Module in an integrated delivery system for chemical vapors from liquid sources

Claim 2

An integrated module for the delivery of chemical vapor from a liquid source through an inlet to a processing chamber of a processing unit for semiconductor wafers, said module comprising a metal housing defining a reservoir for holding a liquid from said source; a supply channel connecting said reservoir to a supply inlet for connection to said source; a gas channel connecting said reservoir to an outlet; means for mounting said housing to said processing unit such that said outlet is connected to said processing chamber inlet; means in said housing for heating said reservoir so that liquid in said reservoir is transformed into vapor, said heating means including a heat transfer plate extending into said reservoir to heat said liquid; and means connected to said gas channel for controlling the delivery of said vapor from said reservoir to said processing chamber; whereby said module controllably and precisely supplies vapor at a constant, uniform and repeatable temperature from said liquid supply to said processing chamber.

Claim 3

The module as in claim 1 wherein said heat transfer plate has a portion for heating said vapor.

Claim 4

The module as in claim 2 wherein said housing comprises upper and lower units, said lower unit defining said reservoir, said heating means having a heating element in said upper unit, said heat transfer plate mounted to said upper unit and extending into said reservoir.

Claim 5

The module as in claim 3 wherein said heating element comprises at least one heating rod in said upper housing, said heating rod having a longitudinal axis; and said heat transfer plate has an elongated base mounted to said upper housing unit, said elongated base parallel to said longitudinal axis and in close proximity with said heating rod.

Claim 6

The module as in claim 4 wherein said heating element comprises two heating rods, each heating rod having a longitudinal axis, said heating rods mounted in said upper housing with longitudinal axes parallel to each other; and wherein said heat transfer plate has two opposite edges and a U-shaped cross-section, said opposite edges forming atop portion of said U-shaped cross-section and elongated bases of said heat: transfer plate, each elongated base mounted to said upper housing unit in close proximity with one of said heating rods and parallel to said longitudinal axis of said one heating rod.

Claim 7

The module as in claim 1 further comprising a means for directly sensing temperature of said liquid in said reservoir, said heating means heating said liquid in said reservoir responsive to said temperature sensing means.

Claim 8

The module as in claim 6 further comprising a thermocouple mounted to said lower housing unit in said reservoir, said heating element heating said liquid in said reservoir responsive to said thermocouple.

Claim 9

The module as in claim 1 wherein said liquid comprises a silylation agent.

Claim 10

An integrated module for the delivery of chemical vapor from a liquid source through an inlet to a processing chamber of a processing unit for semiconductor wafers, said module comprising a metal housing defining a reservoir therein for holding a liquid having a silylation agent from said source; a supply channel in said housing connecting said reservoir to a supply inlet for connection to said source; a gas channel in said housing connecting said reservoir to an outlet; means for mounting said housing to said processing unit such that said outlet is connected to said processing chamber inlet; means mounted in said reservoir for directly sensing the temperature of said liquid; heating elements in said housing for heating said reservoir so that liquid in said reservoir is transformed into vapor and for maintaining the temperature of said liquid responsive to said temperature sensing means; a heat transfer plate mounted to said housing proximate said heating elements and extending into said reservoir; and means integrally mounted to said housing and connected to said gas channel for controlling the delivery of said vapor from said reservoir to said processing chamber; whereby said module controllably and precisely supplies vapor at a constant, uniform and repeatable temperature from said liquid supply to said processing chamber.

Claim 11

An integrated module for the delivery of chemical vapor from a liquid source through an inlet to a processing chamber of a processing unit for semiconductor wafers, said module comprising a metal housing defining a reservoir therein for holding a liquid having a silylation agent from said source; a supply channel in said housing connecting said reservoir to a supply inlet for connection to said source; a gas channel in said housing connecting said reservoir to an outlet; means for mounting said housing to said processing unit such that said outlet is connected to said processing chamber inlet; means mounted in said reservoir for directly sensing the temperature of said liquid; heating elements in said housing for heating said reservoir so that liquid in said reservoir is transformed into vapor and for maintaining the temperature of said liquid responsive to said temperature sensing means; a heat transfer plate mounted to said housing proximate said heating elements and extending into said reservoir; and means integrally mounted to said housing and connected to said gas channel for controlling the delivery of said vapor from said reservoir to said processing chamber; whereby said module controllably and precisely supplies vapor at a constant, uniform and repeatable temperature from said liquid supply to said processing chamber.

Claim 12

The module as in claim 9 wherein said housing comprises upper and lower housing units, said reservoir defined by said lower housing unit, said upper housing unit having a lower surface mating with said lower housing unit to seal said reservoir, said heating elements in said upper housing unit, and said heat transfer plate mounted to said lower surface of said upper housing unit and extending into said reservoir.

Claim 13

The module as in claim 10 wherein said heating elements comprise two heating rods fixed in parallel in said upper housing unit, and said heat transfer plate having two opposite edges and a U-shaped cross-section, said opposite edges forming a top portion of said U-shaped cross-section, each opposite edge mounted to said lower surface in close proximity with one of said heating rods and parallel to one heating rod.

Claim 14

The module as in claim 11 wherein said temperature sensing means comprises a thermocouple mounted to said lower housing unit.