US5399232A
Expired / Lapsed
US
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Microfabricated cantilever stylus with integrated pyramidal tip
Assignee: Leland Stanford Junior University
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Filing: 1994-01-07
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Granted: 1995-03-21
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Expires: 2014-01-07
Abstract
Abstract A dielectric cantilever arm stylus with an integrally formed pyramidal tip is provided. The tip is molded in a pyramidal pit etched in a later-removed (100) silicon substrate. An integrally-formed cantilever arm is also formed as the tip is being formed. Various thin film materials form the cantilever arm and the tip. In one embodiment of the invention, the dielectric is silicon nitride. The cantilever arm is anodically bonded to a glass block.
Inventors
- 👤 Thomas R. Albrecht
- 👤 Shinya Akamine
- 👤 Thomas E. Carver
- 👤 Mark J. Zdeblick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 04:18
CPC Classifications
G; G01; G01Q; G01Q60/00; G01Q60/24; G01Q60/38; B; B82; B82Y; B82Y35/00; G01Q70/00; G01Q70/08; G01Q70/10; G01Q70/14; G01Q70/16
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
151 words
A method of fabricating a micromechanical sensor having a cantilever with a tip at one end, comprising the steps of: providing a wafer substrate having top and bottom sides; coating said top side of said wafer substrate with a first insulating layer and coating said bottom side of said wafer substrate with a second insulating layer; after said coating steps, forming an opening in said first insulating layer; etching a trench in said top side of said wafer substrate through the opening in said first insulating layer; removing said first insulating layer; coating the top side of said wafer substrate and said trench with a desired cantilever beam material; patterning said cantilever beam material to form a cantilever arm with one end overlapping said trench in said wafer substrate; and completely removing said second insulating layer and then completely removing said wafer substrate from the bottom side of said wafer substrate.
Claim 2
Independent Claim
151 words
A method of fabricating a micromechanical sensor having a cantilever with a tip at one end, comprising the steps of: providing a wafer substrate having top and bottom sides; coating said top side of said wafer substrate with a first insulating layer and coating said bottom side of said wafer substrate with a second insulating layer; after said coating steps, forming an opening in said first insulating layer; etching a trench in said top side of said wafer substrate through the opening in said first insulating layer; removing said first insulating layer; coating the top side of said wafer substrate and said trench with a desired cantilever beam material; patterning said cantilever beam material to form a cantilever arm with one end overlapping said trench in said wafer substrate; and completely removing said second insulating layer and then completely removing said wafer substrate from the bottom side of said wafer substrate.
Claim 3
Dependent Claim
11 words
The method of claim 1, wherein the wafer substrate is silicon.
Claim 4
Dependent Claim
31 words
The method of claim 1, wherein said etching step consists of anisotropically etching said wafer substrate through said opening to form a pyramidal pit in the surface of said wafer substrate.
Claim 5
Dependent Claim
22 words
The method of claim 3, wherein said coating step forms a pyramidal tip projecting into the top surface of said wafer substrate.
Claim 6
Dependent Claim
17 words
The method of claim 1, wherein said cantilever beam material is a thin film of silicon nitride.
Claim 7
Dependent Claim
39 words
The method of claim 1, wherein said cantilever beam material is selected from the group consisting of deposited SiO 2 , Al 2 O 3 , Au, Ni, Si 3 N 4 , and thermally grown SiO 2 .
Claim 8
Independent Claim
174 words
A method of fabricating a micromechanical sensor having a cantilever with a tip at one end comprising the steps of: providing a wafer substrate having top and bottom sides; coating said top side of said wafer substrate with a first insulating layer and coating said bottom side of said wafer substrate with a second insulating layer; after said coating steps, forming an opening in said first insulating layer; etching a trench in said top side of said wafer substrate through the opening in said first insulating layer; removing said first insulating layer; coating said trench in the top surface of said wafer substrate with a desired tip material and coating the top surface of said wafer substrate with a desired cantilever material; patterning the cantilever and tip materials coated on the top surface of said wafer substrate to form a cantilever arm with one end overlapping said trench in said wafer substrate; and completely removing said second insulating layer and then completely removing said wafer substrate from the bottom side of said wafer substrate.
Claim 9
Independent Claim
174 words
A method of fabricating a micromechanical sensor having a cantilever with a tip at one end comprising the steps of: providing a wafer substrate having top and bottom sides; coating said top side of said wafer substrate with a first insulating layer and coating said bottom side of said wafer substrate with a second insulating layer; after said coating steps, forming an opening in said first insulating layer; etching a trench in said top side of said wafer substrate through the opening in said first insulating layer; removing said first insulating layer; coating said trench in the top surface of said wafer substrate with a desired tip material and coating the top surface of said wafer substrate with a desired cantilever material; patterning the cantilever and tip materials coated on the top surface of said wafer substrate to form a cantilever arm with one end overlapping said trench in said wafer substrate; and completely removing said second insulating layer and then completely removing said wafer substrate from the bottom side of said wafer substrate.
