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US5420060A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making contract-free floating-gate memory array with silicided buried bitlines and with single-step defined floating gates

Assignee: Texas Instruments Inc
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Filing: 1993-09-13
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Granted: 1995-05-30
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Expires: 2013-09-13
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Abstract

Abstract A contact-free floating-gate non-volatile memory cell array and process with silicided NSAG bitlines and with source/drain regions buried beneath relatively thick silicon oxide. The bitlines have a relatively small resistance, eliminating the need for parallel metallic conductors with numerous bitline contacts. The array has relatively small bitline capacitance and may be constructed having relatively small dimensions. Isolation between bitlines is by thick field oxide. Wordlines may be formed from silicided polycrystalline or other material with low resistivity. Coupling of programming and erasing voltages to the floating gate is improved by extending the gates over the thick field oxide and perhaps by using an insulator with relatively high dielectric constant between the control gate and the floating gate. The sides of the floating gates are defined with a single patterning step. The resulting structure is a dense cross-point array of programmable memory cells.

Inventors

  • 👤 Manzur Gill
  • 👤 Howard L. Tigelaar

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 19:06
CPC Classifications
H; H10; H10B; H10B41/00; H10B41/30; H10B69/00; H10D; H10D30/00; H10D30/60; H10D30/68; H10D30/6891

Claims Analysis

Total Claims: 22
Claim 1
Independent Claim 291 words
A method for making a non-volatile memory cell array including bitlines and wordlines in a face of a semiconductor substrate of first conductivity type, comprising the steps of: forming field oxide regions with underlying channel stop regions in said face, said field oxide regions separated by at least channels; growing a gate oxide layer over said channels and said field oxide regions; applying a first conductive layer on said face over said gate oxide layer; applying a second conductive layer on said face overlying and insulated from said first conductive layer by an inter-level dielectric layer; forming a protective layer over said second conductive layer; patterning said protective layer and forming control-gates from said second conductive layer and forming floating-gates from said first conductive layer such that said floating:gates are substantially centered over said channels between said field oxide regions and such that said gates extend over a part of said field oxide regions, said floating-gates having sides; forming a single-step, thermally grown oxide layer on at least said sides of said floating-gates; using at least said control-gates as a mask, implanting an impurity material of second conductivity type; forming said bitlines in the implanted regions of said face; siliciding said bitlines; forming an insulating oxide region in the space between said control- and floating-gates and over said bitlines and said field oxide regions; removing a part of said insulating oxide region and substantially all of said protective layer to form a surface substantially planar including the upper surface of said control gates; applying a third conductive layer to said substantially planar surface; and patterning said third conductive layer and etching through said third conductive layer to form said wordlines over said control gates and in contact with said control gates.
Claim 2
Independent Claim 291 words
A method for making a non-volatile memory cell array including bitlines and wordlines in a face of a semiconductor substrate of first conductivity type, comprising the steps of: forming field oxide regions with underlying channel stop regions in said face, said field oxide regions separated by at least channels; growing a gate oxide layer over said channels and said field oxide regions; applying a first conductive layer on said face over said gate oxide layer; applying a second conductive layer on said face overlying and insulated from said first conductive layer by an inter-level dielectric layer; forming a protective layer over said second conductive layer; patterning said protective layer and forming control-gates from said second conductive layer and forming floating-gates from said first conductive layer such that said floating:gates are substantially centered over said channels between said field oxide regions and such that said gates extend over a part of said field oxide regions, said floating-gates having sides; forming a single-step, thermally grown oxide layer on at least said sides of said floating-gates; using at least said control-gates as a mask, implanting an impurity material of second conductivity type; forming said bitlines in the implanted regions of said face; siliciding said bitlines; forming an insulating oxide region in the space between said control- and floating-gates and over said bitlines and said field oxide regions; removing a part of said insulating oxide region and substantially all of said protective layer to form a surface substantially planar including the upper surface of said control gates; applying a third conductive layer to said substantially planar surface; and patterning said third conductive layer and etching through said third conductive layer to form said wordlines over said control gates and in contact with said control gates.
Claim 3
Dependent Claim 25 words
A method according to claim 1 including forming insulating oxide strips on said face between said wordlines and over portions of said insulating oxide region.
Claim 4
Dependent Claim 18 words
A method according to claim 1 wherein said first impurity-type is P-type and said second impurity-type is N-type.
Claim 5
Dependent Claim 15 words
A method according to claim 1 wherein said first and second layers are polycrystalline silicon.
Claim 6
Dependent Claim 25 words
A method according to claim 1 wherein sidewall oxide spacers are formed adjacent said control-gates and said floating-gates after said implanting of an impurity material.
Claim 7
Dependent Claim 25 words
A method according to claim 1 wherein sidewall oxide spacers are formed adjacent said control-gates and said floating-gates before said implanting of an impurity material.
Claim 8
Dependent Claim 26 words
A method according to claim 1 wherein the capacitance associated with said gate oxide layer is less than the capacitance associated with said inter-level dielectric layer.
Claim 9
Dependent Claim 14 words
A method according to claim 1 wherein said inter-level dielectric layer includes silicon oxide.
Claim 10
Dependent Claim 13 words
A method according to claim 1 wherein said inter-level dielectric layer includes oxide-nitride-oxide.
Claim 11
Dependent Claim 14 words
A method according to claim 1 wherein said inter-level dielectric layer includes aluminum oxide.
Claim 12
Dependent Claim 14 words
A method according to claim 1 wherein said inter-level dielectric layer includes aluminum nitride.
Claim 13
Dependent Claim 14 words
A method according to claim 1 wherein said inter-level dielectric layer includes tantalum pentaoxide.
Claim 14
Dependent Claim 23 words
A method according to claim 1 wherein two impurities are implanted to form graded junctions in at least alternating ones of said bitlines.
Claim 15
Dependent Claim 40 words
A method according to claim 1 wherein two impurities are implanted to form graded junctions in at least alternating ones of said bitlines, wherein said implantation is made after formation of sidewall oxide spacers adjacent said control-gates and said floating-gates.
Claim 16
Dependent Claim 14 words
A method according to claim 1 wherein said third conductive layer is polycrystalline silicon.
Claim 17
Dependent Claim 15 words
A method according to claim 1 wherein said third conductive layer is silicided polycrystalline silicon.
Claim 18
Dependent Claim 14 words
A method according to claim 1 wherein said third conductive layer is refractory metal.
Claim 19
Dependent Claim 17 words
A method according to claim 1 wherein said third conductive layer is layered refractory metal and polysilicon.
Claim 20
Dependent Claim 17 words
A method according to claim 1 wherein said underlying channel stop region is formed using boron doping.
Claim 21
Dependent Claim 76 words
A method according to claim 1 wherein part of said insulating region is not removed and said third conductive layer is not formed and patterned and in which wordline trenches are formed in said insulating oxide region to the upper conducting surfaces of said control gates, a metal layer is deposited on said insulating oxide region and in said trenches, and a part of said metal layer is removed to form metal wordlines in said trenches.
Claim 22
Dependent Claim 41 words
A method according to claim 1 wherein an oxide layer is deposited after said removal of a part of said insulating oxide region, wordline trenches are formed in said oxide layer, said third conductive layer is removed to form said wordlines.

References Cited (Backward Citations)

US4720323A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-05-29 1998-11-28 1999-05-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-05-29 2002-11-28 2003-05-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-05-29 2006-11-28 2007-05-30 $7700.00 Window Closed / Lapsed

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