Patent US5406210A successfully refreshed from Google Patents.
US5406210A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and method for testing bare dies with low contact resistance between the die and testing station
Assignee: BAE Systems Electronics Ltd
•
Filing: 1993-02-03
•
Granted: 1995-04-11
•
Expires: 2013-02-03
Abstract
Abstract A bare die testing apparatus comprising a multilayer interconnection structure 10 having a testing station 11 for testing the bare die 20, testing circuits and components 12 arranged in said structure adjacent the testing station 11, said testing station 11 having a plurality of microbumps 17 of conductive material soldered onto wettable metallization pads 18 located on interconnection trace terminations of the interconnection structure, said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components 12. The microbumps 17 are distributed in a pattern corresponding to the pattern of contact pads 19 on a bare die 20 to be tested. A method of testing bare dies by the bare-die testing apparatus embodying the invention, the method including optically aligning the contact pads 19 of a bare die 20 under test with the microbumps 17 of the testing station 11, contacting the aligned contact pads 19 of the bare die 20 with the corresponding microbumps 17 of the testing station 11 and applying appropriate pressure on to bare die 20 to ensure desired low contact resitstance between the microbumps 17 and the contact pads 14.
Inventors
- 👤 David J. Pedder
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:33
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
105 words
A bare die testing apparatus, comprising: a multichip module (MCM) substrate having a multilayer interconnection structure including a testing station for testing a bare die; testing circuits and components mounted and interconnected on said substrate adjacent the testing station; said testing station having a plurality of micro-spheres of conductive material soldered and self-aligned onto wettable metallization pads located on interconnection trace terminations of the interconnection structure; said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components; and said micro-spheres being distributed to a pattern corresponding to a pattern of contact pads on the bare die to be tested.
Claim 2
Dependent Claim
105 words
A bare die testing apparatus, comprising: a multichip module (MCM) substrate having a multilayer interconnection structure including a testing station for testing a bare die; testing circuits and components mounted and interconnected on said substrate adjacent the testing station; said testing station having a plurality of micro-spheres of conductive material soldered and self-aligned onto wettable metallization pads located on interconnection trace terminations of the interconnection structure; said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components; and said micro-spheres being distributed to a pattern corresponding to a pattern of contact pads on the bare die to be tested.
Claim 3
Dependent Claim
29 words
An apparatus as claimed in claim 1, in which the multilayer interconnection structure includes a ground plane, a power plane and at least one layer for signal trace routing.
Claim 4
Dependent Claim
23 words
An apparatus as claimed in claim 1, in which the multilayer structure is a multilayer aluminum-polyimide metallization structure formed on a silicon substrate.
Claim 5
Dependent Claim
23 words
An apparatus as claimed in claim 1, in which the micro-spheres are made of copper or copper alloy plated with nickel or gold.
Claim 6
Dependent Claim
41 words
An apparatus as claimed in claim 1, in which the micro-spheres of the testing station are plated or vapour deposited solder bumps of gold-tin eutectic composition, the reflow of the solder bumps providing a desired radius of curvature of the microspheres.
Claim 7
Dependent Claim
16 words
An apparatus as claimed in claim 1, including resistors and capacitors integrated into said MCM substrate.
Claim 8
Independent Claim
174 words
A method of testing bare dies by a bare die testing apparatus including a multichip module (MCM) substrate having a multilayer interconnection structure including a testing station for testing a bare die; testing circuits and components mounted and interconnected on said substrate adjacent the testing station; said testing station having a plurality of micro-spheres of conductive material soldered and self-aligned onto wettable metallization pads located on interconnection trace terminations of the interconnection structure; said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components; said micro-spheres being distributed to a pattern corresponding to a pattern of contact pads on the bare die to be tested, the method comprising the step of: optically aligning the contact pads of the bare die under test with the micro-spheres of the testing station; contacting the aligned contact pads of the bare die with the corresponding micro-spheres of the testing station; and applying appropriate pressure on to the bare die to ensure desired low contact resistance between the micro-spheres and the contact pads.
Claim 9
Independent Claim
174 words
A method of testing bare dies by a bare die testing apparatus including a multichip module (MCM) substrate having a multilayer interconnection structure including a testing station for testing a bare die; testing circuits and components mounted and interconnected on said substrate adjacent the testing station; said testing station having a plurality of micro-spheres of conductive material soldered and self-aligned onto wettable metallization pads located on interconnection trace terminations of the interconnection structure; said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components; said micro-spheres being distributed to a pattern corresponding to a pattern of contact pads on the bare die to be tested, the method comprising the step of: optically aligning the contact pads of the bare die under test with the micro-spheres of the testing station; contacting the aligned contact pads of the bare die with the corresponding micro-spheres of the testing station; and applying appropriate pressure on to the bare die to ensure desired low contact resistance between the micro-spheres and the contact pads.
References Cited (Backward Citations)
US4426773A
Cited
US4585991A
Cited
EP0131375A1
Cited
EP0304868A2
Cited
WO1989011659A1
Cited
EP0350609A2
Cited
US4975637A
Cited
WO1991012706A1
Cited
GB2246662A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-10 | 1998-10-10 | 1999-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-10 | 2002-10-10 | 2003-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-10 | 2006-10-10 | 2007-04-11 | $7700.00 | Window Closed / Lapsed |