Claim 10
Dependent Claim
31 words
The method of claim 7, wherein said etching step consists of anisotropically etching said wafer substrate through said opening to form a pyramidal pit in the surface of said wafer substrate.
Claim 11
Dependent Claim
22 words
The method of claim 8, wherein said coating step forms a pyramidal tip projecting into the top surface of said wafer substrate.
Claim 12
Dependent Claim
11 words
The method of claim 7, wherein the wafer substrate is silicon.
Claim 13
Dependent Claim
16 words
The method of claim 7, wherein said cantilever material is a thin film of silicon nitride.
Claim 14
Dependent Claim
38 words
The method of claim 7, wherein said cantilever material is selected from the group consisting of deposited SiO 2 , Al 2 O 3 , Au, Ni, Si 3 N 4 , and thermally grown SiO 2 .
Claim 15
Independent Claim
187 words
A method of fabricating a micromechanical sensor having a cantilever with a tip at one end, comprising the steps of: providing a wafer substrate having top and bottom sides; coating said top side of said wafer substrate with a first insulating layer and coating said bottom side of said wafer substrate with a second insulating layer; after said coating steps, forming an opening in said first insulating layer; etching a trench in said top side of said wafer substrate through the opening in said first insulating layer; removing said first insulating layer; coating the top side of said wafer substrate and said trench with a desired cantilever beam material; patterning said cantilever beam material to form a cantilever arm with one end overlapping said trench in said wafer substrate; connecting a second substrate to an end of said cantilever arm distal said tip, said second substrate being connected to the surface of said cantilever arm so that said tip projects away from said second substrate; and completely removing said second insulating layer and then completely removing said wafer substrate from the bottom side of said wafer substrate.
Claim 16
Independent Claim
187 words
A method of fabricating a micromechanical sensor having a cantilever with a tip at one end, comprising the steps of: providing a wafer substrate having top and bottom sides; coating said top side of said wafer substrate with a first insulating layer and coating said bottom side of said wafer substrate with a second insulating layer; after said coating steps, forming an opening in said first insulating layer; etching a trench in said top side of said wafer substrate through the opening in said first insulating layer; removing said first insulating layer; coating the top side of said wafer substrate and said trench with a desired cantilever beam material; patterning said cantilever beam material to form a cantilever arm with one end overlapping said trench in said wafer substrate; connecting a second substrate to an end of said cantilever arm distal said tip, said second substrate being connected to the surface of said cantilever arm so that said tip projects away from said second substrate; and completely removing said second insulating layer and then completely removing said wafer substrate from the bottom side of said wafer substrate.
Claim 17
Dependent Claim
48 words
The method of claim 13, wherein said etching step consists of anisotropically etching said wafer substrate through said opening to form a pyramidal pit in the surface of said wafer substrate; and said coating step forms a pyramidal tip projecting into the top surface of said wafer substrate.
Claim 18
Dependent Claim
11 words
The method of claim 13, wherein the wafer substrate is silicon.
Claim 19
Dependent Claim
17 words
The method of claim 13, wherein said cantilever beam material is a thin film of silicon nitride.
Claim 20
Dependent Claim
39 words
The method of claim 13, wherein said cantilever beam material is selected from the group consisting of deposited SiO 2 , Al 2 O 3 , Au, Ni, Si 3 N 4 , and thermally grown SiO 2 .
Claim 21
Independent Claim
210 words
A method of fabricating a micromechanical sensor having a cantilever with a tip at one end, comprising the steps of: providing a wafer substrate having top and bottom sides; coating said top side of said wafer substrate with a first insulating layer and coating said bottom side of said wafer substrate with a second insulating layer; after said coating steps, forming an opening in said first insulating layer; etching a trench in said top side of said wafer substrate through the opening in said first insulating layer; removing said first insulating layer; coating said trench in the top surface of said wafer substrate with a desired tip material and coating the top surface of said wafer substrate with a desired cantilever material; patterning the cantilever and tip materials coated on the top surface of said wafer substrate to form a cantilever arm with one end overlapping said trench in said water substrate; connecting a second substrate to an end of said cantilever arm distal said tip, said second substrate being connected to the surface of said cantilever arm so that said tip projects away from said second substrate; and completely removing said second insulating layer and then completely removing said wafer substrate from the bottom side of said wafer substrate.
