Cooling apparatus for electronic and computer components

Claim 1

Apparatus for cooling one or more equipment components or subassemblies, said apparatus comprising one or more first reactors located at a remote location from said equipment, and one or more second reactors located in heat exchange communication with a component or subassembly of said equipment, each of said first reactors containing the same first complex compound therein and each of said second reactors containing the same second complex compound therein, different from said first complex compound, said complex compounds comprising a chemisorption reaction product of a polar refrigerant and a metal halide, nitrate, nitrite, sulfide, oxalate, sulphate or chlorate salt or double metal chloride salt, or mixtures, or eutectic, peritectic or stoichiometric mixtures of said salts, of a metal selected from the group consisting of alkali and alkaline earth metal, transition metal, aluminum, zinc, copper, cadmium and tin, wherein the equilibrium temperature of the first complex compound in said one or more first reactors differs from the equilibrium temperature of the second complex compound in said one or more second reactors by between about 10° C. and about 150° C. at the same operating pressure, heating means for heating a complex compound in said one or more first reactors, and conduit means for directing polar refrigerant between said first and second reactors.