well through an inlet located adjacent the bottom of the well, rotating the chunk and moving a soft inpact dispensing nozzle, that draws bubble-free fluid from the bottom of the well, over the wafer, and dispensing the fluid at a low pressure and a short distance to the wafer surface.
Inventors
- 👤 Soon E. Neoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 08:15
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/30; G03F7/3021; G03F7/16; G03F7/162; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
175 words
A method for dispensing a developer fluid onto a wafer having a resist coating to be developed supported on rotating chuck in a soft impact manner comprising: filling a developer well which is associated with a soft impact tapered nozzle by introducing the developer fluid into said well through an inlet located adjacent the bottom of said well so as to reduce the possible formation of bubbles at a normal pressure of between about 6 and 11 psi.; moving said wafer onto said chuck and under said soft impact nozzle; rotating said chuck; dispensing said developer fluid, while said chuck is rotating from said well through said nozzle onto the central area of said wafer under controlled pressure of less than 3 psi and in said soft impact manner; stopping the flow of said developer fluid; developing said resist on said wafer without rotating said chuck, while said wafer is on said chuck; removing unreacted developer fluid by rotating said chuck and by rinsing and drying said resist; and removing said wafer from said chuck.
Claim 2
Independent Claim
175 words
A method for dispensing a developer fluid onto a wafer having a resist coating to be developed supported on rotating chuck in a soft impact manner comprising: filling a developer well which is associated with a soft impact tapered nozzle by introducing the developer fluid into said well through an inlet located adjacent the bottom of said well so as to reduce the possible formation of bubbles at a normal pressure of between about 6 and 11 psi.; moving said wafer onto said chuck and under said soft impact nozzle; rotating said chuck; dispensing said developer fluid, while said chuck is rotating from said well through said nozzle onto the central area of said wafer under controlled pressure of less than 3 psi and in said soft impact manner; stopping the flow of said developer fluid; developing said resist on said wafer without rotating said chuck, while said wafer is on said chuck; removing unreacted developer fluid by rotating said chuck and by rinsing and drying said resist; and removing said wafer from said chuck.
Claim 3
Dependent Claim
43 words
The method of claim 1 wherein said well and said nozzle are cleaned and rinsed of developer fluid with the liquid which does the cleaning and rinsing at the same time as said rinsing and drying with said liquid flowing onto said wafer.
Claim 4
Dependent Claim
23 words
The method of claim 1 wherein a shut-off valve for dispensing said developer fluid and said well are mounted directly above said nozzle.
Claim 5
Dependent Claim
37 words
The method of claim 1 wherein an inlet line is provided to said well that enters the well through said inlet located on the bottom of said well so as to reduce bubble formation in said well.
Claim 6
Dependent Claim
31 words
The method of claim 1 wherein the distance between said nozzle and said wafer is between about 5 to 15 millimeters for applying said developer to said wafer at soft impact.
Claim 7
Dependent Claim
32 words
The method of claim 1 wherein said developer fluid is dispensed from the nozzle spaced off-center from the center of said wafer, a distance in the range of 5 to 10 millimeters.
Claim 8
Independent Claim
203 words
A method for developing a resist on a wafer surface in a controlled and uniform manner across the wafer comprising: filling an intermediate developer well which is associated with and directly above a soft impact tapered nozzle by introducing the developer fluid into the bottom of said well so as to reduce the possible formation of bubbles at a normal pressure of between about 6 and 11 psi.; moving said wafer having a resist coating thereon onto a rotatable chuck and directly under said soft tapered impact nozzle; rotating said chuck; dispensing said developer fluid, while said chuck is rotating, from said intermediate well through said nozzle located beneath said well onto the central area of said wafer under controlled and said soft impact manner at a controlled pressure of less than about 3 psi.; stopping the flow of said developer fluid; developing said resist on said wafer without rotating said chuck, while said wafer is on said chuck; removing unreacted developer fluid by rotating said chuck and by spraying a cleaning liquid at said wafer for rinsing said developer from said wafer and simultaneously rinsing said developer from said well and nozzle onto said wafer; and removing said wafer from said chuck.
Claim 9
Independent Claim
203 words
A method for developing a resist on a wafer surface in a controlled and uniform manner across the wafer comprising: filling an intermediate developer well which is associated with and directly above a soft impact tapered nozzle by introducing the developer fluid into the bottom of said well so as to reduce the possible formation of bubbles at a normal pressure of between about 6 and 11 psi.; moving said wafer having a resist coating thereon onto a rotatable chuck and directly under said soft tapered impact nozzle; rotating said chuck; dispensing said developer fluid, while said chuck is rotating, from said intermediate well through said nozzle located beneath said well onto the central area of said wafer under controlled and said soft impact manner at a controlled pressure of less than about 3 psi.; stopping the flow of said developer fluid; developing said resist on said wafer without rotating said chuck, while said wafer is on said chuck; removing unreacted developer fluid by rotating said chuck and by spraying a cleaning liquid at said wafer for rinsing said developer from said wafer and simultaneously rinsing said developer from said well and nozzle onto said wafer; and removing said wafer from said chuck.
Claim 10
Dependent Claim
30 words
The method of claim 7 wherein said distance between said wafer and nozzle is between about 5 to 15 millimeters for applying said developer to said wafer at soft impact.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-07-03 | 1999-01-02 | 1999-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-07-03 | 2003-01-02 | 2003-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-07-03 | 2007-01-02 | 2007-07-04 | $7700.00 | Window Closed / Lapsed |