Abstract A printed circuit board (23) having a plurality of solder coated contact pads (24, 26) for the surface mounting of electrical components (10 1 ) thereon. Each pad (24, 26) has a rectangular portion and a triangular portion extending in the direction of the component's body (18) so as to reduce the amount of solder (28) located under the body (18) while not disadvantageously affecting the tolerance with which connector caps (20, 22) of the components (10 1 ) can be mounted on, and bonded to, the pads (24, 26). This arrangement inhibits the formation of solder droplets on the printed circuit board (23) during the bonding process. At least one of the components fixed to the connector pads has an elongated electrically insulating body portion provided at its ends with connector portions which are respectively bonded to the connector pads. The dimension of the rectangular portion of each pad which is at right angles to the longitudinal axis of the associated component is less than the transverse dimension of the associated connector portion of the associated component. The connector portions of the electrical component extend over and are soldered to parts of both the rectangular and the triangular portions of each of the pads.
A printed circuit board assembly for soldered surface mounted electrical components which reduces the occurrence of solder droplets during assembly, comprising: a printed circuit board; at least one pair of connector pads fixed to the printed circuit board, each said connector pad having a rectangular portion and a triangular portion contiguous thereto with the triangular portions extending toward each other; a solder paste portion on each of said pads and having the same dimensions and configuration as its respective pad; and a surface mounted electrical component fixed to each pair of pads by said solder paste portions; the electrical component fixed to the connector pads having an elongated electrically insulating body portion provided at its ends with connector portions which are respectively bonded to the connector pads; the dimension of the rectangular portion of each pad which is at right angles to the longitudinal axis of the associated component being less than the transverse dimension of the associated connector portion of the associated component.
Claim 2
Dependent Claim
164 words
A printed circuit board assembly for soldered surface mounted electrical components which reduces the occurrence of solder droplets during assembly, comprising: a printed circuit board; at least one pair of connector pads fixed to the printed circuit board, each said connector pad having a rectangular portion and a triangular portion contiguous thereto with the triangular portions extending toward each other; a solder paste portion on each of said pads and having the same dimensions and configuration as its respective pad; and a surface mounted electrical component fixed to each pair of pads by said solder paste portions; the electrical component fixed to the connector pads having an elongated electrically insulating body portion provided at its ends with connector portions which are respectively bonded to the connector pads; the dimension of the rectangular portion of each pad which is at right angles to the longitudinal axis of the associated component being less than the transverse dimension of the associated connector portion of the associated component.
Claim 3
Dependent Claim
37 words
The printed circuit board assembly of claim 1, in which the connector portions of the electrical component extend over and are soldered to parts of both the rectangular and the triangular portions of each of said pads.