US5420689A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High speed illumination system for microelectronics inspection
Assignee: Individual
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Filing: 1993-03-01
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Granted: 1995-05-30
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Expires: 2013-03-01
Abstract
Abstract This invention is a high speed illumination apparatus and technique which highlights bond wires, ball bonds, bond wedges and microcircuit chips separately against a similar substrate background for manual or high speed automatic inspection of microelectronics assemblies. Preferred angles of illumination are provided which reflect off the different specular surfaces of the bond wires, wire bonds, and bond wedges, providing improved background contrast. Light projected on the flat surfaces of microchip bodies tends to be absorbed, producing a negative contrast shadow if the other elements are illuminated in parallel. Formation of the multiple light rings starts with light generated by a tungsten lamp, collimation by a condenser lens, then passage through a liquid crystal light valve having a plurality of circular active transmission areas. A projector lens receives both rings of light and projects the larger ring on an ellipsoidal reflector which redirects the light onto the microcircuit at the large off-verical axis angle. The projector lens also focuses the more narrow beam of light on a torroidal Fresnel lens mounted above the microcircuit, and which also redirects the beam at the smaller off vertical axis angle. By alternating the light transmission through each of these rings at high speed, reflective signatures of interconnect wires, ball bonds, bond wedges and microcircuit chips can be captured by the an objective lens and mirror reflected to light responsive cameras. When displayed, the resulting unique signatures are easily distinguishable.
Inventors
- 👤 Bernard Siu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:01
CPC Classifications
G; G01; G01N; G01N21/00; G01N21/84; G01N21/88; G01N21/95; G01N21/956; G01R; G01R31/00; G01R31/28; G01R31/302; G01R31/308; G01R31/311; H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/075; H10W72/07531; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
307 words
Illumination apparatus for inspection of microelectronic assemblies having internal microcircuit chips with terminals electrically connected by wire bonding means to circuit conductive traces on a mounting substrate, wherein chip bodies and interconnection elements including wires, ball bonds, and wedge bonds which must be visually discriminated against similar reflective backgrounds, comprising: a plurality of concentric light ring source means for illumination of said chips and interconnect elements placed under a center of each said concentric light ring, wherein a first said light ring source is comprised of: a common source of focused light; condenser means for collimating light from said common source; liquid crystal light valve means having a first active area means for forming a wide angle beam of light; and projection lens means for receiving and redirecting said wide angle beam of light from said liquid crystal light valve means; a plurality of focusing means for directing each said light ring source at a predetermined angle of incidence relative to said microcircuit so that optimal contrast may be obtained between reflections from said chip bodies and interconnect elements and similar background trace reflections, wherein a first said focusing means comprises; focusing means for receiving said wide angle beam of light from first said light ring source and redirecting said wide angle beam of light at an illumination angle off vertical which is sufficiently large so as to separate the reflections from said rounded inspection objects, including said bond wires and ball bond, from conductor background traces made of a similar material; first optical means for collecting said light reflections from said chip bodies and interconnection elements emanating along a fixed axis through the concentric centers of each said light ring source and redirecting said reflections for viewing, and viewing means for visual inspection of said chip bodies and interconnect elements in order to determine bonding defects.
Claim 2
Dependent Claim
307 words
Illumination apparatus for inspection of microelectronic assemblies having internal microcircuit chips with terminals electrically connected by wire bonding means to circuit conductive traces on a mounting substrate, wherein chip bodies and interconnection elements including wires, ball bonds, and wedge bonds which must be visually discriminated against similar reflective backgrounds, comprising: a plurality of concentric light ring source means for illumination of said chips and interconnect elements placed under a center of each said concentric light ring, wherein a first said light ring source is comprised of: a common source of focused light; condenser means for collimating light from said common source; liquid crystal light valve means having a first active area means for forming a wide angle beam of light; and projection lens means for receiving and redirecting said wide angle beam of light from said liquid crystal light valve means; a plurality of focusing means for directing each said light ring source at a predetermined angle of incidence relative to said microcircuit so that optimal contrast may be obtained between reflections from said chip bodies and interconnect elements and similar background trace reflections, wherein a first said focusing means comprises; focusing means for receiving said wide angle beam of light from first said light ring source and redirecting said wide angle beam of light at an illumination angle off vertical which is sufficiently large so as to separate the reflections from said rounded inspection objects, including said bond wires and ball bond, from conductor background traces made of a similar material; first optical means for collecting said light reflections from said chip bodies and interconnection elements emanating along a fixed axis through the concentric centers of each said light ring source and redirecting said reflections for viewing, and viewing means for visual inspection of said chip bodies and interconnect elements in order to determine bonding defects.
Claim 3
Dependent Claim
39 words
Illumination apparatus according to claim 1, wherein said first focusing means comprises an ellipsoidal reflector disposed so as to receive said wide angle beam of light and to redirect said beam on said microcircuit at said large incidence angle.
Claim 4
Dependent Claim
81 words
Illumination apparatus according to claim 1, wherein said plurality of concentric light ring source means further includes a second concentric light ring source comprised of: said common source of focused light; said condenser means for collimating light from said common source; said liquid crystal light valve means having a second active area means for forming a narrow angle beam of light; and said projection lens means for receiving said narrow angle beam of light from said liquid crystal light valve means.
Claim 5
Dependent Claim
78 words
Illumination apparatus according to claim 3, wherein said focusing means further comprises second focusing means disposed so as to receive said narrow angle beam of light from said projection lens and to redirect said narrow angle beam of light on said microcircuit at an illumination angle off vertical which is sufficiently small so as to separate the reflection from inspection objects having variable sloped surfaces, including said wedge bonds, from substrate background traces made of a similar material.
Claim 6
Dependent Claim
23 words
Illumination apparatus according to claim 4, further comprising light switching means for sequential activation of illumination from each of said light ring sources.
Claim 7
Dependent Claim
78 words
Illumination apparatus according to claim 4, further comprising light switching means for simultaneous activation of said first and second light valve active area means so as to provide both the large incidence angle beam of light from said first focusing means and the small incidence angle beam of light from said second focusing means in order to separate reflections from inspection objects having fiat body surfaces, including said chip bodies, from other substrate and inspection object background reflections.
Claim 8
Dependent Claim
21 words
Illumination apparatus according to claim 6, wherein both of said light switching means comprises electrical switching of said light valve means.
Claim 9
Dependent Claim
19 words
Illumination apparatus according to claim 7, wherein said large illumination angle is between 75 and 85 degrees off vertical.
Claim 10
Dependent Claim
19 words
Illumination apparatus according to claim 8, wherein said small illumination angle is between 25 and 35 degrees off vertical.
Claim 11
Dependent Claim
18 words
Illumination apparatus according to claim 9, wherein said interconnection elements and conductor background traces are made of gold.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-05-29 | 1998-11-28 | 1999-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-05-29 | 2002-11-28 | 2003-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-05-29 | 2006-11-28 | 2007-05-30 | $7700.00 | Window Closed / Lapsed |