Abstract A method of manufacturing a semiconductor device includes the step of providing a reaction chamber (3) in which a layer of material (2) is deposited on a semiconductor slice (1) which is placed on a support (4) in the reaction chamber, a process gas being conducted towards the slice (1) through a gas inlet system (6) which is provided with a perforated gas inlet plate (9) arranged opposite the support (4). The reaction chamber is, between depositions, periodically cleaned through generation of a plasma between the support (4) and the gas inlet plate (9) in a gas mixture comprising fluorine or a fluorine compound and oxygen or an oxygen compound. A portion of the gas mixture which is comparatively rich in oxygen is conducted into the reaction chamber through the gas inlet system (6) with the gas inlet plate (9), while a portion of the gas mixture comparatively poor in oxygen is conducted into the reaction chamber through an auxiliary inlet system (23). The cleaning plasma as a result is comparatively rich in oxygen close to the gas inlet plate. An attack on the gas inlet plate by the plasma is counteracted in this way, and deposition on the gas inlet plate of polymers formed in the plasma is suppressed. An optimum cleaning plasma is present on average between the gas inlet plate (9) and the support (4).
A method of manufacturing a semiconductor device in which a reaction chamber is provided in which a layer of material is deposited on a semiconductor slice placed on a support in the reaction chamber, a process gas is conducted towards the slice through a gas inlet system which is provided with a perforated gas inlet plate arranged opposite the support, and between depositions the reaction chamber is cleaned through the generation of a plasma between the support and the gas inlet plate in a gas mixture comprising one of fluorine and a fluorine compound and one of oxygen and an oxygen compound, characterized in that a portion of the gas mixture which is rich in oxygen is conducted into the reaction chamber through the gas inlet system with the gas inlet plate, and a portion of the gas mixture which is poor in oxygen is conducted into the reaction chamber through an auxiliary inlet system.
Claim 2
Independent Claim
155 words
A method of manufacturing a semiconductor device in which a reaction chamber is provided in which a layer of material is deposited on a semiconductor slice placed on a support in the reaction chamber, a process gas is conducted towards the slice through a gas inlet system which is provided with a perforated gas inlet plate arranged opposite the support, and between depositions the reaction chamber is cleaned through the generation of a plasma between the support and the gas inlet plate in a gas mixture comprising one of fluorine and a fluorine compound and one of oxygen and an oxygen compound, characterized in that a portion of the gas mixture which is rich in oxygen is conducted into the reaction chamber through the gas inlet system with the gas inlet plate, and a portion of the gas mixture which is poor in oxygen is conducted into the reaction chamber through an auxiliary inlet system.
Claim 3
Dependent Claim
36 words
A method as claimed in claim 1, characterized in that the portion of the gas mixture rich in oxygen is also conducted into the reaction chamber through openings in the support arranged in the reaction chamber.
Claim 4
Dependent Claim
31 words
A method as claimed in claim 1, characterized in that the portion of the gas mixture rich in oxygen is free from fluorine and a fluorine compound from the gas mixture.
Claim 5
Dependent Claim
34 words
A method as claimed in claim 3, characterized in that the portion of the gas mixture rich in oxygen consists essentially of one of all oxygen and an all-oxygen compound from the gas mixture.
Claim 6
Dependent Claim
26 words
A method as claimed in claim 1, characterized in that the auxiliary inlet system comprises a tube surrounding the support and provided with gas outlet openings.