Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
131 words
A method of fabricating an electrostatic switch on a substrate comprising the steps of: a) forming a first layer of electrically conductive material over a surface of said substrate; b) forming said first layer of electrically conductive material into a first electrical contact means; c) forming a layer of electrically insulating material over said first electrical contact means; d) forming a second layer of electrically conductive material over said layer of electrically insulating material; e) forming said second layer of electrically conductive material into a second electrical contact means having a predetermined spaced relationship with respect to said first electrical contact means; and f) creating a void in said layer of electrically insulating material between at least a portion of said first electrical contact means and said second electrical contact means.
Claim 2
Independent Claim
131 words
A method of fabricating an electrostatic switch on a substrate comprising the steps of: a) forming a first layer of electrically conductive material over a surface of said substrate; b) forming said first layer of electrically conductive material into a first electrical contact means; c) forming a layer of electrically insulating material over said first electrical contact means; d) forming a second layer of electrically conductive material over said layer of electrically insulating material; e) forming said second layer of electrically conductive material into a second electrical contact means having a predetermined spaced relationship with respect to said first electrical contact means; and f) creating a void in said layer of electrically insulating material between at least a portion of said first electrical contact means and said second electrical contact means.
Claim 3
Dependent Claim
102 words
The method in accordance with claim 1 wherein said substrate comprises a semiconductor substrate having electrical contact regions disposed therein, said method additionally comprising the steps of: g) forming a first layer of electrically insulating material which is interposed between a surface of the semiconductor substrate and the overlying electrically insulating material; h) forming at least one opening in said first layer of electrically insulating material to expose an underlying electrical contact region; and i) forming said first layer of electrically conductive material over said first electrically insulating layer into said opening and into electrical contact with said exposed electrical contact region.
Claim 4
Dependent Claim
54 words
The method in accordance with claim 2 wherein step i) comprises the steps of: (j) forming a first adhesion layer over the first layer of electrically insulating material into said opening and into electrical contact with said exposed electrical contact region; and (k) forming a first electrically conductive layer over the first adhesion layer.
Claim 5
Dependent Claim
91 words
The method in accordance with claim 1 wherein step b) comprises forming said first layer of electrically conductive material into a first electrical contact means having a middle portion which is secured at least at each end to underlying structure; and wherein step e) comprises forming said second layer of electrically conductive material into a second electrical contact having a middle portion which overlies the middle portion of the first electrical contact means and which is secured at least at each end to said underlying second layer of electrically conductive material.
Claim 6
Dependent Claim
92 words
The method in accordance with claim 1 wherein step b) comprises forming said first layer of electrically conductive material into a first electrically contact means having a cantilevered middle portion which is secured at one end only to underlying structures; and wherein step e) comprises forming said second layer of electrically conductive means into a second electrical contact means having a middle portion which overlies said cantilevered middle portion of said first electrical contact means and which is secured at least at each end to said underlying layer of electrically insulating material.
Claim 7
Dependent Claim
112 words
The method in accordance with claim 1 additionally comprising, after step e), the steps of: l) forming a second layer of electrically insulating material over said second electrical contact means; m) forming a third layer of electrically conductive material over said second layer of said electrically insulating material; n) forming said third layer of electrically conductive material into a third electrical contact means having predetermined space relationship with respect to the underlying first and second electrical contact means; and o) creating a void in said layer of electrically insulating material and said second layer of electrically insulating material between at least a portion of said first, second and third electrical contact means.
Claim 8
Dependent Claim
34 words
The method in accordance with claim 6 wherein said second electrical contact means has a middle portion which is secured at least at both ends thereof to said underlying layer of electrically insulating material.
Claim 9
Dependent Claim
33 words
The method in accordance with claim 6 wherein said second electrical contact means has a middle portion which is secured at only one end thereof to said underlying layer of electrically insulating material.