Patent US5421401A successfully refreshed from Google Patents.
US5421401A
Expired / Lapsed
US
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Compound clamp ring for semiconductor wafers
Assignee: Applied Materials Inc
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Filing: 1994-01-25
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Granted: 1995-06-06
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Expires: 2014-01-25
Abstract
Abstract A compound clamp ring secures a semiconductor wafer having a wafer flat portion to a wafer pedestal during wafer processing while maintaining a continuous seal between the wafer edges and the wafer pedestal to prevent leakage of coolant gases circulated at the backside of the wafer into the process environment. The clamp ring has an annular wafer clamp surface adapted to press a round portion of the wafer into sealing abutment with the wafer pedestal. A cavity formed in the clamp ring securely receives a comb-like array of resilient flexures that are adapted to apply a yieldable bias to the flat portion of the wafer to complete the seal between the wafer and the pedestal at the flat portion of the wafer; and encloses the flexures to shield the flexures from process gases.
Inventors
- 👤 Semyon Sherstinsky
- 👤 Mei Chang
- 👤 Charles C. Harris
- 👤 Alan F. Morrison
- 👤 Virendra V. S. Rana
- 👤 James F. Roberts
- 👤 Ashok K. Sinha
- 👤 Simon Tam
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:17
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/76; H10P72/7604; H10P72/7606; C; C23; C23C; C23C14/00; C23C14/22; C23C14/50; C23C16/00; C23C16/44; C23C16/458; C23C16/4582; C23C16/4583; C23C16/4585; Y; Y10; Y10S; Y10S269/00; Y10S269/903
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
227 words
A compound clamp ring for applying even and continuous pressure to an edge of a semiconductor wafer, including semiconductor wafers defining an edge having a round edge portion and a discontinuous flat edge portion, to sealingly engage the wafer edge with a wafer pedestal, comprising: a discontinuous first clamp surface having a substantially annular configuration adapted to contact and apply pressure to the round portion of the wafer edge; a second, resilient clamp surface which extends along a linear axis positioned as a secant of a circle defined by said first clamp surface; a cavity defined by said clamp ring and located generally adjacent to said second clamp surface; and a comb-like array of spaced resilient flexures secured to said clamp ring within said cavity; said comb-like array being substantially enclosed by said cavity at said second surface and adapted to conform to and apply pressure to the discontinuous portion of the wafer edge, wherein said second clamp surface is located within said discontinuity, said flexures including a bent portion adapted to engage with and urge said wafer discontinuous edge portion into sealing abutment with said wafer pedestal; wherein said clamp ring applies pressure to all edges of the wafer to complete a continuous seal between the wafer and said pedestal and minimize leakage of a coolant fluid from a wafer backside into a wafer process environment.
Claim 2
Dependent Claim
227 words
A compound clamp ring for applying even and continuous pressure to an edge of a semiconductor wafer, including semiconductor wafers defining an edge having a round edge portion and a discontinuous flat edge portion, to sealingly engage the wafer edge with a wafer pedestal, comprising: a discontinuous first clamp surface having a substantially annular configuration adapted to contact and apply pressure to the round portion of the wafer edge; a second, resilient clamp surface which extends along a linear axis positioned as a secant of a circle defined by said first clamp surface; a cavity defined by said clamp ring and located generally adjacent to said second clamp surface; and a comb-like array of spaced resilient flexures secured to said clamp ring within said cavity; said comb-like array being substantially enclosed by said cavity at said second surface and adapted to conform to and apply pressure to the discontinuous portion of the wafer edge, wherein said second clamp surface is located within said discontinuity, said flexures including a bent portion adapted to engage with and urge said wafer discontinuous edge portion into sealing abutment with said wafer pedestal; wherein said clamp ring applies pressure to all edges of the wafer to complete a continuous seal between the wafer and said pedestal and minimize leakage of a coolant fluid from a wafer backside into a wafer process environment.
Claim 3
Dependent Claim
33 words
The clamp ring of claim 1, further comprising: a secondary seal surface provided adjacent to the position assumed by said wafer discontinuous edge portion to enclose said clamp ring cavity during wafer clamping.