Claim 22
Independent Claim
210 words
A method of fabricating a micromechanical sensor having a cantilever with a tip at one end, comprising the steps of: providing a wafer substrate having top and bottom sides; coating said top side of said wafer substrate with a first insulating layer and coating said bottom side of said wafer substrate with a second insulating layer; after said coating steps, forming an opening in said first insulating layer; etching a trench in said top side of said wafer substrate through the opening in said first insulating layer; removing said first insulating layer; coating said trench in the top surface of said wafer substrate with a desired tip material and coating the top surface of said wafer substrate with a desired cantilever material; patterning the cantilever and tip materials coated on the top surface of said wafer substrate to form a cantilever arm with one end overlapping said trench in said water substrate; connecting a second substrate to an end of said cantilever arm distal said tip, said second substrate being connected to the surface of said cantilever arm so that said tip projects away from said second substrate; and completely removing said second insulating layer and then completely removing said wafer substrate from the bottom side of said wafer substrate.
Claim 23
Dependent Claim
48 words
The method of claim 18, wherein said etching step consists of anisotropically etching said wafer substrate through said opening to form a pyramidal pit in the surface of said wafer substrate; and said coating step forms a pyramidal tip projecting into the top surface of said wafer substrate.
Claim 24
Independent Claim
157 words
A method of producing micromechanical sensors for AFM/STM profilometry, which consist of a cantilever beam with at least one tip at its end and a mounting piece at the opposite, comprising the steps of: coating the top and bottom sides of a wafer substrate to form first and second insulating layers, respectively; after said coating step, producing a mask in said first insulating layer on the top side of the wafer substrate; etching a trench in said wafer substrate utilizing said first layer mask; removing said first insulating layer from the top side of said wafer substrate by etching; coating the top surface of said wafer substrate and the trench with a desired cantilever beam material and tip material, respectively; forming said cantilever beam and tip in a photolithographic step and etching step; and completely removing said second insulating layer and then completely removing the supporting wafer material substrate from the bottom side of said wafer substrate.
Claim 25
Independent Claim
157 words
A method of producing micromechanical sensors for AFM/STM profilometry, which consist of a cantilever beam with at least one tip at its end and a mounting piece at the opposite, comprising the steps of: coating the top and bottom sides of a wafer substrate to form first and second insulating layers, respectively; after said coating step, producing a mask in said first insulating layer on the top side of the wafer substrate; etching a trench in said wafer substrate utilizing said first layer mask; removing said first insulating layer from the top side of said wafer substrate by etching; coating the top surface of said wafer substrate and the trench with a desired cantilever beam material and tip material, respectively; forming said cantilever beam and tip in a photolithographic step and etching step; and completely removing said second insulating layer and then completely removing the supporting wafer material substrate from the bottom side of said wafer substrate.
Claim 26
Dependent Claim
28 words
The method of claim 20, wherein said trench etching step consists of etching a pyramidal shaped groove into the wafer substrate by anisotropic wet etching with KOH solution.
Claim 27
Independent Claim
193 words
A method of producing micromechanical sensors for AFM/STM profilometry, which consist of a cantilever beam with at least one tip at its end and a mounting piece at the opposite, comprising the steps of: coating the top and bottom sides of a wafer substrate to form first and second insulating layers, respectively; after said coating step, producing a mask in said first insulating layer on the top side of the wafer substrate; etching a trench in said wafer substrate utilizing said first layer mask; removing said first insulating layer from the top side of said wafer substrate by etching; coating the top surface of said wafer substrate and the trench with a desired cantilever beam material and tip material, respectively; forming said cantilever beam and tip in a photolithographic step and etching step; connecting a second substrate to an end of said cantilever beam distal said tip, said second substrate being connected to the surface of said cantilever beam so that said tip projects away from said second substrate; and completely removing said second insulating layer and then completely removing the supporting wafer material substrate from the bottom side of said wafer substrate.
Claim 28
Independent Claim
193 words
A method of producing micromechanical sensors for AFM/STM profilometry, which consist of a cantilever beam with at least one tip at its end and a mounting piece at the opposite, comprising the steps of: coating the top and bottom sides of a wafer substrate to form first and second insulating layers, respectively; after said coating step, producing a mask in said first insulating layer on the top side of the wafer substrate; etching a trench in said wafer substrate utilizing said first layer mask; removing said first insulating layer from the top side of said wafer substrate by etching; coating the top surface of said wafer substrate and the trench with a desired cantilever beam material and tip material, respectively; forming said cantilever beam and tip in a photolithographic step and etching step; connecting a second substrate to an end of said cantilever beam distal said tip, said second substrate being connected to the surface of said cantilever beam so that said tip projects away from said second substrate; and completely removing said second insulating layer and then completely removing the supporting wafer material substrate from the bottom side of said wafer substrate.
Claim 29
Dependent Claim
45 words
The method of claim 22, wherein said trench etching step consists of etching a pyramidal shaped groove into the wafer substrate by anisotropic wet etching with KOH solution; and said coating step forms a pyramidal tip projecting into the top surface of said wafer substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-20 | 1998-09-19 | 1999-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-20 | 2002-09-19 | 2003-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-20 | 2006-09-19 | 2007-03-21 | $7700.00 | Window Closed / Lapsed |