Claim 4
Dependent Claim
152 words
A compound clamp ring for applying even and continuous pressure to a semiconductor wafer edge having a round edge portion and a flat edge portion to sealingly engage said wafer edge with a wafer pedestal, comprising: a first clamp surface having a substantially annular configuration adapted to contact and apply pressure to the round portion of said wafer edge; said clamp ring defining a cavity that coincides with said wafer flat edge portion; and a comb-like array of spaced, elongated resilient flexures adapted to conform to and to apply pressure to said flat portion of said wafer edge, said flexures being secured to said clamp ring within said cavity and being enclosed thereby; wherein said clamp ring applies pressure to all edges of said wafer to complete a continuous seal between said wafer and said pedestal and minimize leakage of a coolant fluid from a wafer backside into a wafer process environment.
Claim 5
Dependent Claim
152 words
A compound clamp ring for applying even and continuous pressure to a semiconductor wafer edge having a round edge portion and a flat edge portion to sealingly engage said wafer edge with a wafer pedestal, comprising: a first clamp surface having a substantially annular configuration adapted to contact and apply pressure to the round portion of said wafer edge; said clamp ring defining a cavity that coincides with said wafer flat edge portion; and a comb-like array of spaced, elongated resilient flexures adapted to conform to and to apply pressure to said flat portion of said wafer edge, said flexures being secured to said clamp ring within said cavity and being enclosed thereby; wherein said clamp ring applies pressure to all edges of said wafer to complete a continuous seal between said wafer and said pedestal and minimize leakage of a coolant fluid from a wafer backside into a wafer process environment.
Claim 6
Dependent Claim
31 words
The clamp ring of claim 3, wherein said flexures include a bent portion adapted to engage with and urge said wafer flat edge portion into sealing abutment with said wafer pedestal.
Claim 7
Dependent Claim
16 words
The clamp ring of claim 3, wherein said clamp ring is made of a ceramic material.
Claim 8
Dependent Claim
14 words
The clamp ring of claim 3, wherein said clamp ring is made of alumina.
Claim 9
Dependent Claim
17 words
The clamp ring of claim 3, wherein said comb-like array of flexures is made of tempered aluminum.
Claim 10
Independent Claim
145 words
A method for applying even and continuous pressure to a semiconductor wafer edge having a round edge portion and a flat edge portion to sealingly engage said wafer edge with a wafer pedestal, comprising the steps of: contacting and applying pressure to the round portion of said wafer edge with a first clamp surface having a substantially annular configuration; and applying pressure to said flat portion of said wafer edge with a comb-like array of resilient flexures adapted to conform to said flat portion of said wafer, said flexures being secured to said clamp ring within a cavity defined thereby and being enclosed within said cavity; wherein said clamp ring applies pressure to all edges of said wafer to complete a continuous seal between said wafer and said pedestal and minimize leakage of a coolant fluid from a wafer backside into a wafer process environment.
Claim 11
Independent Claim
145 words
A method for applying even and continuous pressure to a semiconductor wafer edge having a round edge portion and a flat edge portion to sealingly engage said wafer edge with a wafer pedestal, comprising the steps of: contacting and applying pressure to the round portion of said wafer edge with a first clamp surface having a substantially annular configuration; and applying pressure to said flat portion of said wafer edge with a comb-like array of resilient flexures adapted to conform to said flat portion of said wafer, said flexures being secured to said clamp ring within a cavity defined thereby and being enclosed within said cavity; wherein said clamp ring applies pressure to all edges of said wafer to complete a continuous seal between said wafer and said pedestal and minimize leakage of a coolant fluid from a wafer backside into a wafer process environment.
References Cited (Backward Citations)
US3711081A
Cited
US4473455A
Cited
JPS6223102A
Cited
US4915367A
Cited
US4978412A
Cited
US5094885A
Cited
US5316278A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-06-05 | 1998-12-05 | 1999-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-06-05 | 2002-12-05 | 2003-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-06-05 | 2006-12-05 | 2007-06-06 | $7700.00 | Window Closed / Lapsed |